The application discloses a preparation method of a
silicon-based adapter plate heterogeneous integrated fan-out SiP packaging module, first, a
silicon-based TSV functional adapter plate of a thin film
resistor and a thin
film capacitor is prepared, passive devices and the
silicon-based adapter plate are integrated by oxidation,
deep reactive ion etching,
insulation layer deposition, seed layer
sputtering,
copper filling, CMP planarization, double-sided RDL and Ni / Au pad preparation; then, the heterogeneous bare
chip PAD is pretreated by
electroless nickel plating, ball planting and FC flip to complete the integration of the bare
chip and the adapter plate; subsequently,
epoxy resin is used for fan-out injection molding and
plastic packaging, and then a BGA
solder ball lead-out end is made at the bottom of the plastic
package body to obtain a finished product. The application integrates
passive resistance and
capacitance devices in the silicon-based adapter plate, saves an additional device
assembly process, improves the connection reliability of the heterogeneous bare
chip, realizes shell-free, lead-free and high-density fan-out packaging as a whole, effectively reduces the packaging cost, and can be widely applied to multi-chip
system-level integration scenes.