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40 results about "Bulk moulding compound" patented technology

Bulk moulding compound (BMC), bulk moulding composite, or dough moulding compound (DMC), is a ready-to-mold, glass-fiber reinforced thermoset polymer material primarily used in compression moulding, as well as in injection moulding and transfer moulding. Typical applications include demanding electrical applications, corrosion resistant needs, appliance, automotive, and transit.

Carbon fiber and glass fiber hybrid-reinforced sheet moulding compound and manufacturing technology thereof

The invention provides a carbon fiber and glass fiber hybrid-reinforced sheet moulding compound and is characterized in that the sheet moulding compound mainly comprises resin paste I, resin paste II and thickening agent; the manufacturing technology of the sheet moulding compound comprises the following steps: the preparation of the resin paste I, the resin paste II and the thickening agent; the mixing of the resin paste I and the thickening agent and that of the resin paste II and the thickening agent; and impregnation: the resin paste I and chopped carbon fiber, and the resin paste II and chopped glass fiber are impregnated on an SMC (Sheet Molding Compound) machine set respectively, the impregnated chopped glass fiber is uniformly placed on the impregnated chopped carbon fiber, and then the impregnated chopped glass fiber and the impregnated chopped carbon fiber are composited by pressure through a compacting machine to manufacture a carbon fiber and glass fiber hybrid sheet material which is wound or packaged in a box through the compacting machine and then is subject to slaking treatment; and after the slaking treatment, the carbon fiber and glass fiber hybrid sheet material is made into a finished sheet moulding compound product through mould pressing. The sheet moulding compound has a low cost and a low manufacturing cost, can meet requirements for utilization, is suitable for industrial production and is simple and applicable.
Owner:青岛威奥时代智能装备有限公司

Polyester resin compositions with reduced emission of volatile organic compounds

Thermally curate resin composition, having shrink-controlled properties and being suitable for use in sheet moulding compounds and bulk moulding compounds (SMCs and BMCs) comprising, inter alia (a)an unsaturated polyester; (b) an alkenyl aromatic monomer; (c) a low profile additive; (d) a peroxide initiator; (e) a thickening agent; (f) fibrous reinforcement material; and optionally one or more components selected from the group of (g) mould release agents; (h) wetting and viscosity reducing agents; and (i) fillers, wherein the composition also comprises a uret dione diisocyanate, in an amount of at least 0,2-1,0% by weight relative to the total weight of components (a), (b) and (c) of the resin composition. The resin compositions according to the invention in particular have a low emission of volatile organic compounds (VOC). More particularly, the resin compositions have excellent Class A properties. The present invention also relates to low profile additives (LPAs) wherein a uret dione diisocyanate is chemically attached through one or both of its reactive side-chain isocyanate groups to one or more of the OH-, NH2-, or COOH- groups of a component already having LPA properties. Finally, the present invention relates to low-VOC products and parts produced from the SMCs and BMCs according to the invention.
Owner:DSM IP ASSETS BV

Polyester Resin Compositions With Reduced Emission Of Volatile Organic Compounds

Thermally curate resin composition, having shrink-controlled properties and being suitable for use in sheet moulding compounds and bulk moulding compounds (SMCs and BMCs) comprising, inter alia (a) an unsaturated polyester; (b) an alkenyl aromatic monomer; (c) a low profile additive; (d) a peroxide initiator; (e) a thickening agent; (f) fibrous reinforcement material; and optionally one or more components selected from the group of (g) mould release agents; (h) wetting and viscosity reducing agents; and (i) fillers, wherein the composition also comprises a uret dione diisocyanate, in an amount of at least 0.2-1.0% by weight relative to the total weight of components (a), (b) and (c) of the resin composition. The resin compositions according to the invention in particular have a low emission of volatile organic compounds (VOC). More particularly, the resin compositions have excellent Class A properties. The present invention also relates to low profile additives (LPAs) wherein a uret dione diisocyanate is chemically attached through one or both of its reactive side-chain isocyanate groups to one or more of the OH—, NH2—, or COOH— groups of a component already having LPA properties. Finally, the present invention relates to low-VOC products and parts produced from the SMCs and BMCs according to the invention.
Owner:DSM IP ASSETS BV
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