2results about How to "Small and lightweight" patented technology

This application provides a power semiconductor device, its fabrication method, and its application. The power semiconductor device includes a ceramic substrate, a cladding body, multiple chips, and multiple lead frames. The ceramic substrate includes a ceramic wafer, an inner metal foil, and an outer metal foil. The inner metal foil is disposed on one side of the ceramic wafer, and the outer metal foil is disposed on the opposite side of the ceramic wafer. The cladding body covers the ceramic substrate, exposing the side of the outer metal foil away from the inner metal foil to the external space. The chips are located within the cladding body and disposed on the inner metal foil. The multiple chips are spaced apart from each other. The side of a single chip not in contact with the inner metal foil is electrically connected to the inner metal foil through a lead frame. This application replaces the lead bonding in traditional power semiconductor devices with lead frames, which not only improves the heat dissipation performance of the chips but also reduces thermal resistance, achieving miniaturization and weight reduction of the device, thereby improving the reliability of the power semiconductor device.

This utility model relates to the field of water conservancy construction technology, specifically a wall-brushing device for concrete anti-seepage walls used in grab bucket excavators. It includes a base plate, with two opposing base vertical plates fixed to the lower surface of the base plate. A first reinforcing plate is fixed between each base vertical plate and the base plate. Two outer wire mesh clamps are fixed to the upper surface of the base plate, and two inner wire mesh clamps are detachably installed between the two outer wire mesh clamps. The two outer wire mesh clamps and the two inner wire mesh clamps correspond one-to-one and are all semi-circular. Several wire brushes, evenly spaced along their arc-shaped edges, are clamped between each outer wire mesh clamp and its corresponding inner wire mesh clamp. Several reinforcing ribs are fixed between the tops of the two outer wire mesh clamps along their arc-shaped edges. This invention solves the problems of existing concrete anti-seepage wall joint treatment where wall brushing, slag removal, roughening, and groove milling require two separate sets of equipment for step-by-step operation, resulting in low construction efficiency, high construction costs, and time consumption.