78results about How to "Improve wiring quality" patented technology

The invention relates to an electromigration analysis method and a system for analyzing one or more nets in a digital integrated circuit design that are at risk of electromigration. The method comprises the steps of providing at least one interconnect between a driver cell and at least one load cell; applying same extracted netlist data for noise and/or timing analysis and for electromigration analysis; modeling the driver cell by a train of trapezoidal voltage pulses transmitted from the driver cell to the one or more load cells through the at least one interconnect; extracting at least a slew rate of a driver voltage signal (U_D) and/or timing information from a noise and/or timing analysis for the one or more nets; and comparing a locally measured current density (i_f,rms,R32) in the at least one interconnect to an effective local maximum current density limit (i_rms,max) of the at least one interconnect.

The invention discloses a wiring method and device. The wiring method comprises the steps that start edge position information and end edge position information of a wiring area are acquired, wherein the start edge position information comprises start edge information, start terminal information as well as start terminal and start edge contact information, the end edge position information comprises end edge information, end terminal information as well as end terminal and end edge contact information, and one or more start terminals and end terminals are provided; a wiring graph is generated in the wiring area according to a cutting line and a wiring interval; the wiring graph is used for indicating wiring between the start terminal and the end terminal; the cutting line comprises a start edge and an end edge. According to the wiring method and device, the problem in a wiring method of a correlation technique is solved, and a new wiring method is provided, so that the wiring quality is improved.

The invention discloses a semiconductor wafer electrode structure and a manufacturing method thereof. According to the semiconductor wafer electrode structure, the centre area of the surface of an electrode is even and the periphery area of the surface of the electrode is rough; the attaching viscosity needed by wire bonding and ball junction ends is provided by the centre area; and the periphery area is used for preventing oscillation energy during wire bonding from being transversely transferred to the outer side of an electrode such that the ball junction ends joined with the electrode can accord with the wire bonding technical standard. The manufacturing method comprises the steps of: defining the centre area of the electrode on the surface layer of the semiconductor wafer by the mask lithography; roughening the area of the surface layer of the semiconductor chip beyond a photomask; and evaporating the electrode metal onto the flat and rough surfaces of the surface layer of the semiconductor wafer, and therefore the electrode structure with even surface centre area and rough periphery area is formed on the surface layer of the semiconductor wafer. The semiconductor wafer electric structure disclosed by the invention has the effect of enhancing the spherical wire bonding quality.

This invention discloses ultrasonic welding wire method and its device, which comprises welding probe system, positioning and testing cameral optics system, movable workbench, rotation bench in level direction and the clamper for welding parts fixed on the rotation bench. The method orderly comprises the following steps: setting initial positions, welding wire points; moving the initial points of welding mouth or moving the end points of welding mouth and wires; welding the wire end terminals.

The invention discloses an intelligent building comprehensive wiring system and a cable bridge thereof. The cable bridge comprises two U-shaped rails, a plurality of layers of binding wire bridge plates, an upper cover and a bottom cover, wherein the height of the binding wire bridge plates increases in sequence; the two U-shaped rails are arranged in parallel to each other; each layer of binding wire bridge plate comprises at least two bridge plates of the same structure; the two ends of the bridge plates are fixedly arranged in U-shaped grooves of the two rails respectively; the upper cover and the bottom cover are U-shaped respectively; the open ends of the upper cover and the bottom cover are arranged opposite to each other vertically; two free ends of the upper cover are fixedly inserted into the U-shaped grooves of the two rails respectively; two free ends of the bottom cover are inserted between the two rails; and the binding wire bridge plates are packaged by the upper cover and the bottom cover. According to the intelligent building comprehensive wiring system and the cable bridge thereof, modularized members are adopted, the manufacturing is realized by using a factory mould, convenience in mounting is realized on a construction site according to a program, and convenience in laying of a cable, classified arrangement, layered binding and ordered management are assisted.

The invention relates to a pre-wiring template. According to the pre-wiring template, a four-connecting-shaft support is designed, and a panel of the template can freely erected or horizontally placed; the panel of the template is composed of two transparent glass steel plates, a plastic spraying drawing of the template can be clamped between the two transparent glass steel plates, it is ensured that the plastic spraying drawing is not abraded, even small holes are distributed in the glass steel plates, and therefore accessories can be conveniently mounted on the template. Three kinds of wiring accessories are selected, the wiring quality is improved, the pre-wiring working procedure is more flexible and convenient, the working efficiency is improved, waste is reduced, and the production cost is reduced.

The invention discloses a power distribution cabinet based on a cable fixing and adjusting structure, which mainly solves the problem in the prior art that a cable cannot be stably connected with a connection part inside a power distribution cabinet during the cable wiring operation. The power distribution cabinet comprises a power distribution cabinet body and an anti-pulling piece. The anti-pulling piece comprises a baffle plate fixed on the power distribution cabinet body and provided with a first cable through hole, a fixing part provided with a second cable through hole, a spring with the two ends thereof respectively connected with the baffle plate and the fixing part, and a cable fixing and adjusting structure arranged above the second cable through hole. The cable fixing and adjusting structure is of a conical structure. The diameter of the cable fixing and adjusting structure is gradually reduced along the central axis towards the direction of the fixing part. The central connecting line between the first cable through hole and the second cable through hole is on the same straight line with the central axis of the spring. The power distribution cabinet is stable in connection effect and the influence of the cable wiring operation on the connection part thereof is effectively avoided.

The invention discloses a method for acquiring a laying path of signal lines, which is applied to wiring software of a printed circuit board which is provided with a first signal line and a second signal line. The method comprises: forming a reference point on the first signal line and the second signal line respectively, and acquiring a central point on a reference line formed on the first signal line and the second signal line; splitting the first signal line and the second signal line into a plurality of line segment groups after judging that the distance from the central point to the reference point of the first signal line or the second signal line is not less than the preset safe spacing, and selecting two central points corresponding to a clamped area of the two signal lines for each line segment group; using a straight line to connect the central points of various line segment groups, extending the straight line at least to a straight line joint of adjacent line segment groups, and forming a turning point on the joint; and finally using a straight line to connect all the central points and the turning point, and forming the laying path for laying the signal lines to be laid between the first signal line and the second signal line, so as to overcome the prior defects.

The invention relates to a method and a system for routing electric circuits in integrated circuit chip design. Specifically, the invention encompasses the steps of performing a congestion analysis (208) for a given routed placement of cells (11) containing said electric circuits on chip (10); defining (210) a critical area (14) on said chip (10) based on congestion information (208); analyzing (212) actual wiring quality within said critical area (14); comparing (214, 216) actual wiring quality of said critical area (14) with a reference wiring quality of said critical area (14); and rerouting (218) said critical area (14) based on a comparison (216) between actual wiring quality and reference wiring quality.

The invention discloses a wire drawing device for production of welding wires. The wire drawing device for production of the welding wires comprises a base, wherein the top of the base is connected with an external box body through bolts; an inner box body is embedded in the outer box body through bolts; two rotating shafts are separately connected between the inner walls of the two sides of the inner box body through mechanical sealing pieces; the side, which is positioned in the inner box body, of each of the two rotating shafts is connected with a wire drawing roller in a sleeving manner through a bolt; threaded grooves which are distributed spirally are separately arranged on the peripheral outer walls of the two wire drawing rollers; the middles of the inner walls of the two sides ofthe inner box body are connected with the same mounting rack through bolts. The wire drawing device for production of the welding wires is simple and convenient to use, the load of a single wire drawing mold is reduced, the service time of the device is prolonged, welding wire raw materials are embedded in the threaded grooves and rotate, the welding wire raw materials can be limited, the circumstance that the welding wire raw materials slide on the surfaces of the wire drawing rollers is avoided, the stability of wire drawing of the wire drawing rollers is improved, and the quality of weldingwire drawing is further ensured.

The invention discloses a printed circuit board (PCB) combination pad. A first kind of PCB combination pad comprises a pad and further comprises an electric connection part and a through hole. The electric connection part is respectively connected with the pad and the through hole, and the electric connection part, the pad and the through hole constitute a conductive integral body. A second kind of PCB combination pad comprises a PCB substrate. The PCB substrate is provided with a through hole. In a packaging design, another pad and the PCB pad are connected by use of an electric connection part to form a conductive integral body. A third kind of PCB combination pad comprises a pad and further comprises an electric connection part. The idle end of the electric connection part is taken as the position indication of a through hole during wiring to unify a wiring mode. By using the PCB combination pad provided by the invention, the functions of partial wiring connection or complete wiring connection can be finished on the pad, the defect of wiring quality control difficulty caused by the randomness of a lead wire and the through hole during manual wiring is avoided, and the PCB design efficiency and PCB wiring quality are improved.

The invention applies to the field of electrical devices and provides a wiring structure and a switch socket. The wiring structure comprises: a wiring terminal arranged inside a housing provided withwiring holes; an elastic part arranged on the wiring terminal; and an outgoing terminal crimped to the wiring terminal, wherein the outgoing terminal is provided with a wiring guide aligned with the wiring holes, and wires are inserted from the wiring holes along the wiring guide and are clamped between the wiring terminal and the elastic part. The wiring structure provided herein has the wiring guide on the outgoing terminal; wires are inserted between the wiring terminal and the elastic part along the wiring guide, the wires are rarely deviated from the wiring direction, the problem that thewires are deviated or inclined when inserted to the wiring terminal is avoided, and wiring quality is improved. The switch socket employs the above wiring structure; the performance of the switch socket can be effectively improved.

The invention provides a cable interference detection method based on geometrical characteristics. The method is characterized by comprising a cable and cable interference detection method and a cable and structure element interference detection method, wherein during the cable and cable interference detection, firstly, a wire distribution assembly body is traversed, then, a wire harness part in the assembly body is obtained, next, cables in the wire harness part are searched, cable relevant data is obtained, the distance between two cable center lines is calculated, and the smallest distance value is used as the judging basis. During the cable and structure element interference detection, the wire distribution assembly body is firstly traversed, the space position data and the profile data of a structure element are obtained, the cable center lines are subjected to discrete representation in a space coordinate point form, and then, the smallest distance between the structure element and the cable discrete coordinate is judged. The cable interference detection method has the advantages that the computer aided three-dimensional wire distribution accuracy and the engineering practicability can be greatly improved, and the reliability and the stability of cable wire distribution are improved.

The invention discloses a rare earth magnesium alloy welding wire. The rare earth magnesium alloy welding wire is characterized by comprising 2.00-7.00 wt% of Gd, 0.02-2.00 wt% of Y, 0.30-0.80 wt% of Zr, 0.20-0.50 wt% of Sn, 0.02-0.18 wt% of Ag, 0.02-0.18 wt% of Er and the balance magnesium and inevitable impurities. According to the rare earth magnesium alloy welding wire, an Mg-Gd-Y-Zr alloy system capable of being strengthened through heat treatment is selected, and microalloy elements the Gd, the Y, the Zr, the Ag and the Sn are cooperatively added, so that the melt quality is improved, the welding wire quality is improved, and the defects of pore oxide inclusion and the like in a welding joint are reduced; the starting difficulty of a conical surface slippage system is reduced, the plastic deformation capacity of an alloy material is greatly improved by starting a potential slippage system, the extrusion deformation process of a welding wire is coordinated, and the welding wire quality is improved; and low-scale second-phase particles serve as heterogeneous nucleation factors, so that grains are refined, the alloy grain size is controlled, and the extrusion deformation capacity of the material is improved.

The invention discloses a packaging method of a QFN fingerprint identification chip, belonging to the technical field of semiconductor chip packaging. The process comprises the following steps: mounting a loading film on the back of a lead frame; adhering the chip to the lead frame; curing silver paste; performing plasma cleaning; performing wire bonding; performing plastic packaging; removing theloading film; performing post curing; removing residual glue; baking; thinning a plastic cover and pasting a reinforcing film; cutting off a connecting rib to carry out a strip test; printing a marking; removing the reinforcing film; and cutting for molding. The invention provides a packaging method capable of improving the yield of QFN fingerprint identification chip packaging.

The invention discloses a formulation of high-manganese cupronickel brazing filler metal and a production process of the high-manganese cupronickel brazing filler metal. According to the formulation of the high-manganese cupronickel brazing filler metal, the high-manganese cupronickel brazing filler metal is prepared from the components in percentage: 8.5-10.5% of Ni, 36.5-38.5% of Mn and the balance of Cu. The production process of the high-manganese cupronickel brazing filler metal comprises the steps of batching, vacuum melting, forging, rolling, drawing and annealing, scaling and finishedproduct drawing, finished product annealing, inspection and packaging and storage. The requirements of electronic valve welding can be met, and the fluidity and the wettability during welding and thecorrosion resistance and the welding strength after welding can be met; and the electronic valve cost is greatly reduced. The production process of the high-manganese cupronickel brazing filler metalhas simple and convenient operation steps, perfect steps and high quality of produced welding wires.

A screening nest, method of screening green sheets and cleaning the mask and a mask cleaning station. The screening nest includes an electromagnet that clamps the mask to a green sheet on the nest during screening. The mask may be electromagnetically dampened during application and removal. The cleaning station electromagnetically dampens the mask during cleaning and especially during rinsing and drying.

The invention provides bonding equipment and a bonding head structure thereof, wherein the bonding head structure comprises a voice coil motor, a bonding head body, a transducer and a chopper. One end of the bonding head body is mechanically connected with the voice coil motor, the transducer is installed at the other end of the bonding head body, and the chopper is installed at the front end of the transducer. The voice coil motor comprises a rotor and two stators connected with the rotor; and the rotor is mechanically connected with the bonding head body, and the rotor is clamped between the two stators. The rotor is provided with a coil, a magnet with a trapezoidal cross section is arranged in each stator, the two magnets are arranged close to the coil, and the coil is clamped in the middle. According to the bonding equipment and the bonding head structure thereof, the force constant stability in a bonding area is improved, and the pressure output in an important working interval is stable, so that the stability of the chopper at different heights during working is improved, and the bonding quality is improved.