The utility model discloses a
chip adsorption device which comprises an adsorption base, an air guide
pipe is installed at the top end of the adsorption base in a threaded mode, a main suction cup and an auxiliary suction cup are installed at the bottom end of a main
air channel and the bottom end of an auxiliary
air channel respectively, a base plate is fixedly installed at the bottom of the outer side wall of the adsorption base, and a vertical
threaded rod is installed in a hole formed in the base plate in a penetrating mode. A bottom plate is fixed to the bottom end of the vertical
threaded rod, a protective pad is installed on the bottom face of the bottom plate, the top end of the vertical
threaded rod penetrates through a hole formed in the movable plate, a blocking plate is fixed to the middle of the vertical threaded rod, a buffer spring is fixed to the top face of the blocking plate, and the top end of the buffer spring is fixed to the bottom face of the movable plate. According to the
chip adsorption device, the novel structural design is adopted, chips of different sizes can be stably adsorbed, the chips moving upwards due to air pressure can be buffered and protected, meanwhile, the resistance of the buffering structure can be conveniently and rapidly adjusted, and the chips of different specifications can be stably adsorbed and transferred conveniently.