Provided is a method for manufacturing an SOI
wafer, which is capable of: efficiently removing an
ion-implanted defect layer existing in an
ion implanted layer in the vicinity of a peeled surface peeled by an
ion implantation peeling method; ensuring the in-plane uniformity of a substrate; and also achieving cost reduction and higher
throughput. The method for manufacturing an SOI
wafer includes at least the steps of: bonding a
silicon wafer with or without an
oxide film onto a
handle wafer to prepare a bonded substrate, wherein the
silicon wafer has an ion implanted layer formed by implanting
hydrogen ions and / or
rare gas ions into the
silicon wafer; peeling the silicon wafer along the ion implanted layer, thereby transferring the silicon wafer onto the
handle wafer to produce a post-peeling SOI wafer; immersing the post-peeling SOI wafer in an aqueous
ammonia-
hydrogen peroxide solution; and performing a heat treatment at a temperature of 900° C. or higher on the immersed post-peeling SOI wafer, and / or
polishing a silicon film layer of the immersed post-peeling SOI wafer, through CMP
polishing by 10 to 50 nm.