30results about How to "Good technical value" patented technology

Provided is a compound which can form a film by a wet film-formation method and which permits a low heating temperature in forming a film. The film obtained using the compound has high film stability and can be laminated with other layer by a wet film-formation method or the like. The compound is useful as a material for electronic devices, and the electronic devices using same suffer from little lowering in charge transport efficiency or light emission efficiency and have excellent drive stability. Specifically provided are: a compound and a polymer which are characterized by bearing a leaving group having a specific structure; and an organic compound which is characterized by bearing a leaving group exhibiting a low leaving temperature.

The invention discloses an active X-shaped double-row pile foundation pit supporting method. The active X-shaped double-row pile foundation pit supporting method comprises the following steps of (1) driving front-row vertical support piles to the pile bottom designed elevation along the inner side of the edge of a foundation pit, driving inclined rear-row support piles to the pile bottom designedelevation in the pit and meanwhile arranging a water isolation curtain behind the rear-row support piles; (2) arranging a jack on the pile top of each rear-row support pile; (3) arranging crown beamson the front-row vertical support piles and the rear-row support piles, and connecting the crown beams on the front-row vertical support piles and the rear-row support piles into a whole though connecting beams; and (4) excavating a soil body surrounded by the front-row vertical support piles and the rear-row support piles to the pit bottom designed elevation and applying control expansive force to the rear-row support piles through the jacks so as to reduce displacement of the soil body and the pile tops. Through the active X-shaped double-row pile foundation pit supporting method, the displacement of the pile tops can be reduced to a great extent, the bending moment of pile bodies can be reduced, the construction cost can be reduced, the excavation depth can be increased, and the possibility of collapse and damage to the foundation pit can be reduced.

The patent of the present invention proposes an extrapolation method for first arrival waves of seismic data. Firstly, a time window is set around the first arrival wave of the shot set; secondly, the wave fields of the reference trace and the target trace are deconvoluted and superimposed in the shot domain to form a virtual wave field; thirdly, the wave field of the reference trace and the virtual wave field are combined The field is convolved and superimposed in the detector point domain to obtain the super virtual first arrival wave; from the second time, it is judged whether to use cyclic iteration; in addition, the first arrival wave is extrapolated, and the target trace is located between the detector arrays of the target shot set Then, deconvolution stacking and convolution stacking are performed in the shot domain and receiver point domain in turn to obtain the extrapolated super virtual first arrival wave; after that, it is judged whether to use cyclic iteration. The invention can effectively enhance the energy of the first arrival wave, improve the signal-to-noise ratio of the first arrival wave, and at the same time greatly increase the amount of available first arrival wave data through extrapolation of the first arrival wave, provide more abundant information for subsequent seismic data processing, and can be well It is used for seismic data acquired under complex near-surface conditions.