61results about How to "Avoid the knife" patented technology

The invention relates to a matching die cutting and half-and-half rotating pasting processing method for conductive adhesive. The matching die cutting and half-and-half rotating pasting processing method for the conductive adhesive includes the following steps of 1, typesetting and designing; 2, die cutting mode designing; 3, waste scheme designing; 4, product rotating pasting. After die cutting is performed on a single product, the half-and-half rotating pasting technology is adopted. The half-and-half rotating pasting technology comprises the steps that a row of products are pasted in a rotating mode, after material strips are cut, and the other half products are reposted; two strips of box sealing tape with the width of 5 mm are needed in product rotating pasting, a single PCS product is firstly fixed, dislocation or amount missing are prevented, then face paper on the conducting adhesive is removed, the original two rows of side-by-side products which are designed through the up-down and front-back rope winding are changed into products by rotating pasting in sequence and material strap cutting in sequence, therefore, the typesetting of a client is restored, and products the customer needed are manufactured. The matching die cutting and half-and-half rotating pasting processing method for the conductive adhesive improves the use efficiency of conducting resin materials, the waste materials in the manufacturing process are eliminated, the blade collapse is prevented, the normal production is guaranteed, and the production efficiency is improved; the conducting resin product rotating pasting is achieved, and the product typesetting is restored.