This invention belongs to the field of
semiconductor molding compound
strength testing technology, specifically a
strength testing device for
semiconductor molding compounds. It includes a C-shaped frame, a first sleeve fixedly connected to the C-shaped frame, a holding plate slidably connected to the first sleeve, a
drive motor fixedly connected to the C-shaped frame, an
impact member slidably connected to the C-shaped frame, a
threaded rod fixedly connected to the output shaft of the
drive motor, a movable plate threadedly connected to the
threaded rod, a support rod fixedly connected to the lower side of the holding plate, a splined rod with a first floating plug fixedly connected to the splined rod, and a second floating plug slidably connected to the first sleeve. This invention automatically adjusts the height of the holding plate by changing the flow state of the liquid in the first sleeve and the position of the lower pressure plate, ensuring that the distance between the upper surface of molding compounds of different thicknesses and the lower surface of the
impact member is consistent. This allows the
impact member to apply a consistent impact force to molding compounds of different thicknesses, improving testing efficiency.