63results about How to "Increase linear density" patented technology

A recording medium which has a zone or zones storing lookup tables comprising an edge shift value of leading and trailing recording pulses.

Disclosed is a package substrate for electrolytic leadless plating, characterized in that a wire bonding pad onto which a semiconductor chip is mounted is subjected to electrolytic leadless Au plating, and a solder ball pad is subjected to OSP metal finishing or electroless Au plating without use of plating lead lines, upon preparation thereof. A method of manufacturing the package substrate is also disclosed. The method includes Cu plating a whole surface of a base substrate having through-holes, developing a first dry film laminated onto the through-holes, removing a copper foil not covered with the first dry film, stripping the first dry film, exposing and developing a second dry film on the substrate so that only an upper portion to be subjected to electrolytic Au plating is exposed, grounding an electrolytic Au plating terminal to a solder ball pad, Ni—Au plating the wire bonding pad, removing the second dry film by a stripping solution, exposing and developing a third dry film, removing the exposed copper foil by an etching solution, removing the third dry film by a stripping solution, performing a series of processes of coating, exposing, developing and drying a solder resist, and subjecting the solder ball pad to OSP metal finishing.

An information recording method using an optical recording medium includes the steps of forming a plurality of recording pulses to irradiate the optical recording medium and recording information to the optical recording medium by irradiating the recording pulses on the optical recording medium. At least a leading edge of a first recording pulse and a trailing edge of a last recording pulse of the recording pulses shift at a shifting value, wherein the shifting value is determined by combinations of a length of M(n) of a mark being currently written and at least one of a length s(n−1) of a space precedent to the mark and a length s(n+1) of a space subsequent to the mark.

An information recording apparatus using an optical recording medium includes a light source to irradiate a light beam to the optical recording medium and a pulse former for forming a plurality of recording pulses of the light beam. A leading edge of a first recording pulse of the recording pulses shifts at a shifting value, and the shifting value is determined by a combination of a length of M(n) of a mark being currently written and a length s(n−1) of a space precedent to the mark.

Several embodiments of a sense current perpendicular to the planes of the sensor (CPP) and flux guide type of read head has a gap between first and second shield layers at an air bearing surface (ABS) where the flux guide is located which is less than a gap between the first and second shield layers at a recessed location where the sensor is located. This reduced gap increases the linear bit density capability of the read head. A longitudinal bias stack (LBS) is located in the sensor stack. Several unique methods of construction are described for forming the magnetic head assemblies.

A TAMR (Thermal Assisted Magnetic Recording) write head uses the energy of optical-laser excited surface plasmons in a plasmon generator to locally heat a magnetic recording medium and reduce its coercivity and magnetic anisotropy. The optical radiation is transmitted to the plasmon generator by means of a waveguide, whose optical axis (centerline) is tilted relative to either or both the backside surface normal and ABS surface normal in order to eliminate back reflections of the optical radiation that can adversely affect the properties and performance of the laser. Variations of the disclosure include tilting the plasmon generator, the waveguide and the laser diode.

An electro-optical device includes a substrate having a display region; and an extending region extending from the display region. The extending region is provided with wiring lines, and at least some wiring lines, which are disposed to be adjacent to each other, are correspondingly disposed in a plurality of different layers.

A package substrate of, for example, a BGA type or a CSP type, manufactured by carrying out an electrolytic Au plating process without using any plating lead line for formation of bond fingers and solder ball pads, and a method for manufacturing the package substrate. The method includes the steps of laminating first dry films over upper and lower surfaces of a base substrate having via holes while being formed at its upper and lower surfaces with copper foils, and patterning the first dry films to expose predetermined surface portions of the base substrate, removing portions of the copper foils not covered by the first dry films to form circuits, stripping the first dry films, and forming a plated layer over the base substrate, laminating second dry films over the plated surfaces of the base substrate, and patterning the second dry films to expose portions of the plated surfaces of the base substrate corresponding to regions where Au is to be plated, removing the plated layer from the exposed surface portions of the base substrate corresponding to the Au plating regions, plating Au on the exposed surface portions of the base substrate, stripping the second dry films, and removing the remaining plated layer to expose the circuits, and coating a solder resist on the exposed circuits while exposing predetermined portions of the circuits.

An optical disk recording apparatus operates on an optical disk having circular tracks which are provisionally written with an index signal used for securing a constant linear velocity of the optical disk from an innermost circular track to an outermost circular track, and records data along the circular tracks at different linear densities on different annular zones of the optical disk. In the apparatus, a disk drive section rotates the optical disk while synchronizing the index signal successively read from the rotated optical disk with a predetermined reference clock signal to thereby maintain the constant linear velocity of the circular tracks. A clock generating section multiples or divides the reference clock signal by different rates to generate different writing clock signals in correspondence to the different annular zones of the optical disk. A data recording section operates in synchronization to the different writing clock signals for recording data along the circular tracks at the different linear densities on the different annular zones.

A method of manufacturing a package substrate includes forming a first copper plated layer on a base substrate having through holes and inner surfaces of the through hole, coating a first resist over the first copper plated layer, partially removing the first resist, forming a second copper plated layer on the first copper plated layer, stripping the first resist, coating a second resist over the resultant structure, and removing the second resist from regions where wire bonding pads and solder ball pads are to be formed, removing exposed portions of the first copper plated layer, forming the wire bonding pads and the solder ball pads, removing the second resist, removing exposed portions of the first copper plated layer, and coating a solder resist over all surfaces of the resultant structure, and removing portions of the solder resist respectively covering the wire bonding pads and the solder ball pads.

A vertical slot scanner generates a full coverage scan pattern for reading symbols presented or moved past a vertical window. Scan lines are generated in upper and lower central regions of the window to improve scanner productivity.

With respect to an X coordinate shifted by a second length from an X coordinate of a reference nozzle of a first head, an X coordinate of a reference nozzle of a second head is further shifted by a length ½ times shorter than a first length. Further, with respect to an X coordinate shifted by the second length from an X coordinate of a reference nozzle of a third head, an X coordinate of a reference nozzle of a fourth head is further shifted by a length ½ times shorter than the first length. In addition, with respect to an X coordinate shifted by the second length from the X coordinate of the reference nozzle of the second head, the X coordinate of the reference nozzle of the third head is shifted by a length ¼ times or ¾ times shorter than the first length. The first length is a nozzle pitch of the head in an X-axis direction. The second length is a product of the first length and ¼ times of the number of the nozzles of the head.