The invention relates to a high-precision, high-reliability, multi-layer, low-resistance thermosensitive
chip, which includes a
ceramic body, a
surface electrode arranged on the top surface of the
ceramic body, a bottom
electrode arranged on the bottom surface of the
ceramic body, and N electrodes arranged inside the ceramic body An
electrode layer, N is an even number greater than or equal to 2; the ceramic body is composed of N+1 ceramic
layers stacked, and an
electrode layer is arranged between every two adjacent ceramic
layers, and one side of the ceramic body is opened There are first holes penetrating through No. 1 to No. N ceramic
layers, and second holes penetrating No. 2 to No. N+1 ceramic layers are opened on the other side, the first holes are filled with first hole electrodes, and the second holes are The second holes are filled with second hole electrodes. The invention also relates to a manufacturing method of the high-precision, high-reliability, multi-layer, low-resistance thermal
chip. The high-precision, high-reliability, multi-layer, low-resistance heat-sensitive
chip of the invention can realize small size,
low resistance value and high B value at the same time.