The application relates to the technical field of
waste gas purification, and relates to a
semiconductor production
waste gas treatment process, which comprises the following steps: pretreatment, introducing an object into a preposition mechanism to participate in preposition dust removal treatment; air mixing treatment, introducing the object output by the preposition mechanism into an air mixing mechanism to participate in slow flow
speed reduction treatment; purification treatment, introducing the object output by the air mixing mechanism into a purification mechanism to participate in
plasma combustion purification treatment; cooling treatment, introducing the object output by the purification treatment into a cooling mechanism to participate in cooling treatment; and
discharge treatment, discharging the object output by the cooling mechanism through an external
discharge mechanism. The application is favorable for solving the problems that some existing
plasma purification equipment has difficulty in removing impurities and the purification effect is affected by the change of air flow when treating
waste gas.