The present invention discloses a glue curing monitoring method based on
optical path difference change, which belongs to the field of glue curing monitoring, including: configuring a test scheme, establishing a test environment, and configuring environmental characteristics; placing a
test sample in the configured test environment, and performing sample timing monitoring, and establishing a curing
timing data set; establishing and updating phase data, and establishing timing curing data of the cured glue; establishing a predictive fitting model, and performing a fitting test, and establishing a fitting test result; judging whether the fitting test result meets a preset test threshold, and when it meets, completing the glue curing monitoring of the cured glue through the predictive fitting model. The present application solves the technical problem that the contact monitoring used in the existing glue curing monitoring requires
puncturing the
colloid, resulting in damage to the
colloid, and achieves the technical effect of establishing a predictive fitting model through non-contact multi-point monitoring of the
spectrometer and phase
data analysis, thereby performing glue curing monitoring and realizing non-destructive monitoring of the glue curing process.