The invention discloses a power semiconductor module packaging structure, which is characterized by comprising a substrate, a shell, a power semiconductor module subunit and an auxiliary terminal, wherein the shell is connected with the substrate in a fastened mode; the power semiconductor module subunit is arranged in accommodating space formed by the shell and the substrate and is used for forming a topology control circuit structure, the power semiconductor module subunit comprises a plurality of lining plates arranged on the substrate at intervals, the two oppositely arranged lining platesare connected through a main power terminal and a module-level bonding wire, and the top of the main power terminal extends out of the top of the shell; and the auxiliary terminal is used for introducing a driving signal into the power semiconductor module subunit, a bottom pin of the auxiliary terminal is connected with the lining plate, and the top of the auxiliary terminal extends out of the top of the shell. Thus, the heat dissipation efficiency of the power semiconductor module can be improved, parasitic inductance or resistance parameters are balanced, the process consistency is improved, the loss is low, and the reliability is good.