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4results about How to "High process flexibility" patented technology

Pneumatic vibration main shaft for circuit board machining and circuit board drilling method

The invention relates to the technical field of circuit board processing, in particular to a pneumatic vibration main shaft for circuit board processing and a circuit board drilling method. The main shaft comprises a main shaft shell, a floating rotating shaft and a pneumatic vibration assembly. The pneumatic vibration assembly is provided with a first air pressure cavity and a second air pressure cavity which are oppositely arranged in the axial direction of the floating rotating shaft, and a first air path and a second air path which are communicated with the two cavities and can independently control air pressure. By controlling the air pressure of the two air paths, a controlled air pressure difference is formed between the two cavities, so that the floating rotating shaft is driven to generate axial reciprocating vibration. Axial micro-vibration of the drill point is achieved through the pure pneumatic principle, chip removal in the drilling process is effectively promoted, the hole wall quality and the drilling precision are improved, and the system is simple in structure and high in anti-interference capacity.
Owner:NANJING TALIANG TECH CO LTD

Intelligent controllable variable-diameter venturi system capable of three-phase foam foaming

The application discloses an intelligent controllable variable-diameter Venturi tube system which can be used for three-phase foam foaming, and relates to the technical field of fluid mixing and foaming equipment. The system comprises an elastic Venturi tube module, a variable-diameter execution module, a working condition sensing module and an intelligent control module. The throat is composed of an elastic tubular body which can be elastically deformed in the radial direction. The variable-diameter execution module is arranged outside the throat and is used for applying a controllable radial force to the elastic tubular body to adjust the inner diameter of the throat. The working condition sensing module is used for monitoring the slurry flow, pressure and foam quality parameters in real time. The intelligent control module performs closed-loop control on the variable-diameter execution module according to the sensing data, so that the inner diameter of the throat is adjusted to be within a preset target pressure difference range. The application can adjust the throat diameter in real time according to different working conditions, optimizes the mixing effect of gas, liquid and solid three phases, and improves the foaming stability and working condition adaptability.
Owner:GUIZHOU UNIV

Method for manufacturing soi material and soi wafer

ActiveCN121772710Bavoid damagesmooth interfaceWaferIon implantation
The application belongs to the technical field of semiconductor processing and manufacturing, and provides a preparation method of SOI material and SOI wafer, which comprises sequentially preparing an aluminum nitride layer, an aluminum oxide layer and a top layer of silicon on a first substrate to obtain a first bonding body; providing a support substrate provided with a buried oxygen layer as a second bonding body, and bonding the first bonding body and the second bonding body to obtain a bonding structure; and then sequentially removing the first substrate, the aluminum nitride layer and the aluminum oxide layer in the bonding structure to expose the top layer of silicon and obtain the SOI material. The ion implantation process is replaced and omitted by the combination of epitaxial growth, bonding and removal processes, so that the performance problems caused by the introduction of various defects can be avoided, the accurate control of the thickness of the top layer of silicon and the quality of the buried oxygen layer can be facilitated, the complexity of the process and the process cost can be reduced, and the application is particularly suitable for the batch production of 300mm and above large-size SOI wafers.
Owner:TJ INNOVATIVE SEMICON SUBSTRATE TECH CO LTD

Busbar multi-material resistance welding process and gradient current sharing electrode structure

PendingCN122583700Aimproved current distributionNo bumps
The application discloses a bus multi-material resistance welding process and a gradient current-distribution electrode structure and belongs to the technical field of resistance welding.The application integrates an electrode quick-change mechanism in a single welding station, can automatically switch a chromium-zirconium-copper inlaid tungsten-copper electrode and a graphite electrode, respectively completes two types of welding procedures of copper braided wire-copper plate and copper plate-L-shaped copper bent plate, adopts a gradient current-distribution electrode with a waist-shaped through groove on a working surface in a matched mode, realizes uniform distribution of current in a large-area welding area with a size of 21*15 mm or above, simultaneously constructs a full-process automatic production line of "welding-air knife cleaning-CCD visual detection-automatic sorting", and effectively solves problems of uneven welding current of large-area copper workpieces, low electrode change efficiency, easy interference of detection by cooling water and the like, electrode switching time is less than or equal to 5 s, the welding point drawing force is stable, the bus welding full-process unmanned operation can be realized, and production efficiency and product consistency are greatly improved.
Owner:XIAMEN BEOGOLD TECH CO LTD