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253results about How to "Wide bandgap" patented technology

Semiconductor integrated circuit

To reduce power consumption of a semiconductor integrated circuit and to reduce delay of the operation in the semiconductor integrated circuit, a plurality of sequential circuits included in a storage circuit each include a transistor whose channel formation region is formed with an oxide semiconductor, and a capacitor whose one electrode is electrically connected to a node that is brought into a floating state when the transistor is turned off. By using an oxide semiconductor for the channel formation region of the transistor, the transistor with an extremely low off-state current (leakage current) can be realized. Thus, by turning off the transistor in a period during which power supply voltage is not supplied to the storage circuit, the potential in that period of the node to which one electrode of the capacitor is electrically connected can be kept constant or almost constant. Consequently, the above objects can be achieved.
Owner:SEMICON ENERGY LAB CO LTD

Enhancement-Mode III-N Devices, Circuits, and Methods

A method of fabricating AlGaN / GaN enhancement-mode heterostructure field-effect transistors (HFET) using fluorine-based plasma immersion or ion implantation. The method includes: 1) generating gate patterns; 2) exposing the AlGaN / GaN heterostructure in the gate region to fluorine-based plasma treatment with photoresist as the treatment mask in a self-aligned manner; 3) depositing the gate metal to the plasma treated AlGaN / GaN heterostructure surface; 4) lifting off the metal except the gate electrode; and 5) high temperature post-gate annealing of the sample. This method can be used to shift the threshold voltage of a HFET toward a more positive value, and ultimately convert a depletion-mode HFET to an enhancement-mode HFET (E-HFET).
Owner:THE HONG KONG UNIV OF SCI & TECH

Semiconductor integrated device

To reduce power consumption of a semiconductor integrated circuit and to reduce delay of the operation in the semiconductor integrated circuit, a plurality of sequential circuits included in a storage circuit each include a transistor whose channel formation region is formed with an oxide semiconductor, and a capacitor whose one electrode is electrically connected to a node that is brought into a floating state when the transistor is turned off. By using an oxide semiconductor for the channel formation region of the transistor, the transistor with an extremely low off-state current (leakage current) can be realized. Thus, by turning off the transistor in a period during which power supply voltage is not supplied to the storage circuit, the potential in that period of the node to which one electrode of the capacitor is electrically connected can be kept constant or almost constant. Consequently, the above objects can be achieved.
Owner:SEMICON ENERGY LAB CO LTD

Aromatic amine compound, and light-emitting element, light-emitting device, and electronic appliance using the aromatic amine compound

An object of the present invention is to provide a novel aromatic amine compound, and a light-emitting element, a light-emitting device, and an electronic appliance with high luminous efficiency. An aromatic amine compound expressed by General Formula (1) and a light-emitting element, a light-emitting device, and an electronic appliance formed using the aromatic amine compound expressed by General Formula (1) are provided. By the use of the aromatic amine compound expressed by General Formula (1), the light-emitting element, the light-emitting device, and the electronic appliance can have high luminous efficiency.
Owner:SEMICON ENERGY LAB CO LTD

Monolithic Integration of Enhancement- and Depletion-mode AlGaN/GaN HFETs

A method for and devices utilizing monolithic integration of enhancement-mode and depletion-mode AlGaN / GaN heterojunction field-effect transistors (HFETs) is disclosed. Source and drain ohmic contacts of HFETs are first defined. Gate electrodes of the depletion-mode HFETs are then defined. Gate electrodes of the enhancement-mode HFETs are then defined using fluoride-based plasma treatment and high temperature post-gate annealing of the sample. Device isolation is achieved by either mesa etching or fluoride-based plasma treatment. This method provides a complete planar process for GaN-based integrated circuits favored in high-density and high-speed applications.
Owner:THE HONG KONG UNIV OF SCI & TECH

Lithium-enriched anti-perovskite sulfides, solid electrolyte material containing lithium-enriched anti-perovskite sulfides and application of solid electrolyte material

The invention discloses lithium-enriched anti-perovskite sulfides and a solid electrolyte material. The general formula of the lithium-enriched anti-perovskite sulfides is (LimMn)3-xS1-y(XaYb)1-z, wherein m is more than 0 and less than or equal to 1, n is more than or equal to 0 and less than to 0.5, (m+n) is less than or equal to 1, a is more than 0 and less than or equal to 1, b is more than or equal to 0 and less than 1, (a+b) is less than or equal to 1, x is more than or equal to 0 and less than or equal to 0.5, y is more than or equal to 0 and less than or equal to 0.5, z is more than or equal to 0 and less than or equal to 0.5 and x=2y+z; M is H, Na, K, Rb, Mg, Ca, Sr, Ba, Y, La, Ti, Zr, Zn, B, Al, Ga, In, C, Si, Ge, P, S or Se; and X is Fe, Cl, Br or I, and Y is a negative ion. The solid electrolyte material has high ion conductivity and thermal stability and a wide working temperature range, and can be applied to lithium ion batteries, rechargeable metal lithium batteries, lithium liquid flow batteries or lithium ion capacitors.
Owner:BEIJING WELION NEW ENERGY TECH CO LTD

Crystal Control and Stability for High-Performance Perovskite Solar Cell

PbI2 thin film crystallization control is prerequisite of high-quality perovskite layer for the sequentially solution-processed perovskite solar cells. According to the present invention, an efficient-and-simple method has been developed by adding halogen acid additive to improve perovskite thin-film quality and an efficiency of at least 15.2% is obtained. This approach improves coverage, uniformity and stability of pervoskite thin-film. In addition, a nanofiber scaffold is incorporated into the perovskite layer so as to reduce the amount of grain boundaries, thus substaintially reducing electron recombination within these boundaries.
Owner:THE HONG KONG POLYTECHNIC UNIV

Semiconductor device

An n-channel transistor or a p-channel transistor provided with a second gate electrode for controlling a threshold voltage in addition to a normal gate electrode is used for a complementary logic circuit. In addition, an insulated gate field-effect transistor with an extremely low off-state current is used as a switching element to control the potential of the second gate electrode. A channel formation region of the transistor which functions as a switching element includes a semiconductor material whose band gap is wider than that of a silicon semiconductor and whose intrinsic carrier density is lower than that of silicon.
Owner:SEMICON ENERGY LAB CO LTD

Thermally activated delayed fluorescence material

ActiveCN106316924AWeak electron-withdrawing abilityWide bandgapOrganic chemistrySolid-state devicesFluorescenceWide band
The invention discloses a thermally activated delayed fluorescence material, which has a structure shown as formula I in the specification. In the formula I, a maximum of two of R1-R5 are H, and the balance are electron-donating groups. The molecular formula of the thermally activated delayed fluorescence material contains one cyano group and at most two H, and the balance are electron-donating groups. The structure has the advantages that: 1) single cyano group has weak electron-withdrawing ability, wider band gap (2.5ev-3.5ev) materials can be obtained, thus being conducive to construction of blue-light emitting materials; 2) single cyano material has shallower LUMO energy level (about 2.7eV), and has weaker dependence on the main material; and 3) the raw material synthesis is easier, and the price is cheaper.
Owner:TSINGHUA UNIV

Method of manufacturing a semiconductor device with fluorine concentration

At present, a forming process of a base film through an amorphous silicon film is conducted in respective film forming chambers in order to obtain satisfactory films. When continuous formation of the base film through the amorphous silicon film is performed in a single film forming chamber with the above film formation condition, crystallization is not sufficiently attained in a crystallization process. By forming the amorphous silicon film using silane gas diluted with hydrogen, crystallization is sufficiently attained in the crystallization process even with the continuous formation of the base film through the amorphous silicon film in the single film forming chamber.
Owner:SEMICON ENERGY LAB CO LTD

Semiconductor device

A semiconductor apparatus includes a semiconductor chip 61 including a power semiconductor device using a wide band gap semiconductor, base materials 62 and 63, first and second intermediate members 65 and 68a, a heat conducting member 66, a radiation fin 67, and an encapsulating material 68 for encapsulating the semiconductor chip 61, the first and second intermediate member 65 and 68a and the heat conducting member 66. The tips of the base materials 62 and 63 work respectively as external connection terminals 62a and 63a. The second intermediate member 68a is made of a material with lower heat conductivity than the first intermediate member 65, and a contact area with the semiconductor chip 61 is larger in the second intermediate member 68a than in the first intermediate member.
Owner:PANASONIC CORP

Insulating gate AlGaN/GaN HEMT

InactiveUS20060138456A1Reduce trappingIncrease maximum drive currentSemiconductor/solid-state device detailsSolid-state devicesHigh resistivityPhysics
AlGaN / GaN HEMTs are disclosed having a thin AlGaN layer to reduce trapping and also having additional layers to reduce gate leakage and increase the maximum drive current. One HEMT according to the present invention comprises a high resistivity semiconductor layer with a barrier semiconductor layer on it. The barrier layer has a wider bandgap than the high resistivity layer and a 2DEG forms between the layers. Source and drain contacts contact the barrier layer, with part of the surface of the barrier layer uncovered by the contacts. An insulating layer is included on the uncovered surface of the barrier layer and a gate contact is included on the insulating layer. The insulating layer forms a barrier to gate leakage current and also helps to increase the HEMT's maximum current drive. The invention also includes methods for fabricating HEMTs according to the present invention. In one method, the HEMT and its insulating layer are fabricated using metal-organic chemical vapor deposition (MOCVD). In another method the insulating layer is sputtered onto the top surface of the HEMT in a sputtering chamber.
Owner:CREE INC

Liquid crystal display device and touch panel

To provide a highly reliable liquid crystal display device including flexible substrates and a crystalline oxide semiconductor film for a backplane. The device includes a flexible first substrate, a flexible second substrate facing the first substrate, and a liquid crystal layer sealed between the substrates with a sealing member. The first substrate is provided with a layer including a transistor, an organic resin film over the transistor, a pixel electrode and a common electrode over the organic resin film, which partly overlap with each other with an insulating film provided therebetween, and an alignment film thereover. The transistor includes a crystalline oxide semiconductor film as a semiconductor layer where a channel is formed. Drying treatment is performed on the layer before the liquid crystal layer is sealed between the substrates, and steps from the drying treatment to sealing of the liquid crystal layer are performed without exposure to the air.
Owner:SEMICON ENERGY LAB CO LTD

Liquid crystal display device and method for driving the same

To increase the frequency of input of image signals in terms of design in a field-sequential liquid crystal display device. Image signals are concurrently supplied to pixels provided in a plurality of rows among pixels arranged in matrix in a pixel portion of the liquid crystal display device. Thus, the frequency of input of an image signal to each pixel can be increased without change in response speed of a transistor or the like included in the liquid crystal display device.
Owner:SEMICON ENERGY LAB CO LTD

Perovskite nanocrystal particle light emitting body with core-shell structure, method for fabricating same, and light emitting element using same

Provided are a core-shell structured perovskite nanocrystalline particle light-emitting body, a method of preparing the same, and a light emitting device using the same. The core-shell structured organic-inorganic hybrid perovskite nanocrystalline particle light-emitting body or metal halide perovskite nanocrystalline particle light-emitting body is able to be dispersed in an organic solvent, and has a perovskite nanocrystal structure and a core-shell structured nanocrystalline particle structure. Therefore, in the perovskite nanocrystalline particle light-emitting body of the present invention, as a shell is formed of a substance having a wider band gap than that of a core, excitons may be more dominantly confined in the core, and durability of the nanocrystal may be improved to prevent exposure of the core perovskite to the air using a perovskite or inorganic semiconductor, which is stable in the air, or an organic polymer.
Owner:SN DISPLAY CO LTD

Nitride semiconductor device

A nitride semiconductor device includes: a conductive substrate; a first semiconductor layer provided on the substrate; a second semiconductor layer provided on the first semiconductor layer; a third semiconductor layer on the second semiconductor layer; a first main electrode connected to the third semiconductor layer; a second main electrode connected to the third semiconductor layer; and a control electrode provided on the third semiconductor layer. The first semiconductor layer is made of AlXGa1−XN (0≦X≦1) of a first conductivity type. The second semiconductor layer is made of a first nitride semiconductor. The third semiconductor layer is made of a second nitride semiconductor which is undoped or of n-type and has a wider bandgap than the first nitride semiconductor.
Owner:KK TOSHIBA

Novel nitrogen-containing heterocyclic compound and organic electronic device using the same

The present invention provides a novel nitrogen-containing heterocyclic derivative and an organic electronic device using the same. The organic electronic device according to the present invention has excellent properties in terms of efficiency, driving voltage, and a life span.
Owner:LG CHEM LTD

Loaded multifunctional catalysis composite material, preparation method thereof and application of composite material to catalytic removal of water pollutants

The invention discloses a loaded multifunctional catalysis composite material, a preparation method thereof and an application of the composite material to catalytic removal of water pollutants. The preparation method includes the steps: preparing a zinc oxide nano-sheet loaded nickel foam (Ni@ZnO) composite material by an electro-deposition method; compounding molybdenum disulfide micro-nano particles on ZnO porous nano-sheets by an electro-deposition method to obtain Ni@ZnO / MoS2. The composite material Ni@ZnO / MoS2 combines the advantages of components such as nickel foam, the zinc oxide nano-sheets and molybdenum disulfide from the point of material performances, high catalytic degradation activity and recycled performances are achieved, photo-catalysis and electro-catalysis are combined from the point of material application, and the catalytic activity of the composite material is improved by the aid of synergistic effects of photo-catalysis and electro-catalysis.
Owner:SUZHOU UNIV

Semiconductor device and manufacturing method thereof

A semiconductor device includes an oxide semiconductor layer including a channel formation region which includes an oxide semiconductor having a wide band gap and a carrier concentration which is as low as possible, and a source electrode and a drain electrode which include an oxide conductor containing hydrogen and oxygen vacancy, and a barrier layer which prevents diffusion of hydrogen and oxygen between an oxide conductive layer and the oxide semiconductor layer. The oxide conductive layer and the oxide semiconductor layer are electrically connected to each other through the barrier layer.
Owner:SEMICON ENERGY LAB CO LTD

Semiconductor display device

In the case where a still image is displayed on a pixel portion having a pixel, for example, a driver circuit for controlling writing of an image signal having image data to the pixel portion stops by stopping supply of power supply voltage to the driver circuit, and writing of an image signal to the pixel portion is stopped. After the driver circuit stops, supply of power supply voltage to a panel controller for controlling the operation of the driver circuit and an image memory for storing the image data is stopped, and supply of power supply voltage to a CPU for collectively controlling the operation of the panel controller, the image memory, and a power supply controller for controlling supply of power supply voltage to a variety of circuits in a semiconductor display device is stopped.
Owner:SEMICON ENERGY LAB CO LTD

Semiconductor memory device

To provide a highly integrated semiconductor memory device. To provide a semiconductor memory device which can hold stored data even when power is not supplied. To provide a semiconductor memory device which has a large number of write cycles. The degree of integration of a memory cell array is increased by forming a memory cell including two transistors and one capacitor which are arranged three-dimensionally. The electric charge accumulated in the capacitor is prevented from being leaking by forming a transistor for controlling the amount of electric charge of the capacitor in the memory cell using a wide-gap semiconductor having a wider band gap than silicon. Accordingly, a semiconductor memory device which can hold stored data even when power is not supplied can be provided.
Owner:SEMICON ENERGY LAB CO LTD

Bipolar phosphorescent main material containing anthracene derivatives of tetraphenyl silicane and carbazole and organic electroluminescent device

The invention discloses a bipolar phosphorescent main material containing anthracene derivatives of tetraphenyl silicane and carbazole and an organic electroluminescent device. The organic electroluminescent device has a layered doped structure, wherein a luminescent layer is made from bipolar phosphorescent main material doped series Ir (III) luminescent material which contains the anthracene derivatives of tetraphenyl silicane and carbazole. The series main material has relatively wide band gap, relatively high glass transition temperature (Tg) and excellent bipolarity of hole / electron transmission capability, is applied to the main material of green organic phosphorescent luminophor and also has the potential of red light and blue light application. The phosphorescent main material has the biggest characteristic of bipolar hole and electron transmission property and can be widely applied to the red, green and blue (RGB) base color doped phosphorescent main material. The manufacturing process is simple and the invention provides an excellent material for full-color display and illumination application.
Owner:陕西蒲城海泰新材料产业有限责任公司

Gallium-nitride based multi-quantum well light-emitting diode n-type contact layer structure

A structure for the n-type contact layer in the GaN-based MQW LEDs is provided. Instead of using Si-doped GaN as commonly found in conventional GaN-based MQW LEDs, the n-type contact layer provided by the present invention achieves high doping density (>1×1019 cm−3) and low resistivity through a superlattice structure combining two types of materials, AlmInnGa1-m-nN and AlpInqGa1-p-qN (0≦m, n<1, 0<p, q<1, p+q≦1, m<p), each having its specific composition and doping density. In addition, by controlling the composition of Al, In, and Ga in the two materials, the n-type contact layer would have a compatible lattice constant with the substrate and the epitaxial structure of the GaN-based MQW LEDs. This n-type contact layer, therefore, would not chap from the heavy Si doping, have a superior quality, and reduce the difficulties of forming n-type ohmic contact electrode. In turn, the GaN-based MQW LEDs would require a lower operation voltage.
Owner:LUMENS +1

Light emitting diode

InactiveUS20100187550A1Enhancing recombinationIncrease in the electron barrierSemiconductor devicesLight emitting deviceLight-emitting diode
In a preferred embodiment, a light emitting device comprising: a polar template; a p-type layer grown on the polar template; the p-type layer having a first polarization vector; the first polarization vector having a first projection relative to a growth direction; an n-type layer grown on the p-type layer; the n-type layer having a second polarization vector; the second polarization vector having a second projection relative to said growth direction that is larger than the first projection of the first polarization vector for the p-type layer; the n-type layer and p-type layer forming an interface; whereby the first polarization vector in the p-layer and second polarization vector in the n-layer create a discontinuity at the interface resulting in a negative charge appearing at the interface. In another preferred embodiment, a light emitting device comprising: a polar template; a n-type layer grown on the template; the n-type layer having a first polarization vector; the first polarization vector having a first projection relative to a growth direction; an p-type layer grown on the n-type layer; the p-type layer having a second polarization vector; the second polarization vector having a second projection relative to said growth direction that is larger than the first projection of the first polarization vector for the p-type layer; the n-type layer and p-type layer forming an interface; whereby the first polarization vector in the p-layer and second polarization vector in the n-layer create a discontinuity at the interface resulting in a negative charge appearing at the interface.
Owner:ARMY US SEC THE THE
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