The invention relates to a fan-out packaging structure and its production process, which is characterized in that: it includes a core board, a
chip is arranged in a groove on the core board, a pad is provided on the front side of the
chip, and bumps are arranged on the pad; The board, the
chip, and the
dielectric material on the front and back of the chip are pressed together, the pads and bumps on the front of the chip are embedded in the
dielectric material, and the gap between the chip and the tank is filled with the
dielectric material; the dielectric material on the back of the chip A
metal layer is provided on the outer surface, a solder
resist layer is provided on the outer surface of the dielectric material on the front of the chip, an RDL circuit layer is arranged in the solder
resist layer, and BGA balls are arranged on the pads of the RDL circuit layer; the dielectric material on the front of the chip The material is provided with
laser blind holes, which are filled with electroplated
metal, and the RDL circuit layer is interconnected with the bumps on the front of the chip through the electroplated
metal in the
laser blind holes. The invention eliminates the restrictive condition of the active chip embedded in the organic substrate, improves the
yield rate of device packaging, and reduces the cost of fan-out packaging.