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63results about How to "Increase linear density" patented technology

Package substrate for electrolytic leadless plating and manufacturing method thereof

Disclosed is a package substrate for electrolytic leadless plating, characterized in that a wire bonding pad onto which a semiconductor chip is mounted is subjected to electrolytic leadless Au plating, and a solder ball pad is subjected to OSP metal finishing or electroless Au plating without use of plating lead lines, upon preparation thereof. A method of manufacturing the package substrate is also disclosed. The method includes Cu plating a whole surface of a base substrate having through-holes, developing a first dry film laminated onto the through-holes, removing a copper foil not covered with the first dry film, stripping the first dry film, exposing and developing a second dry film on the substrate so that only an upper portion to be subjected to electrolytic Au plating is exposed, grounding an electrolytic Au plating terminal to a solder ball pad, Ni—Au plating the wire bonding pad, removing the second dry film by a stripping solution, exposing and developing a third dry film, removing the exposed copper foil by an etching solution, removing the third dry film by a stripping solution, performing a series of processes of coating, exposing, developing and drying a solder resist, and subjecting the solder ball pad to OSP metal finishing.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

A package substrate manufactured by electrolytically plating Au in a semi-additive manner without using any plating lead line on wire bonding pads and solder ball pads, and a method for manufacturing the package substrate. The method includes the steps of forming a first copper plated layer on a base substrate having through holes and inner surfaces of the through holes, coating a first resist over the first copper plated layer, partially removing the first resist, thereby exposing portions of the first copper plated layer respectively corresponding to regions where circuit patterns are to be plated, forming a second copper plated layer on the exposed portions of the first copper plated layer, stripping the first resist, coating a second resist over the resultant structure, and removing the second resist from regions where wire bonding pads and solder ball pads are to be formed, removing exposed portions of the first copper plated layer, forming the wire bonding pads and the solder ball pads, removing the second resist, removing exposed portions of the first copper plated layer, and coating a solder resist over all surfaces of the resultant structure, and removing portions of the solder resist respectively covering the wire bonding pads and the solder ball pads.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate. The method includes the steps of laminating first dry films over upper and lower surfaces of a base substrate having via holes while being formed at its upper and lower surfaces with copper foils, and patterning the first dry films to expose predetermined surface portions of the base substrate, removing portions of the copper foils not covered by the first dry films to form circuits, stripping the first dry films, and forming a plated layer over the base substrate, laminating second dry films over the plated surfaces of the base substrate, and patterning the second dry films to expose portions of the plated surfaces of the base substrate corresponding to regions where Au is to be plated, removing the plated layer from the exposed surface portions of the base substrate corresponding to the Au plating regions, plating Au on the exposed surface portions of the base substrate, stripping the second dry films, and removing the remaining plated layer to expose the circuits, and coating a solder resist on the exposed circuits while exposing predetermined portions of the circuits.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD

Single-spindle controllable condensed spinning device and condensing method

The invention provides a single-spindle controllable condensed spinning device and a condensing method. A hollow structure large roller is adopted as a front roller, a circular closed hollow air suction insert is arranged between the hollow structure of the roller and a roller shaft, the air suction insert is embedded in an inner wall slide of the hollow structure of the roller by a roller drivenby a motor, an air suction groove is formed in the circular surface, adjacent to the inner wall of the hollow structure of the roller, of the air suction insert, the left side surface or the right side surface of the air suction insert is connected with a branch pipe through a closed bearing in a communication manner, and the branch pipes of two adjacent spindles are connected with a middle pipe in a communication manner. During use, the motor drives the air suction insert to rotate around the inner wall of the hollow structure of the roller, so that relative rotation between the air suction groove and the roller is realized, the time when the air suction groove is located right below the inner wall of the hollow structure of the roller and the relative position are controllable, controllable condensing of single spindle is realized, and random controllability of style characteristics of yarn surfaces under different condensing actions is realized.
Owner:合肥经新科技有限公司
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