A
package substrate manufactured by electrolytically plating Au in a semi-additive manner without using any plating lead line on
wire bonding pads and
solder ball pads, and a method for manufacturing the
package substrate. The method includes the steps of forming a first
copper plated layer on a base substrate having through holes and inner surfaces of the through holes,
coating a first
resist over the first
copper plated layer, partially removing the first
resist, thereby exposing portions of the first
copper plated layer respectively corresponding to regions where circuit patterns are to be plated, forming a second copper plated layer on the exposed portions of the first copper plated layer, stripping the first
resist,
coating a second resist over the
resultant structure, and removing the second resist from regions where
wire bonding pads and
solder ball pads are to be formed, removing exposed portions of the first copper plated layer, forming the
wire bonding pads and the
solder ball pads, removing the second resist, removing exposed portions of the first copper plated layer, and
coating a solder resist over all surfaces of the
resultant structure, and removing portions of the solder resist respectively covering the wire bonding pads and the solder ball pads.