The invention relates to a high temperature characteristic test method and a device for a semiconductor device heated by current. When the circuit formed when a power supply and a to-be-tested semiconductor device are electrically connected is conducted, conduction current exists in the to-be-tested semiconductor device, loss of the semiconductor device itself can be used to heat a semiconductor chip, and the heating speed is quick; during the heating process, a TSP parameter of the semiconductor device is monitored timely, the TSP parameter is used to calculate the junction temperature of the to-be-tested semiconductor device, once the junction temperature is enough close to the test target temperature Tj-test, the high temperature characteristic test system is used to realize a high temperature characteristic test on the to-be-tested semiconductor device. The time consumed for test is little, the efficiency is high, and the method and the device are extremely suitable for test on a large number of samples; the test precision is high; and no scalding possibility exists during the operation process, and the test safety is improved.