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75results about How to "Small region" patented technology

Modulated metal removal using localized wet etching

An apparatus for wet etching metal from a semiconductor wafer comprises a wafer holder for rotating a wafer and a plurality of nozzles for applying separate flow patterns of etching liquid to the surface of the wafer. The flow patterns impact the wafer in distinct band-like impact zones. The flow pattern of etching liquid from at least one nozzle is modulated during a total etching time control the cumulative etching rate in one local etch region relative to the cumulative etching rate in one or more other local etch regions. Some embodiments include a lower etch chamber and an upper rinse chamber separated by a horizontal splash shield. Some embodiments include a retractable vertical splash shield used to prevent splashing of etching liquid onto the inside walls of a treatment container. An etch-liquid delivery system includes a plurality of nozzle flow paths having corresponding nozzle flow resistances, and a plurality of drain flow paths having corresponding drain flow resistances. Nozzle flow resistances and drain flow resistances are matched so that switching the flow from a nozzle to a corresponding drain flow path does not change the flow rate of etching liquid through other nozzles. A non-wafer-contacting measuring device measures a metal thickness on a rotating semiconductor wafer during metal wet etching by immersing a plurality of electrodes in etching liquid in close proximity to the wafer surface of the rotating wafer and determining electrical resistance between a plurality of electrodes.
Owner:NOVELLUS SYSTEMS

Method of Continuously Synthesizing Oriented Carbon Nanotubes and Apparatus for Continuously Synthesizing Same

A method and apparatus for continuously synthesizing oriented carbon nanotubes, with which oriented carbon nanotubes can be stably synthesized in large quantities, is presented.The method and apparatus for continuously synthesizing oriented carbon nanotubes comprise: a coating and drying step in which a catalyst liquid is applied and dried to form a catalyst layer on a substrate surface; a catalyst substrate formation step in which the catalyst layer is heated to form a catalyst substrate having a catalyst particle layer on the substrate surface; a synthesis step in which a raw material gas heated to a temperature equal to or higher than a synthesis temperature for the oriented carbon nanotubes is brought into contact with the surface of the catalyst substrate to synthesize oriented carbon nanotubes; and a collection step in which the oriented carbon nanotubes are collected. In the synthesis step, a carrier gas having a temperature equal to or higher than the synthesis temperature is supplied to the periphery of the raw material gas which is in contact with the surface of the catalytic substrate, or to its front and rear stages. Thus, oriented carbon nanotubes are continuously or intermittently synthesized.
Owner:NIPPON SANSO CORP +1

Light-emitting device for sealing light-emitting elements and electronic apparatus

A light-emitting device includes: a substrate; a plurality of light-emitting elements which is formed on the substrate and each of which has an anode partitioned by an insulating pixel partition wall, a cathode, and an organic light-emitting layer interposed therebetween and emits light by an electric field generated by the anode and the cathode; a first organic buffer layer that is formed by applying an organic compound and hardening the organic compound and covers a region larger than the region in which the plurality of light-emitting elements are formed; a second organic buffer layer that is that is formed by applying an organic compound and hardening the organic compound and is arranged above the substrate with the first organic buffer layer interposed therebetween so as to cover the plurality of light-emitting elements; and a gas barrier layer that is formed of an inorganic compound, covers a region larger than the region in which the first and second organic buffer layers are formed, and protects the plurality of light-emitting elements from air. In the light-emitting device, a region of the substrate overlapping the first organic buffer layer is not completely matched with a region of the substrate overlapping the second organic buffer layer.
Owner:SEIKO EPSON CORP

Modulated metal removal using localized wet etching

An apparatus for wet etching metal from a semiconductor wafer comprises a wafer holder for rotating a wafer and a plurality of nozzles for applying separate flow patterns of etching liquid to the surface of the wafer. The flow patterns impact the wafer in distinct band-like impact zones. The flow pattern of etching liquid from at least one nozzle is modulated during a total etching time control the cumulative etching rate in one local etch region relative to the cumulative etching rate in one or more other local etch regions. Some embodiments include a lower etch chamber and an upper rinse chamber separated by a horizontal splash shield. Some embodiments include a retractable vertical splash shield used to prevent splashing of etching liquid onto the inside walls of a treatment container. An etch-liquid delivery system includes a plurality of nozzle flow paths having corresponding nozzle flow resistances, and a plurality of drain flow paths having corresponding drain flow resistances. Nozzle flow resistances and drain flow resistances are matched so that switching the flow from a nozzle to a corresponding drain flow path does not change the flow rate of etching liquid through other nozzles. A non-wafer-contacting measuring device measures a metal thickness on a rotating semiconductor wafer during metal wet etching by immersing a plurality of electrodes in etching liquid in close proximity to the wafer surface of the rotating wafer and determining electrical resistance between a plurality of electrodes.
Owner:NOVELLUS SYSTEMS
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