The invention discloses a circuit-board
internal layer making technology. The technology comprises the following steps of S1,
cutting a plate: setting a plate corner to be a round corner, cleaning
cutting plate dust, removing a glue mark on the plate, and removing
moisture absorbed by a sheet during storage through
glazing; S2, carrying out pre-
processing; S3, carrying out
internal layer image transferring: firstly, uniformly attaching photosensitive ink to a
copper surface and carrying out
coating processing, then, using
ultraviolet light energy to harden a selective local bridge frame, and then, using
sodium carbonate to dissolve and wash the ink which is not exposed, leaving a photosensitive portion, carrying out
etching to etch away the
copper surface of an unexposed exposed-
copper portion, and finally, removing a film protecting a line copper surface by
sodium oxide with a higher concentration; S4, carrying out optical inspection; S5, carrying out brown
processing: cleaning the copper surface through acid
pickling, removing the oily substance of the copper surface, providing adaptive preprocessing for mitigating a strengthening
drug before
browning through preimpregnation, and finally,
drying a copper plate surface; S6, typesetting; and S7, pressing the plate.