The invention discloses a flat polishing machine for wafer processing. The flat polishing machine structurally comprises a workbench, a polishing seat, a top plate and a button, the bottom of the polishing seat is embedded and fixed on the upper surface of the workbench, the top plate is arranged right above the workbench, and the button is embedded and fixed on the upper surface of the top plate.The flat polishing machine has the beneficial effects that a cut wafer is placed on the polishing seat, a rotating block is rotated to drive a screw rod to rotate, so that a polishing knife polishesthe flat of a wafer, an air exhauster is started to upwards suck burrs removed and discharged in the polishing process into a storage barrel, when the air exhauster stops working, a baffle is closed to prevent the burrs from falling out to influence the environment near the polishing machine, the air exhauster is started to drive a rotating rod to rotate, the rotating rod drives a polishing blockto rotate, so that a brush rubs with the surface of the wafer to remove the burrs on the plat of the wafer, polish and grind the burrs, meanwhile, the cut burrs are shoveled up by an inclined scraper,so that the burrs are sucked into an isolation cavity conveniently, and are prevented from splashing everywhere due to the fact that the polishing block throws out the burrs.