40results about How to "Delayed failure time" patented technology

The invention relates to a battery module capable of delaying heat diffusion and a battery pack. The battery module comprises multiple groups of stacked battery cells, a module upper cover and a fireproof heat insulation pad, wherein the fireproof heat insulation pad is arranged between top sealing edges of the multiple groups of battery cells and the module upper cover, multiple heat diffusion openings are formed in the fireproof heat insulation pad, and the heat diffusion opening is connected with a door-shaped structure for opening or closing the heat diffusion opening; multiple heat diffusion holes are formed in the module upper cover, and the multiple heat diffusion holes and the multiple heat diffusion openings are arranged in a one-to-one correspondence manner; and a closed heat diffusion channel is formed between each group of battery cells and the fireproof heat insulation pad through the sealing structure, and the heat diffusion channel at least corresponds to one heat diffusion opening. When a single battery cell is subjected to thermal runaway, the edge sealing position where thermal runaway eruption is not expected to occur is pressed by the fireproof heat insulation pad to prevent the non-target eruption position from being broken and erupted and prevent high-temperature gas or flame from rushing the door-shaped structure to erupt, so that the influence on other groups of battery cells can be reduced, the thermal runaway of other groups of battery cells is delayed, and even other battery cells are not triggered to generate thermal runaway.

The invention provides a paddy field chemical fertilizer burying device. The paddy field chemical fertilizer burying device comprises a paddy field power walking part, a fertilizer discharging part and a slurry stirring part, wherein the slurry stirring part comprises a slurry stirring wheel which rotates in a paddy field in a driving or driven manner so that slurry in a field walking track is stirred; the fertilizer discharging part comprises a fertilizer box for storing fertilizers, and a fertilizer discharging mechanism mounted at the bottom of a box body; the fertilizer discharging mechanism is used for discharging the fertilizers from the fertilizer box into the field along a fertilizer applying pipe; the slurry stirring wheel is located behind an outlet of the fertilizer applying pipe; and the stirring part and the fertilizer discharging part are connected with the power walking part into a whole body by a rack. According to the paddy field chemical fertilizer burying device, after a fertilizer is applied into the paddy field, the slurry in the paddy field is stirred by the stirring wheel and then is mixed with the applied fertilizers, so that the fertilizers are fused into mud and the aim that the effect by using the device is same with the deep application effect is realized.

The invention discloses an anti-flash circuit assembly and an image sensor. Wherein the anti-flash circuit assembly further comprises a plurality of flash detection units, each flash detection unit comprises a first photoelectric detection module, a first triggering generation module and a first port logic module, and the first photoelectric detection module is suitable for monitoring light signals irradiated on the first photoelectric detection modules in real time and outputting corresponding electric signals; the first input end of the first trigger generation module is coupled to the first photoelectric detection module, the first output end of the first trigger generation module is coupled to the first interface logic module, and the first trigger generation module is suitable for generating a first trigger generation signal to the first interface logic module when the electric signal exceeds a set threshold value; the first input end of the first interface logic module is coupled to the first trigger generation module; wherein a second input end of the first interface logic module is coupled with the flash detection control unit through a flash detection refresh signal line,a first output end of the first interface logic module is coupled with the flash detection control unit through a flash detection trigger signal line, and the first interface logic module is suitablefor outputting a trigger state signal when receiving a first trigger generation signal.

The invention proposes a manufacturing method for reducing hot carrier injection damage of a semiconductor device, comprising the following steps: forming an n well and a p well in a semiconductor substrate, growing a gate oxide layer above the substrate, and forming a gate oxide layer on the gate oxide layer. Polysilicon gate; after covering the photoresist layer above the n-well region, perform source-drain implantation of lightly doped drain region structure in the p-well region; ash the photoresist layer with a combination gas containing carbon tetrafluoride and source-drain in the p-well region Silicon-fluorine bonds are formed at the end interface; after covering the photoresist layer above the p-well region, the lightly doped drain region structure source-drain implantation is performed on the n-well region; the photoresist layer is ashed with a combination gas containing carbon tetrafluoride and A silicon-fluorine bond is formed at the source-drain interface of the n-well region; gate sidewalls are fabricated and source-drain implants are performed to form source and drain electrodes. The invention provides a manufacturing method of a MOS device capable of reducing the hot carrier injection damage of the semiconductor device, which can not only prevent the hot carrier injection damage of the MOS device, but also suppress the boron punch-through phenomenon.

The invention discloses a semiconductor wafer and a semiconductor sealing structure. The semiconductor wafer comprises a plurality of chips, an insulating layer, a plurality of protrusion block lower metal layers and a plurality of conduction protrusions. Each chip is provided with an active surface and a plurality of connecting pads formed on the active surface. The insulating layer is formed on the active surfaces of chips and provided with a plurality of opening structures exposing the connecting pads in a corresponding mode. Each opening structure comprises a central opening and at least two extending opening grooves. The hole diameter of each central opening is smaller than the diameter of each connecting pad. Each extending opening groove extends outwards from an edge of each central opening in a radiating mode and keeps a certain distance with the edge of the connecting pad. The plurality of protrusion block lower metal layers are respectively formed on the opening structures and electrically connected with the connecting pads. The plurality of conduction protrusions are respectively formed on the protrusion block lower metal layers. The opening structures of the insulation layer is favorable for enhancing stress buffering effect and increasing combined area of the protrusion block lower metal layers and the connecting pads.

The invention discloses a slow-release stress-resistant probiotic crystal ball and a preparation method thereof. The slow-release stress-resistant probiotic crystal ball comprises a probiotic inner core layer, a slow-release layer, a stress-resistant layer and a protective layer which are sequentially arranged from inside to outside, wherein the probiotic inner core layer is of a spherical structure, and the surface of the probiotic inner core layer is sequentially coated with the slow-release layer, the stress-resistant layer and the protective layer. The probiotic inner core layer is wrapped with the material of the slow-release layer, the material of the stress-resistant layer and the material of the protective layer in sequence through a pot coating method to obtain the slow-release stress-resistant probiotic crystal ball. The probiotic crystal ball membrane material with better stress resistance is prepared, and the stress-resistant membrane can better protect the probiotics in the membrane, so that the probiotics are prevented from being damaged and inactivated by gastric acid, cholate, pancreatic juice and the like in the digestive tract during use, and an ideal effect is exerted.

A command communication network integration system based on an IP comprises network managing device and a managed device. The network managing device is composed of two network control devices, and redundant backup protection is performed between the main network control device and the auxiliary network control device. The managed device comprises a network switching/routing device, a network security device, a wired integration communication device, an IP voice processing device, a command terminal device, a satellite communication navigation device, a microwave radio station device and an ultra-short wave radio station device. Information interaction is performed between the network managing device and the managed device through an IP network to complete device managing and maintain work.

The invention discloses a refractory glass thermal-insulation frame positioning structure. The refractory glass thermal-insulation frame positioning structure comprises a sectional material spliced frame used for positioning the edge of refractory glass, wherein a cavity for containing the edge of the refractory glass is formed in the sectional material spliced frame, and fireproof flame-retardant rubber strips attached to the refractory glass are fixed to the parts, on the two sides of the cavity, of the sectional material spliced frame; a refractory glass edge protecting frame is fixed to the part, at the bottom of the cavity, of the sectional material spliced frame and provided with a positioning clamping groove for clamping the edge of the refractory glass. The refractory glass thermal-insulation frame positioning structure is characterized in that a thermal-expansion graphite band is attached to the sectional material spliced frame, and the cavity is filled with the thermal-expansion graphite band after thermal expansion. The thermal-expansion graphite band is attached to the sectional material spliced frame, the cavity for positioning the refractory glass is filled with the graphite band after thermal expansion, the graphite band is expanded to reinforce the refractory glass and obstruct heat transfer, the fireproof flame-retardant rubber strips are protected, and the refractory glass thermal-insulation frame positioning structure is prevented from separating from the refractory glass; in this way, the positioning stability of the refractory glass is greatly improved through the whole structure, and then the flame-retardant and thermal-insulation performance of the refractory glass is further improved.

The invention discloses a power station boiler water-cooled wall temperature online prediction method based on a gating neural network, and belongs to the field of power station boiler equipment water-cooled wall pipeline temperature measurement. According to the method, the problem that long-term real-time accurate prediction of the temperature of the water wall tube is difficult to realize by utilizing the existing updating model is solved. The method comprises the steps that the water wall pipeline temperature and temperature related variables are collected; preprocessing the water wall pipeline temperature and the temperature related variables to obtain preprocessed data, and taking the preprocessed data as a historical training data set; establishing a gating neural network model, and performing offline training on the gating neural network model by using historical training data; performing model parameter online updating on the offline trained gating neural network model to obtain a gating neural network model of which the parameters are updated online; and inputting the water-cooled wall pipeline temperature related variables collected in real time into the online updated gating neural network model, and outputting to obtain the predicted water-cooled wall pipeline temperature. The method is used for predicting the temperature of the boiler water wall pipeline.

The invention provides an application method of an alkali electroless nickel/cobalt-plating solution. By using sodium hydroxide and/or potassium hydroxide as one additive for holding the pH value of an electroless plating solution, concentration of NH4<+> in the solution is not greater than 40g/L. The method can greatly slow down failure time of the alkali electroless plating solution, improve the metal utilization ratio in the electroless plating solution, lower the production cost and reduce the sewage treatment quantity; further, the method can be carried out simply and the production can be implemented practically and easily.