The present application relates to the technical field of
semiconductor manufacturing, in particular to a vacuum negative pressure type flux cleaning device and a cleaning method. One side of the cavity is provided with a
wafer transmission window, the center of the cavity is provided with a rotating mechanism, the lower end of the rotating mechanism is connected with a motor, the upper end of the rotating mechanism is connected with a
wafer carrier, the lower end of the
wafer carrier is provided with a vibrating device, the upper end of the wafer carrier is provided with an
optical fiber sensor and a wafer temperature sensor, the lower end of the cavity is provided with a waste
pipe, one side of the waste
pipe is provided with an electric
conductivity meter and an optical bubble sensor, the upper side of the wafer carrier is provided with a swing arm, the swing arm is provided with a plurality of nozzles, the upper end of the cavity is provided with a vacuum interface, a
nitrogen gas interface, a negative
pressure sensor and a cavity temperature sensor. Compared with the prior art, the defects of the traditional vacuum negative pressure cleaning in the
differential pressure control precision and temperature adaptability are solved; under the premise of ensuring micro-bump zero damage, the flux cleaning efficiency in the
narrow gap advanced packaging structure is improved.