A 
package substrate manufactured by electrolytically plating Au in a semi-additive manner without using any plating lead line on 
wire bonding pads and 
solder ball pads, and a method for manufacturing the 
package substrate. The method includes the steps of forming a first 
copper plated layer on a base substrate having through holes and inner surfaces of the through holes, 
coating a first 
resist over the first 
copper plated layer, partially removing the first 
resist, thereby exposing portions of the first 
copper plated layer respectively corresponding to regions where circuit patterns are to be plated, forming a second copper plated layer on the exposed portions of the first copper plated layer, stripping the first 
resist, 
coating a second resist over the 
resultant structure, and removing the second resist from regions where 
wire bonding pads and 
solder ball pads are to be formed, removing exposed portions of the first copper plated layer, forming the 
wire bonding pads and the 
solder ball pads, removing the second resist, removing exposed portions of the first copper plated layer, and 
coating a solder resist over all surfaces of the 
resultant structure, and removing portions of the solder resist respectively covering the wire bonding pads and the solder ball pads.