72results about How to "Hinder its implementation" patented technology

The invention relates to a microstructured technological system and, in particular, micromirror arrangements. The aim of the invention is to produce facade elements for buildings having large areas in square centimetres and above, at reduced cost. The entire micromirror arrangement can be produced as a flat, architectonically useable structural element in a modularly replicable manner. According to the invention, the control electronic system, which contains the logics which are controlled as mirror elements, is arranged in the centre of a control device at a specific, remote distance from which an addressing network is used to control the individual mirror elements or modules. Said addressing network is already integrated into the flat modules during production and to a large degree, in the form of printed lines. As a result, the necessity of incorporating silicon-based chip technology into the facade elements, which is expensive, is no longer necessary. Also, essentially less expensive materials than highly pure silicon are used in the production of the micromirror arrangements. Production costs, which are at least in the same size order as other, traditional, high quality façade elements, result therefrom.

A method of separating a semiconductor substrate having an implementation member attached thereon includes a dividing process for at least the implementation member on the semiconductor substrate along a separation line, a placing process for film member on a same side as the implementation member, a forming process area by irradiating a laser beam from at least one of a first side of the semiconductor substrate having the implementation member and a second side that is an opposite side of the first side of the semiconductor substrate along the separation line with a focusing point of the laser beam aligned with a substance in the semiconductor substrate and severing / removing at least one semiconductor chip at the separation line from the semiconductor substrate.

Device for moulding thermoplastic containers by blow-moulding hot preforms, comprising a mould (1) and blow-moulding means (2) comprising a bell nozzle (8) which is axially displaceable between a raised position and a blow-moulding position in abutment against the mould; the driving means comprising mechanical means (12) with a cam follower roller (13) / cam (14) and pneumatic means (16) with a piston (18) integral with the upper end of the nozzle and sliding in a fixed enclosure (17), defining therein an upper chamber (19) connected to a source (24) of control fluid and a lower chamber (20) connected to this source and to the upper chamber via a solenoid valve (26); the upper face of the piston has a surface area which is greater than that of its lower face and that of the bell (9) of the nozzle.

A hydraulic control apparatus for an automatic transmission includes a first solenoid valve, a second solenoid valve, a third solenoid valve, a preliminary shift speed switch valve, and an oil pressure supply switch valve, which is switched between a normal-state position where the first, second, and third working fluid pressures can be supplied to the hydraulic servos of the first, second, and third friction engagement elements, respectively, and a failure-state position where the first and second preliminary oil pressures can be supplied to the hydraulic servos of the first and second friction engagement elements, respectively, and a line pressure can be supplied to the hydraulic servo of the third friction engagement element, during a failure that causes de-energization.

A monitor is located adjacent to a hand hygiene product dispenser and extends a sensor field adjacent to the hand hygiene product dispenser. The sensor senses activity adjacent to the hand hygiene product dispenser in the sensor field. The monitor determines whether sensed activity indicates a use of the hand hygiene product dispenser and reports a use of the dispenser to a monitoring system when a use is determined.