The invention belongs to the technical field of printed circuit boards, and particularly relates to a sandwich aluminum-based printed circuit board laminating method which comprises the following steps: S1, after an aluminum substrate is fixed on a clamp, performing drilling on the aluminum substrate to obtain a through hole; S2, on the basis of the step S1, immersing the aluminum substrate in DI water at the temperature of 50-60 DEG C for ultrasonic cleaning, after cleaning is completed and drying is conducted, attaching prepregs to the upper surface and the lower surface of the aluminum substrate respectively, and then covering the surfaces of the prepregs with a layer of copper foil; S3, on the basis of the step S3, feeding the aluminum substrate into a laminating machine, and laminating the aluminum substrate to obtain a semi-finished circuit board; S4, on the basis of the step S3, conducting drilling again at the position of the through hole in the aluminum substrate, obtaining a working hole, and conducting metallization treatment on the inner wall of the working hole. The prepared circuit board is low in production cost and good in performance and stability.