78 results about "Darkfield illumination" patented technology

The invention relates to the technical field of optical detection, in particular to semiconductor detection equipment, which comprises a reinspection light source for emitting reinspection light, a bright field light source for emitting bright field light and a dark field light source for emitting dark field light, the reinspection light, the bright field light and the dark field light are respectively guided to irradiate the surface of a wafer, the reinspection light is reflected by the wafer to form reinspection signal light, and the reinspection signal light is transmitted to the light source. The bright-field light is reflected by the wafer to form bright-field signal light, and the dark-field light source is scattered by the wafer to form dark-field signal light; the optical separation element is used for collecting the bright-field signal light, the dark-field signal light and the reinspection signal light and performing spatial separation, so that the dark-field signal light, the bright-field signal light and the reinspection signal light are emitted to different transmission paths for respective imaging; wherein a dark field illumination light spot formed by the dark field light on the surface of the wafer, a bright field illumination light spot formed by the bright field light on the surface of the wafer and a reinspection illumination light spot formed by the reinspection light on the surface of the wafer do not coincide with one another. The wafer defect detection device is at least beneficial to improving the detection speed and the detection precision of wafer defect detection.

The invention relates to the field of industrial visual inspection, and discloses a material surface defect detection system based on industrial visual inspection, which comprises a laser light source module, a light beam distribution assembly, a dark field illumination structure, a near field irradiation structure, an industrial visual inspection module, a signal processing module and a data processing module. The laser light source module is used for generating a modulated laser beam, and the laser beam distribution assembly guides the laser beam to the surface of a material; and the dark field illumination structure is matched with the near field irradiation structure to form an irradiation path with an inclined direction and a sub-wavelength scale. The industrial visual inspection module comprises an industrial camera, an image acquisition device and an image processing module and is used for acquiring and processing images of the defect area. The signal processing module is used for performing frequency domain analysis on the scattered signals; and the data processing module is used for analyzing spatial positions and forms of defects based on image and signal data. The system is suitable for fine detection and structure identification of tiny defects on the surface of a material.

The invention relates to the technical field of optical detection, in particular to an optical detection system and optical detection equipment. A first optical element for changing a bright field illumination light beam into first linearly polarized light is arranged in a light path of the bright field illumination light beam; a second optical element for changing the dark field illumination light beam into second linearly polarized light is arranged in a light path of the dark field illumination light beam, the polarization direction of the first linearly polarized light is different from that of the second linearly polarized light, and the first optical element is used for inhibiting the first stray light from being mixed into a transmission path of the first linearly polarized light; the first stray light comprises light which reaches the bright field illumination lens group after the second linearly polarized light is reflected and / or scattered; therefore, in the dark field detection process, the first stray light is prevented from being reflected by the bright field illumination lens group through the first optical element, the adverse effect of the first stray light on dark field imaging is reduced, the imaging quality and the imaging effect of dark field images are improved, and the detection efficiency and the detection accuracy are improved.

According to the wafer bright and dark field defect detection device provided by the invention, the objective lenses with multiple multiplying powers are arranged, and the objective lenses can be flexibly switched according to the requirement of detection precision, so that switching between high detection precision and low detection speed and low detection precision and high detection speed is realized; and the dark field illumination light beam is accurately configured at the dark field light source end, so that the dark field illumination light spot covers the acquisition view field corresponding to the dark field detector under the required multiple objective lens multiplying power, and the crosstalk of the dark field acquisition view field and the dark field acquisition view field is avoided by effectively controlling the dark field illumination light spot area.

The invention discloses an optical detection device and a sample analyzer, in the optical detection device, a bright / dark field illumination assembly is used for emitting an illumination light beam, and a fluorescence excitation assembly is used for emitting an excitation light beam; the bearing table is used for bearing a to-be-detected sample; the infinite objective lens and the barrel lens are used for imaging a to-be-detected sample in a bright field to form a bright field imaging light beam, imaging the to-be-detected sample in a dark field to form a dark field imaging light beam, and performing microscopic imaging on fluorescent particles in the to-be-detected sample to form a fluorescent imaging light beam; the imaging receiving assembly is used for receiving the bright field imaging light beam, the dark field imaging light beam and the fluorescence imaging light beam. The optical detection device is an infinite microscopic optical system, can perform bright / dark field detection on the to-be-detected sample, can perform fluorescence detection on the to-be-detected sample, is compact in structure, high in sharing rate of all optical elements, saves optical element materials, and is low in cost.

The invention discloses a semiconductor defect detection method and device, and the detection method comprises the steps: controlling the bright field illumination and the objective magnification, and obtaining the surface microstructure morphology of a to-be-detected sample; determining the process type of the sample to be detected based on the surface microstructure morphology, and automatically determining dark field illumination light intensity parameters of at least two groups of dark field light sources according to a preset mapping relation between the process type and the dark field illumination light intensity parameters; according to the tissue morphology of the sample, at least two dark field light sources with different incident angles are controlled to carry out dark field illumination on the sample to be detected from different directions, and scattered signal images corresponding to different dark field angles are obtained through at least two detectors respectively; and analyzing defect information of the to-be-detected sample based on the scattered signal images at the dark field angles. The detection method can be adaptive to defect detection of different process sheet types, can effectively improve the detection precision of defect diversity and directivity, improves the detection signal-to-noise ratio, and efficiently detects multiple different types of defects at the same time.

The invention relates to a wafer defect detection optical system, which comprises an imaging assembly, a detection assembly and an illumination assembly, the illumination assembly is used for forming bright field illumination and dark field illumination, the bright field illumination respectively forms reflection bright field illumination and transmission bright field illumination under reflection and transmission conditions, the imaging assembly is located on an imaging path of a to-be-detected wafer, and the detection assembly is located on the imaging path of the to-be-detected wafer. The imaging assembly is used for imaging a wafer to be detected, and the detection assembly is used for collecting an imaging picture on the imaging assembly; the lighting assembly comprises a first light source, a second light source and a third light source. The first light source is used for providing a light source during reflection of bright field illumination, the second light source is used for providing a light source during dark field illumination, and the third light source is used for providing a light source during transmission of bright field illumination. According to the wafer defect detection optical system, under the condition of the same detection station, pure bright field detection, phase deflection detection, dark field detection and light transmission detection can be provided; and the process adaptability of detecting different defect types is improved.

The invention relates to the technical field of surface quality defect detection of kitchen utensils, in particular to an imaging method and an imaging device for the inner wall surface of a cylindrical thin-wall part. The interference of highlight spots and halo generated by mirror reflection in the imaging process of the inner surface of the high-light-reflection thin-wall part can be effectively overcome. High-precision inner surface unfolding image acquisition is realized by synchronously controlling the acquisition frequencies of the rotating platform and the line scanning camera and combining a mirror surface refraction dark field illumination technology and an image processing algorithm. The method has the structural advantage of being adaptive to an automatic assembly line, and is suitable for large-scale and high-precision industrial quality detection.

The present invention discloses a single-point rotation scanning dark field optical microscopy imaging system and method, belonging to the field of optical microscopy imaging technology, comprising: a sample stage; an object environment for observing the sample stage; a camera for collecting the sample image through the object environment; a dark field illuminator for providing illumination light to illuminate the sample stage; the dark field illuminator comprises: an illumination light source for providing illumination light; a rotatable baffle for adjusting the illumination light of the illumination light source to illuminate the sample stage at a set angle; the rotatable baffle comprises: a first baffle and a second baffle that cooperates with the first baffle to form an adjustable gap; the single-point rotation scanning dark field optical microscopy imaging system and method reveal the variation law of scattering intensity between different orientations, establish the correlation between the scattering intensity and the morphology, construct a fast and high-throughput morphology recognition method for static particles, and provide a new solution for obtaining particle morphology distribution information.

The present invention discloses a dark-field defect detection device, which relates to the field of optical detection technology. The dark-field defect detection device includes a first illumination optical system, a first reflector, and an imaging system; the first illumination optical system is configured to emit a dark-field illumination beam, which is incident from the end face of the object to be tested to the interior of the object to be tested; the imaging system is configured to image the light beam emitted from the upper surface or lower surface of the object to be tested; and the first reflector is configured to reflect the light beam emitted from the end face of the object to be tested back into the object to be tested. The embodiments of the present invention improve energy utilization, save costs, and increase the adjustability and flexibility of detection.

The invention relates to the technical field of semiconductor manufacturing, and discloses a mask detection device and method based on a light path technology, and the device comprises an optical imaging system, a dark field illumination system, a reflection coaxial light illumination system, a transmission coaxial light illumination system, and an automatic focusing system. Wherein the dark field illumination system is arranged in the bottom area of the optical imaging system, a mask to be detected is arranged at the bottom of the dark field illumination system, the reflection coaxial light illumination system is arranged in the side edge area of the optical imaging system, and the transmission coaxial light illumination system is arranged in the bottom area of the mask. A transmission light path adopts a four-stage compression design of a light source, a light receiving lens, a field lens and a condensing lens, and is matched with a plane reflector to fold the light path, so that the total length is shortened by 35% compared with that of a Kohler illumination system, and the Kohler illumination system is shorter in light path, smaller in occupied space and convenient to integrate and use compared with a traditional Kohler illumination system.

The invention relates to a device and a method for in-line quality control of a coating of a component of a solid-state battery, the device (1a) comprising: a transport device (6) for a solid-state battery component (5) having a layer, in particular a layer produced by means of dry or wet coating; at least one first light source (2) for transmitted light illumination of the layer; at least one second light source (3a) for bright-field illumination and / or dark-field illumination of a surface (7) of the layer; at least one camera (4a) for recording image data of the layer by means of bright-field, dark-field and / or transmitted-light illumination; and image processing means for processing the image data to detect a defect of the layer.

The present application provides a wafer bright and dark field defect detection device, which is equipped with objective lenses of multiple magnifications. These objective lenses can be flexibly switched according to the requirements of detection accuracy, thereby realizing switching between high detection accuracy and low detection speed and low detection accuracy and high detection speed; and the dark field illumination beam is precisely configured at the dark field light source end, so that the dark field illumination spot covers the collection field of view corresponding to the dark field detector under the required multiple objective lens magnifications, and crosstalk between the bright and dark field collection fields is avoided by effectively controlling the dark field illumination spot area.

A method and an apparatus for generating reflective dark field (RDF) illumination for a microscope are provided. The apparatus may include: one or more RDF illumination light sources positioned to emit light beams substantially orthogonal to a microscope optical axis; and multiple beam directing assemblies positioned at substantially identical optical axis distances from an RDF port of a bright field / dark field (BD) objective lens of the microscope. The multiple beam directing assemblies may be positioned to redirect emitted light received from the RDF illumination light sources into the RDF port to form a hollow light cylinder around the microscope optical axis, wherein the hollow light cylinder is diverted towards a microscope field of view (FOV) by an internal light diverting element (ILDE) of the microscope positioned within the RDF port.

Systems and methods for grading a gemstone including its clarity are presented. An image capturing device disposed to capture images along a line of sight: a holder to support the gemstone thereon; a manipulator arm, carrying the holder, configured to rotate along a roll axis, and allow for rotation of the holder along a pitch axis: an illumination sub-system comprising a direct illumination arrangement, a dark-field illumination arrangement, and a facet illumination arrangement; and a controller arrangement configured to control the illumination arrangements to generate a plurality of illumination patterns for the gemstone, control the manipulator arm to position the holder for a plurality of orientations of the gemstone, control the image capturing device to capture an image of each of the generated illumination patterns, each of the orientations and each of one or more depths of focus, and process the captured images to grade the gemstone.

The present application relates to a kind of optical detection systems with full-angle oblique incidence dark field illumination system, belong to wafer defect detection technical field, especially to full-angle oblique incidence dark field illumination system optical detection system.The optical detection system provided by the present application, by the combination of first cone lens and second cone lens, collimate incident laser beam as parallel annular light beam, then realize full-angle oblique incidence dark field illumination by annular reflector and annular focusing system, fundamentally overcome the problems of existing single light source directional sensitivity and high precision of installation and adjustment of divergent annular light beam, poor expansibility, while ensuring the advantages of dark field high contrast, high precision and non-destructive testing, significantly improve system detection sensitivity, installation and adjustment convenience and function expansion capability.

Imaging apparatus 10 for imaging nozzle section 21 of droplet dispenser device 20 includes illumination device 11 arranged for creating illumination light directed along illumination axis A1 towards an illumination range configured for accommodating nozzle section 21, and camera device 12 having imaging axis A2 directed to the illumination range. Camera device 12 is configured for collecting nozzle image(s) of nozzle section 21 arranged in the illumination range, wherein illumination device 11 and camera device 12 are arranged for dark field illumination of nozzle section 21. Illumination axis A1 and imaging axis A2 are slanted relative to each other and an illumination angle between axes A1 and A2 is selected such that the at least one nozzle image is collected with a dark background. Furthermore, dispenser apparatus 100 for dispensing droplets on a target and an imaging method for imaging nozzle section 21 of droplet dispenser device 20 are described.

The present application relates to the technical field of surface quality defect detection of kitchen utensils, and in particular to a cylindrical thin-walled part inner wall imaging method and imaging device, compared with the prior art, the imaging method of the present application is convenient to implement, and can effectively overcome the high-brightness spot and halo interference caused by mirror reflection in the imaging process of the inner surface of the high-reflectivity thin-walled part. By synchronously controlling the acquisition frequency of the rotating platform and the line-scan camera, combining mirror refraction dark-field illumination technology and image processing algorithm, high-precision inner surface unwrapping image acquisition is realized. The method has the structural advantage of adapting to the automatic assembly line and is suitable for large-scale, high-precision industrial quality detection.

An illumination module may include a laser diode array configured to emit laser radiation; a phosphor illumination unit that is configured to emit phosphor radiation following an exposure to the laser radiation; a multiple-angle illumination unit; and intermediate optics that is configured to convey the phosphor radiation to the multiple-angle illumination unit. The multiple-angle illumination unit is configured to receive the phosphor radiation and to dark field illuminate a region of a sample wafer from multiple angles during inspection of the wafer.

The invention discloses an optical fiber type dark field illumination system for a micron-sized variable area. The optical fiber type dark field illumination system is mainly used for forming high-brightness micron-sized variable area dark field illumination. The device is composed of a laser light source, a conical single-mode fiber, a three-dimensional precision displacement table and a microscopic imaging device. Firstly, a laser light source is coupled into a single-mode optical fiber with a conical output end, a high-purity single mode is formed, the output end face of the optical fiber obliquely irradiates a sample at a plurality of or more than ten wavelength magnitude distances through a three-dimensional fine tuning frame, and finally a micron-sized dark field illumination area is formed, so that the illumination intensity is improved, and redundant scattered light is avoided; and the signal-to-noise ratio of the weak scattering intensity is further improved. A complicated optical system of a traditional optical fiber illumination mode is omitted, and the size of an illumination area can be flexibly adjusted through the three-dimensional fine adjustment frame loaded with the optical fiber fixing device. The grinding optical fibers and the light sources in the structure can be flexibly changed, and the wavelength and intensity of illumination light can be changed by selecting different light sources and corresponding optical fibers.

A method and a system for inspecting the outer skin of an aircraft or a component thereof by scanning a surface of an outer skin of an aircraft with a line scan camera unit while the surface is illuminated with a first light field and with a second light field, and generating image data representing the surface while it is scanned. The image data is processed and defects of the surface and their characteristics and physical locations are automatically determined from the image data representing the surface during its illumination with the first light field and its illumination with the second light field. The defects, characteristics and physical locations are output. The first and second light fields may be formed as alternating bright field illumination and dark field illumination, or as light of a first color and light of a second color.

The invention provides an optical sensing system and an optical sensing method. The optical sensing system comprises a bright field light source, a dark field light source, an optical detection circuit and a processing circuit. The processing circuitry executes a floor type detection procedure including controlling the dark field light source to provide dark field illumination to the floor; receiving scattered light from the floor through an optical detection circuit; executing a dark field calculation program to obtain a first optical characteristic of the target area; when it is determined that the first optical characteristic does not meet the first surface condition, the floor type is determined to be a first type; when it is determined that the first optical characteristic meets the first surface condition, bright field illumination is provided for the floor; receiving scattered light from the floor through an optical detection circuit; executing the bright field calculation program to obtain a second optical characteristic of the target area, and determining whether the second optical characteristic meets a second surface condition; and when it is determined that the second optical characteristic meets the second surface condition, determining that the floor type of the floor in the target area is a second type.

The application provides a defect detection device, which comprises an illumination module, a detection channel and an image processing module. The illumination module comprises an inclined dark-field illumination assembly configured to emit a first light beam, which is obliquely projected onto an object plane; the detection channel comprises a light collection assembly, a first detector and a second detector. The light collection assembly is used to collect scattered light generated after a to-be-detected object on the object plane is irradiated by the first light beam, and divide the scattered light of the first light beam into first light and second light with different propagation directions. The first detector is used to receive the first light and generate an in-focus image for showing a defect morphology. The second detector is used to receive the second light and generate an out-of-focus image for showing the defect morphology. The image processing module is used to compare the in-focus image and the out-of-focus image, and classify defects based on a comparison result. The defect detection device of the application can distinguish and classify convex and concave defects.

One variation of an optical inspection kit includes: an enclosure defining an imaging volume; an optical sensor adjacent the imaging volume and defining a field of view directed toward the imaging volume; a nest module defining a receptacle configured to locate a surface of interest on a first unit of a first part within the imaging volume at an image plane of the optical sensor; a dark-field lighting module adjacent and perpendicular to the nest module and including a dark-field light source configured to output light across a light plane and a directional light filter configured to pass light output by the dark-field light source normal to the light plane and to reject light output by the dark-field light source substantially nonparallel to the light plane; and a bright-field light source proximal the optical sensor and configured to output light toward the surface of interest.

Systems, methods, and devices for inspection, under a microscope, of end connectors of fiber optic cables are provided. In one aspect, a light ring including a circular array of light sources provides darkfield illumination to an end connector being inspected under a microscope. Each of the light sources may be lit in series and the resulting shadows may be used to identify dirt on the end connector, as well as to determine whether any dirt identified on the end connector can be cleaned off. In another aspect, a light ring combined with a redirection ring (e.g., a reflector and / or refractor ring) may provide darkfield illumination. In yet another aspect, a series of images may be captured and analyzed to automatically identify dirt on the end connector, as well as to determine whether any identified dirt can be cleaned off.

The present invention proposes a device for detecting the phototaxis of plankton, comprising a detection box and a light induction unit arranged on one side of the detection box, wherein the light induction unit comprises an induction light source with switchable wavelengths; further comprising: an illumination unit, which is distributed around the detection box and is used for illuminating the detection box; and an imaging unit, which is arranged above the detection box and is used for acquiring images in the detection box. The device for detecting the phototaxis of plankton can be used to study the phototaxis characteristics of plankton to light of different wavelengths. Furthermore, the illumination unit can switch between bright field illumination and dark field illumination, and can well observe different types of plankton. The present invention also proposes a method for analyzing the phototaxis of plankton, which analyzes the movement state of plankton based on the acquired plankton phototaxis video and generates data for scientific research. In addition, the detection device of the present invention directly observes the plankton body, accurately detects the position of the plankton, and is conducive to obtaining more accurate analysis results.

A microscope is configured for brightfield and darkfield illumination using Kohler illumination. An illuminator provides a first radiation pattern that passes through the microscope's objective lens for brightfield illumination and provides at least one second radiation pattern that also passes through the objective lens for darkfield illumination.

The application relates to an illumination device, an illumination method and a semiconductor optical detection system. The illumination device comprises a light source, an optical assembly and an out-light module. The light source is configured to emit an illumination light beam in response to an illumination request. The optical assembly is located on a transmission path of the illumination light beam and is configured to convert the illumination light beam into a bright-field illumination light beam in a bright-field illumination mode and convert the illumination light beam into a dark-field illumination light beam in a dark-field illumination mode. The out-light module is located on an out-light side of the optical assembly and is configured to transmit the bright-field illumination light beam to a detection area in the bright-field illumination mode and transmit the dark-field illumination light beam to the detection area in the dark-field illumination mode. The application can realize high-precision and high-efficiency illumination mode switching.

An inspection system and method are presented for edge and bevel inspection of a semiconductor structure using and an optical system defining: a tangential imaging providing back-light tangential illumination propagating along a tangential illumination path with respect to a contour outline of a contour region of an edge of the structure and substantially along a detection path of a tangential imaging sensor unit which detects at least a part of said back-light tangential illumination and generates image data indicative of a tangential image of the contour outline to enable detection of defect data of the edge, and at least dark-field imaging setup directing dark-field illumination towards the contour region along at least one dark-field illumination path and providing collection of scattering of a response of the contour region to the dark-field illumination, to enable detection of a dark-field image indicative of location of defects along said profile of the edge.

The invention relates to the technical field of optical imaging, and discloses a dark field polarized light microscopic imaging device, which comprises a dark field illumination light source; the light beam shaping system is arranged behind the light path of the dark field illumination light source; the polarizer is arranged behind the light path of the light beam shaping system; the dark field illumination ring is arranged behind the light path of the polarizer; the microscope objective is used for collecting signal light from the sample; the dark field imaging ring is arranged in an imaging light path of the microscope objective; the polarization analyzer is arranged behind the light path of the dark field imaging ring; and an imaging camera. The device provided by the invention has the advantage of high-sensitivity detection of a nano-scale scatterer by a dark-field microscope, and also obtains the capability of identifying and analyzing a material by a polarizing microscope by utilizing polarization characteristics, so that the signal-to-noise ratio and contrast ratio of imaging built-in nano impurities or defects in a strong birefringence material are remarkably improved; the problem of background interference which cannot be overcome by a single technical means is solved.