61 results about "Darkfield illumination" patented technology

The invention relates to the field of industrial visual inspection, and discloses a material surface defect detection system based on industrial visual inspection, which comprises a laser light source module, a light beam distribution assembly, a dark field illumination structure, a near field irradiation structure, an industrial visual inspection module, a signal processing module and a data processing module. The laser light source module is used for generating a modulated laser beam, and the laser beam distribution assembly guides the laser beam to the surface of a material; and the dark field illumination structure is matched with the near field irradiation structure to form an irradiation path with an inclined direction and a sub-wavelength scale. The industrial visual inspection module comprises an industrial camera, an image acquisition device and an image processing module and is used for acquiring and processing images of the defect area. The signal processing module is used for performing frequency domain analysis on the scattered signals; and the data processing module is used for analyzing spatial positions and forms of defects based on image and signal data. The system is suitable for fine detection and structure identification of tiny defects on the surface of a material.

The invention discloses a semiconductor defect detection method and device, and the detection method comprises the steps: controlling the bright field illumination and the objective magnification, and obtaining the surface microstructure morphology of a to-be-detected sample; determining the process type of the sample to be detected based on the surface microstructure morphology, and automatically determining dark field illumination light intensity parameters of at least two groups of dark field light sources according to a preset mapping relation between the process type and the dark field illumination light intensity parameters; according to the tissue morphology of the sample, at least two dark field light sources with different incident angles are controlled to carry out dark field illumination on the sample to be detected from different directions, and scattered signal images corresponding to different dark field angles are obtained through at least two detectors respectively; and analyzing defect information of the to-be-detected sample based on the scattered signal images at the dark field angles. The detection method can be adaptive to defect detection of different process sheet types, can effectively improve the detection precision of defect diversity and directivity, improves the detection signal-to-noise ratio, and efficiently detects multiple different types of defects at the same time.

The invention relates to a wafer defect detection optical system, which comprises an imaging assembly, a detection assembly and an illumination assembly, the illumination assembly is used for forming bright field illumination and dark field illumination, the bright field illumination respectively forms reflection bright field illumination and transmission bright field illumination under reflection and transmission conditions, the imaging assembly is located on an imaging path of a to-be-detected wafer, and the detection assembly is located on the imaging path of the to-be-detected wafer. The imaging assembly is used for imaging a wafer to be detected, and the detection assembly is used for collecting an imaging picture on the imaging assembly; the lighting assembly comprises a first light source, a second light source and a third light source. The first light source is used for providing a light source during reflection of bright field illumination, the second light source is used for providing a light source during dark field illumination, and the third light source is used for providing a light source during transmission of bright field illumination. According to the wafer defect detection optical system, under the condition of the same detection station, pure bright field detection, phase deflection detection, dark field detection and light transmission detection can be provided; and the process adaptability of detecting different defect types is improved.

The invention relates to the technical field of surface quality defect detection of kitchen utensils, in particular to an imaging method and an imaging device for the inner wall surface of a cylindrical thin-wall part. The interference of highlight spots and halo generated by mirror reflection in the imaging process of the inner surface of the high-light-reflection thin-wall part can be effectively overcome. High-precision inner surface unfolding image acquisition is realized by synchronously controlling the acquisition frequencies of the rotating platform and the line scanning camera and combining a mirror surface refraction dark field illumination technology and an image processing algorithm. The method has the structural advantage of being adaptive to an automatic assembly line, and is suitable for large-scale and high-precision industrial quality detection.

The present invention discloses a dark-field defect detection device, which relates to the field of optical detection technology. The dark-field defect detection device includes a first illumination optical system, a first reflector, and an imaging system; the first illumination optical system is configured to emit a dark-field illumination beam, which is incident from the end face of the object to be tested to the interior of the object to be tested; the imaging system is configured to image the light beam emitted from the upper surface or lower surface of the object to be tested; and the first reflector is configured to reflect the light beam emitted from the end face of the object to be tested back into the object to be tested. The embodiments of the present invention improve energy utilization, save costs, and increase the adjustability and flexibility of detection.

The invention relates to the technical field of semiconductor manufacturing, and discloses a mask detection device and method based on a light path technology, and the device comprises an optical imaging system, a dark field illumination system, a reflection coaxial light illumination system, a transmission coaxial light illumination system, and an automatic focusing system. Wherein the dark field illumination system is arranged in the bottom area of the optical imaging system, a mask to be detected is arranged at the bottom of the dark field illumination system, the reflection coaxial light illumination system is arranged in the side edge area of the optical imaging system, and the transmission coaxial light illumination system is arranged in the bottom area of the mask. A transmission light path adopts a four-stage compression design of a light source, a light receiving lens, a field lens and a condensing lens, and is matched with a plane reflector to fold the light path, so that the total length is shortened by 35% compared with that of a Kohler illumination system, and the Kohler illumination system is shorter in light path, smaller in occupied space and convenient to integrate and use compared with a traditional Kohler illumination system.

The invention relates to a device and a method for in-line quality control of a coating of a component of a solid-state battery, the device (1a) comprising: a transport device (6) for a solid-state battery component (5) having a layer, in particular a layer produced by means of dry or wet coating; at least one first light source (2) for transmitted light illumination of the layer; at least one second light source (3a) for bright-field illumination and / or dark-field illumination of a surface (7) of the layer; at least one camera (4a) for recording image data of the layer by means of bright-field, dark-field and / or transmitted-light illumination; and image processing means for processing the image data to detect a defect of the layer.

The present application provides a wafer bright and dark field defect detection device, which is equipped with objective lenses of multiple magnifications. These objective lenses can be flexibly switched according to the requirements of detection accuracy, thereby realizing switching between high detection accuracy and low detection speed and low detection accuracy and high detection speed; and the dark field illumination beam is precisely configured at the dark field light source end, so that the dark field illumination spot covers the collection field of view corresponding to the dark field detector under the required multiple objective lens magnifications, and crosstalk between the bright and dark field collection fields is avoided by effectively controlling the dark field illumination spot area.

A method and an apparatus for generating reflective dark field (RDF) illumination for a microscope are provided. The apparatus may include: one or more RDF illumination light sources positioned to emit light beams substantially orthogonal to a microscope optical axis; and multiple beam directing assemblies positioned at substantially identical optical axis distances from an RDF port of a bright field / dark field (BD) objective lens of the microscope. The multiple beam directing assemblies may be positioned to redirect emitted light received from the RDF illumination light sources into the RDF port to form a hollow light cylinder around the microscope optical axis, wherein the hollow light cylinder is diverted towards a microscope field of view (FOV) by an internal light diverting element (ILDE) of the microscope positioned within the RDF port.

Systems and methods for grading a gemstone including its clarity are presented. An image capturing device disposed to capture images along a line of sight: a holder to support the gemstone thereon; a manipulator arm, carrying the holder, configured to rotate along a roll axis, and allow for rotation of the holder along a pitch axis: an illumination sub-system comprising a direct illumination arrangement, a dark-field illumination arrangement, and a facet illumination arrangement; and a controller arrangement configured to control the illumination arrangements to generate a plurality of illumination patterns for the gemstone, control the manipulator arm to position the holder for a plurality of orientations of the gemstone, control the image capturing device to capture an image of each of the generated illumination patterns, each of the orientations and each of one or more depths of focus, and process the captured images to grade the gemstone.

The present application relates to a kind of optical detection systems with full-angle oblique incidence dark field illumination system, belong to wafer defect detection technical field, especially to full-angle oblique incidence dark field illumination system optical detection system.The optical detection system provided by the present application, by the combination of first cone lens and second cone lens, collimate incident laser beam as parallel annular light beam, then realize full-angle oblique incidence dark field illumination by annular reflector and annular focusing system, fundamentally overcome the problems of existing single light source directional sensitivity and high precision of installation and adjustment of divergent annular light beam, poor expansibility, while ensuring the advantages of dark field high contrast, high precision and non-destructive testing, significantly improve system detection sensitivity, installation and adjustment convenience and function expansion capability.

The present application relates to the technical field of surface quality defect detection of kitchen utensils, and in particular to a cylindrical thin-walled part inner wall imaging method and imaging device, compared with the prior art, the imaging method of the present application is convenient to implement, and can effectively overcome the high-brightness spot and halo interference caused by mirror reflection in the imaging process of the inner surface of the high-reflectivity thin-walled part. By synchronously controlling the acquisition frequency of the rotating platform and the line-scan camera, combining mirror refraction dark-field illumination technology and image processing algorithm, high-precision inner surface unwrapping image acquisition is realized. The method has the structural advantage of adapting to the automatic assembly line and is suitable for large-scale, high-precision industrial quality detection.

The invention discloses an optical fiber type dark field illumination system for a micron-sized variable area. The optical fiber type dark field illumination system is mainly used for forming high-brightness micron-sized variable area dark field illumination. The device is composed of a laser light source, a conical single-mode fiber, a three-dimensional precision displacement table and a microscopic imaging device. Firstly, a laser light source is coupled into a single-mode optical fiber with a conical output end, a high-purity single mode is formed, the output end face of the optical fiber obliquely irradiates a sample at a plurality of or more than ten wavelength magnitude distances through a three-dimensional fine tuning frame, and finally a micron-sized dark field illumination area is formed, so that the illumination intensity is improved, and redundant scattered light is avoided; and the signal-to-noise ratio of the weak scattering intensity is further improved. A complicated optical system of a traditional optical fiber illumination mode is omitted, and the size of an illumination area can be flexibly adjusted through the three-dimensional fine adjustment frame loaded with the optical fiber fixing device. The grinding optical fibers and the light sources in the structure can be flexibly changed, and the wavelength and intensity of illumination light can be changed by selecting different light sources and corresponding optical fibers.

A method and a system for inspecting the outer skin of an aircraft or a component thereof by scanning a surface of an outer skin of an aircraft with a line scan camera unit while the surface is illuminated with a first light field and with a second light field, and generating image data representing the surface while it is scanned. The image data is processed and defects of the surface and their characteristics and physical locations are automatically determined from the image data representing the surface during its illumination with the first light field and its illumination with the second light field. The defects, characteristics and physical locations are output. The first and second light fields may be formed as alternating bright field illumination and dark field illumination, or as light of a first color and light of a second color.

The application provides a defect detection device, which comprises an illumination module, a detection channel and an image processing module. The illumination module comprises an inclined dark-field illumination assembly configured to emit a first light beam, which is obliquely projected onto an object plane; the detection channel comprises a light collection assembly, a first detector and a second detector. The light collection assembly is used to collect scattered light generated after a to-be-detected object on the object plane is irradiated by the first light beam, and divide the scattered light of the first light beam into first light and second light with different propagation directions. The first detector is used to receive the first light and generate an in-focus image for showing a defect morphology. The second detector is used to receive the second light and generate an out-of-focus image for showing the defect morphology. The image processing module is used to compare the in-focus image and the out-of-focus image, and classify defects based on a comparison result. The defect detection device of the application can distinguish and classify convex and concave defects.

One variation of an optical inspection kit includes: an enclosure defining an imaging volume; an optical sensor adjacent the imaging volume and defining a field of view directed toward the imaging volume; a nest module defining a receptacle configured to locate a surface of interest on a first unit of a first part within the imaging volume at an image plane of the optical sensor; a dark-field lighting module adjacent and perpendicular to the nest module and including a dark-field light source configured to output light across a light plane and a directional light filter configured to pass light output by the dark-field light source normal to the light plane and to reject light output by the dark-field light source substantially nonparallel to the light plane; and a bright-field light source proximal the optical sensor and configured to output light toward the surface of interest.

A microscope is configured for brightfield and darkfield illumination using Kohler illumination. An illuminator provides a first radiation pattern that passes through the microscope's objective lens for brightfield illumination and provides at least one second radiation pattern that also passes through the objective lens for darkfield illumination.

The application relates to an illumination device, an illumination method and a semiconductor optical detection system. The illumination device comprises a light source, an optical assembly and an out-light module. The light source is configured to emit an illumination light beam in response to an illumination request. The optical assembly is located on a transmission path of the illumination light beam and is configured to convert the illumination light beam into a bright-field illumination light beam in a bright-field illumination mode and convert the illumination light beam into a dark-field illumination light beam in a dark-field illumination mode. The out-light module is located on an out-light side of the optical assembly and is configured to transmit the bright-field illumination light beam to a detection area in the bright-field illumination mode and transmit the dark-field illumination light beam to the detection area in the dark-field illumination mode. The application can realize high-precision and high-efficiency illumination mode switching.

The invention relates to the technical field of optical imaging, and discloses a dark field polarized light microscopic imaging device, which comprises a dark field illumination light source; the light beam shaping system is arranged behind the light path of the dark field illumination light source; the polarizer is arranged behind the light path of the light beam shaping system; the dark field illumination ring is arranged behind the light path of the polarizer; the microscope objective is used for collecting signal light from the sample; the dark field imaging ring is arranged in an imaging light path of the microscope objective; the polarization analyzer is arranged behind the light path of the dark field imaging ring; and an imaging camera. The device provided by the invention has the advantage of high-sensitivity detection of a nano-scale scatterer by a dark-field microscope, and also obtains the capability of identifying and analyzing a material by a polarizing microscope by utilizing polarization characteristics, so that the signal-to-noise ratio and contrast ratio of imaging built-in nano impurities or defects in a strong birefringence material are remarkably improved; the problem of background interference which cannot be overcome by a single technical means is solved.

Apparatus for inspecting two opposite edge sides of a transported planar object and use of the apparatus therefor An apparatus for inspecting two opposite, right and left edge sides (93, 94) of a transported planar object (90) with respect to a transport direction (101) is described, wherein surfaces of the left and right edge sides (93, 94) are oriented parallel to the transport direction (101). The apparatus (1) comprises a transport device (2) for moving the object (90) transported in the transport direction (101) with a support plate (21) and with a transport surface (31). For inspecting the right and left edge sides (93, 94) of the object (90), the apparatus (1) respectively comprises of an inspection device (5) with an imaging unit (50) comprising microscope optics (51) and with an illumination unit (52) comprising bright field illumination (53) and / or dark field illumination (54). The support plate (21) of the transport device (2) has at each imaging area (56) of the right and left inspection devices (5, 62, 63) a first recess (26) in the edge (22, 23) of the support plate (21). A use of the apparatus for inspection is also described.

Method for generating a high-contrast light-dark-field image in a microscope, comprising the following process steps: - Illuminating an object with light from a condenser in such a way that a beam of light penetrates the object in the manner of bright-field illumination, and a second beam of light, after passing through the object, is directed past the lens in the manner of dark-field illumination, - Merging the bright-field-dominated image created by bright-field illumination and the dark-field-dominated image created by scattered light in the manner of dark-field illumination in the plane of the intermediate image; - Generating a summation image by interfering with both superimposed light- and dark-field-dominated images in the intermediate image plane; - Viewing the superposition image thus created as a variable light-dark field image in a manner known per se using an eyepiece, wherein according to the method the illumination light is polarized by means of a polarizer and each light beam can be attenuated with respect to its intensity and thus its share in the summation image by means of an associated analyzer.

The invention discloses a microscope, and belongs to the technical field of illumination. The microscope comprises a light source module, a lens, a spectroscope and an objective lens, the light source module, the lens and the spectroscope are sequentially arranged, the objective lens is adjacent to the spectroscope, the light source module comprises a first light source and a second light source surrounding the first light source, and the objective lens is provided with a center channel and an edge channel located outside the center channel. Optical lenses are arranged in the annular channel and the edge channel, illumination modes of the microscope comprise a bright field illumination mode and a dark field illumination mode, the microscope is further provided with a sample bearing surface, and under the condition that the microscope is in the bright field illumination mode, only light emitted by the first light source enters the center channel after being transmitted by the lens and reflected by the spectroscope; the light is emitted to the sample bearing surface through the corresponding optical lens; when the microscope is in a dark field illumination mode, only the light emitted by the second light source enters the edge channel after being transmitted by the lens and reflected by the spectroscope, and is emitted to the sample bearing surface through the corresponding optical lens.

This utility model relates to the field of optical inspection technology and discloses an optical dark background device for inspecting the appearance of optical lenses. It includes a dark background device fixing bracket, a fixed reference surface fixedly connected to the upper surface of the bracket, an XY motion platform slidably connected to the upper surface of the reference surface, and a dark background device positioned below the XY motion platform. The dark background device includes a light-absorbing black cloth positioned below the XY motion platform and fixedly connected to the upper surface of the bracket. A lens carrier is fixedly connected to the upper surface of the XY motion platform, and the lens to be tested is fixedly connected to the upper surface of the lens carrier. A support frame is fixedly connected to the outer wall of the XY motion platform. In this utility model, by constructing the light source, the lens to be tested, and the acquisition camera in a coaxial arrangement, combined with the conical dark background device positioned below the lens, lens appearance inspection under dark illumination conditions is achieved.

The invention discloses an optical detection system, and the system comprises a bright field illumination assembly which is used for transmitting a bright field light source to a transmission assembly; the dark field illumination assembly is used for emitting a dark field light source to a measured object; the transmission assembly is used for reflecting the bright field light source emitted by the bright field illumination assembly to a measured object and reflecting reflected light generated by the measured object based on the bright field light source back to the bright field imaging assembly; scattered light generated by the measured object based on the dark field light source is reflected back to the dark field imaging assembly; the bright field imaging assembly is used for receiving the reflected light generated by the measured object based on the bright field light source and reflected by the transmission assembly, and collecting a bright field image based on the reflected light; and the dark field imaging assembly is used for receiving the scattered light generated by the measured object based on the dark field light source and reflected by the transmission assembly, and collecting a dark field image based on the scattered light. The optical detection system can be used for optical detection of bright field illumination and dark field illumination, and compatibility of optical detection can be improved so as to adapt to various application scenes of optical detection.

A method for surface inspection of a cured composite part comprising glass fibers and carbon fibers, in particular of an aircraft, by illuminating a surface of the composite part with infrared light from an IR-light source, and capturing an image of the surface. The IR-light source is arranged so generated infrared light hits the surface at a first angle α to provide a dark field illumination, and the camera is arranged to point at the surface at a second angle β to capture the image of the dark field illuminated surface. The captured image is evaluated with regard to brightness and contrast to detect one or more glass fiber layers on top of one or more carbon fiber layers within the composite part.

The dark field illumination device is used for illuminating a workpiece to be detected and comprises the annular off-axis even-order aspheric curved mirror and an annular light source set, the annular off-axis even-order aspheric curved mirror is provided with a reflecting surface, the annular light source set is located near the focal point of the reflecting surface, and the annular light source set is located near the focal point of the reflecting surface. Light emitted by the annular light source group is reflected by the reflecting surface and then forms an illuminating surface at the axis of the annular off-axis even-order aspheric curved mirror, and a workpiece to be detected is located on the illuminating surface. Collimated or converged high-quality light beams can be generated by utilizing the excellent optical characteristics of even aspheric surfaces, the imaging contrast ratio and the defect detection capability are remarkably improved, and light spot hot spots and dark areas in a traditional scheme are fundamentally eliminated by combining the annular light source with the optical design of rotational symmetry.

The application discloses an optical imaging system and device suitable for wafer defect detection of different types, and relates to the field of semiconductor detection. The system comprises a bright field imaging module and a dark field imaging module. The bright field imaging module is provided with a multi-spectrum bright field illumination path for bright field illumination and a bright field imaging path for bright field imaging. The dark field imaging module is provided with a dark field illumination path for dark field illumination and a dark field imaging path for dark field imaging. The bright field light source of the bright field imaging module comprises a fiber light source structure composed of multiple different colors and is connected to the light inlet of the multi-spectrum bright field illumination path. The dark field light source of the dark field imaging module comprises a switchable ring-shaped fiber light source and a laser light source. The application solves the problems that the current wafer defect detection system has few types of light sources to choose from and few types of distinguishable defects.

A lighting device for foreign object debris (FOD) detection is included. The lighting device includes a light source configured to emit light onto a surface, and a diffuser coupled to the light source and configured to cause the emitted light to impinge the surface in at least a partially planar pattern, so as to create a darkfield lighting effect with respect to the surface. The lighting device further includes a cylindrical rod including a first end portion and a second end portion, in which the first end portion is configured to couple to the light source and the diffuser and the second end portion is configured to be manually held by a user of the portable lighting device.

The utility model discloses a kind of calibration plate, for the calibration of semiconductor wafer defect detection equipment, including calibration plate base body and the calibration pattern group being set on calibration plate base body;Calibration pattern group includes first calibration pattern and second calibration pattern, first calibration pattern includes multiple interval settings stripe grating line, the line width of stripe grating line is equal with the line distance between adjacent stripe grating line;Second calibration pattern includes at least one first long straight line and at least three second short straight lines, first long straight line and second short straight line are mutually orthogonal, and the extension direction of stripe grating line is parallel with the extension direction of first long straight line.By the above structure, the calibration plate can be used for the evaluation of dark field illumination uniformity, and can be completed with line scanning camera posture and calibration plate azimuth angle debugging, reduce the repeated positioning error generated by replacing different calibration plate, improve the calibration efficiency and detection stability of wafer defect detection equipment.

A detection system and method for edge and ramp detection of a semiconductor structure using an optical system defining tangential imaging providing a backlight tangential illumination propagating along a tangential illumination path relative to a contour line of a contour region of the edge of the structure, and propagating substantially along a detection path of a tangential imaging sensor unit that detects at least a portion of the backlit tangential illumination and generates image data indicative of a tangential image of the contour line to enable detection of defect data of the edge; and at least a dark-field imaging device that directs the dark-field illumination along at least one dark-field illumination path towards the contour region and provides collection of scattering of the contour region's response to the dark-field illumination to enable detection of a dark-field image indicative of a location of a defect of the contour along the edge.