The invention discloses a method of raising ormosia seedlings by cutting. The method includes the steps of preparing cutting beds, to be specific, building the cutting beds in a greenhouse, providing each cutting bed with a plastic shed, mixing well fresh yellow soil, fine sand and nutrient soil proportionally to obtain cutting substrate, spreading the cutting substrate on the cutting beds, and sterilizing the cutting beds with potassium permanganate before cuttage; collecting cuttings, to be specific, using shoots which grow robust, are free of disease and pest damage and are already lignified, as cuttings, cutting flat the upper end of each stem, and cutting a 45-degree slope at the lower end of each stem; treating the cuttings, to be specific, soaking lower end cuts of the cuttings into composite rooting agent solution, and treating the shoots with sterilizing liquid for standby; performing cuttage, to be specific, inserting the cuttings into the cutting substrate, making sure the lower ends of the cuttings are in tight contact with the cutting substrate, and performing full irrigation; performing post-cuttage management, to be specific, keeping the interior of bow film at 20 DEG C to 28 DEG C under the humidity of 85% to 90% to make sure the cuttings and their leaves are glossy. The method has the advantages that rooting time is short, rooting rate is high, survival rate of seedlings is high and the method is suitable for popularization and application in production practice.