2results about How to "Reduce system noise" patented technology

This invention provides a tunable on-chip frequency conversion system, comprising: a first laser for generating laser light of a first wavelength; a second laser for generating laser light of a second wavelength; an adjustable laser array, including at least one third laser for generating laser light of a third wavelength; a first photodetector for beating the first combined beam to obtain a fixed local oscillator signal; a second photodetector for beating the second combined beam to obtain an adjustable local oscillator signal; an electro-combiner for mixing the signal to be converted with the fixed local oscillator signal to obtain a mixed signal; an electro-optic modulator for modulating the third split beam, the mixed signal, and the adjustable local oscillator signal to form an optical carrier signal; and a third photodetector for beating the optical carrier signal to obtain a converted signal. This system employs double-conversion technology to achieve high-quality signal conversion, has tunability advantages, and can be widely applied in fields such as microwave photonic signal processing.

The application discloses a power module, comprising: a first half-bridge power unit, a second half-bridge power unit and a third half-bridge power unit, the first half-bridge power unit, the second half-bridge power unit and the third half-bridge power unit are located on the same substrate, the first half-bridge power unit, the second half-bridge power unit and the third half-bridge power unit are sealed in the same power module to form a three-phase full-bridge power unit, each half-bridge power unit further comprises a power terminal, the power terminal comprises a direct current positive terminal, a direct current negative terminal and an alternating current terminal, a first surface of the power module is parallel to the substrate, the power module comprises opposite first and second sides and opposite third and fourth sides, the first side is perpendicular to the third side, the direct current positive terminal is led out from the first surface of the power module, the physical size between multiple substrates is reduced, the power density of the power module is improved, the power path of the power module is reduced, and higher power output and energy efficiency are obtained.