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30results about How to "Increase unit density" patented technology

High-thermal-conductivity graphene heat dissipation film and preparation method thereof

ActiveCN114314573AWide range of choicesReduce raw material range restrictionsGrapheneGraphene membraneGraphite oxide
The invention relates to the technical field of heat dissipation materials, in particular to a graphene heat dissipation film and a preparation method thereof. The method comprises the following steps: S1, mechanically crushing an artificial graphite film to obtain artificial graphite powder; s2, mixing graphite oxide in a solvent containing ammonia water, uniformly stirring, and carrying out primary stripping to obtain graphene oxide slurry; s3, mixing the artificial graphite powder, the graphene oxide slurry and a stripping aid, uniformly stirring, and performing secondary stripping to obtain mixed slurry; s4, defoaming the mixed slurry, coating the mixed slurry on a base material, drying, and stripping to obtain a graphene film crude product; s5, placing the graphene film crude product in an inert atmosphere, heating to a first temperature, and carrying out carbonization treatment for a certain time; s6, placing a product obtained in the step S5 in an inert atmosphere, heating to a second temperature, and graphitizing to obtain a graphene film; and S7, carrying out lamination calendaring treatment on the graphene film to obtain the graphene heat dissipation film. The heat dissipation performance of the material can be effectively improved, and the cost is reduced.
Owner:XIAMEN KNANO GRAPHENE TECH CORP

Preparation method of semiconductor structure and semiconductor structure

The invention provides a preparation method of a semiconductor structure and the semiconductor structure. The method comprises the following steps: providing a substrate; forming a first capacitor structure on the substrate; forming a first transistor structure on the first capacitor structure, wherein a source electrode or a drain electrode of the first transistor structure is electrically connected with the first capacitor structure; forming a bit line structure on the first transistor structure, wherein the bit line structure is electrically connected with a drain electrode or a source electrode of the first transistor structure; forming a second transistor structure on the bit line structure, wherein a drain electrode or a source electrode of the second transistor structure is electrically connected with the bit line structure; and forming a second capacitor structure on the second transistor structure, wherein the second capacitor structure is electrically connected with the source electrode or the drain electrode of the second transistor structure. The vertical gate-all-around field effect transistor is adopted, the size of the semiconductor structure is reduced, more storage units are obtained in the same unit area, and the unit density of the dynamic random access memory is improved.
Owner:CHANGXIN MEMORY TECH INC

Metal cutting equipment facilitating collecting of metal scraps

The invention discloses metal cutting equipment facilitating collecting of metal scraps. The structure of the equipment comprises a motor, a cutter, a curl collecting structure, a bottom frame, a steering wheel and an equipment body. The bottom frame is arranged at the top end of the equipment body. The cutter is arranged at the topmost end of the bottom frame. The curl collecting structure is installed on the side face of the cutter. The steering wheel is arranged on the bottom frame bottom directly facing the bottom frame. A motor is installed on the other side, corresponding to the steeringwheel, of the cutter. A housing covers the cutter. A curl mingling device is arranged right in the middle in the housing. The curl mingling device directly faces the cutter. According to the metal cutting equipment, the curl mingling device retracts to roll into a metal net ball of a lattice structure, the metal net ball and the housing cooperate with each other, the metal scraps generated by cutting enter the metal net ball in the cutting process, by means of layer-upon-layer design of net bars, the net bars and the metal scraps cut each other, then along with impact force of the metal scraps, the net bars and the metal scraps collide with each other, the impact force is weakened gradually, and the situation that the metal scraps penetrate through the metal ball again and collide with the housing, and noise is generated can be avoided.
Owner:新昌县灵佳机械有限公司
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