31results about How to "High process flexibility" patented technology

The invention provides a three-coordinate galvanometer scanning laser processing head, which comprises an XY two-axis laser galvanometer system, a clamping mechanism, a Z-axis moving mechanism, a laser displacement sensor and a control system, wherein the Z-axis moving mechanism comprises a fixed part and a moving part, and the clamping mechanism is fixedly mounted on the fixed part of the Z-axis moving mechanism; and the XY two-axis laser galvanometer system and the laser displacement sensor are fixedly mounted on the moving part of the Z-axis moving mechanism, and the laser displacement sensor, the Z-axis moving mechanism and the XY two-axis laser galvanometer system are all electrically connected with the control system. The laser processing head has the function of dynamic focal length setting, and has an independent and compact structure; the laser processing head has the broach interface design of a standard numerically-controlled machine tool, which enables the laser processing head to be easily assembled for processing with commercialized multi-axis synchronous numerically-controlled machine tools of a three-axis type, a five-axis type, and the like; and technological flexibility is greatly enhanced, and a conventional multi-axis synchronous numerically-controlled machine tool can be conveniently changed into a galvanometer scanning laser processing machine tool with compatible functions, thereby the three-coordinate galvanometer scanning laser processing head has important practical value.

The invention relates to a method for forming a fuel cell metal bipolar plate. The invention aims at the problems of a conventional plastic deformation means (such as a punching forming means) for forming a metal sheet that a raised mould and a concave mould are difficult to match with each other and a driving sheet cannot be reused in a process of electromagnetically forming a metal bipolar plate. The device is characterized in that a forming mould, a flexible mould, a driving plate, a support frame and an upper fixing plate are stacked on a lower fixing plate from bottom to top, wherein a coil is arranged in a groove on a lower end face of the support frame; two adjacent circles of leads are separated by high-pressure isolating material; high-pressure high-strength isolating materials are filled between the groove and the coil and on the surface of the coil, thereby forming a flat coil; two ends of the coil are serially connected to a capacitor bank; and the upper fixing plate and the lower fixing plate are fixedly connected through a fastening bolt. The method comprises the following steps: placing a plate blank on the forming mould and fastening the upper fixing plate and the lower fixing plate; and performing discharging forming; and taking out a formed piece, thereby acquiring the metal bipolar plate. The device and the method provided by the invention are used for forming the fuel cell metal bipolar plate.

The invention provides a preparation method of a printed circuit board. The method includes the following steps of: S1, copper foil arrangement: copper foil is arranged on a carrier in a manner that the copper foil is aligned with the carrier, and the copper foil and the carrier are composited; S2, laser cutting: laser cutting is performed on the pattern of the circuit diagram of a circuit board;S3, selective peeling: an aluminum substrate is coated with photoresist, and a mask with a circuit diagram is arranged on the aluminum substrate, and the aluminum substrate is selectively exposed according to the pattern of the circuit diagram, so that the non-circuit portion of the circuit diagram loses viscosity; and S4, printed circuit board preparation: the copper foil arranged on the carrieris aligned with the aluminum substrate, so that the circuit diagrams of the copper foil and the aluminum substrate are completely overlapped with each other, and the copper foil of a circuit portion is completely bonded to the aluminum substrate, and the copper foil of a non-circuit portion is peeled off. According to the preparation method of the invention, the circuit board is inscribed by a laser cutting method, so that chemical etching can be avoided in a production process; and waste copper can be directly recycled, and therefore, a great environmental protection value can be realized with cost reduced. With the method adopted, a new idea is provided for the production of copper foil for circuit board.

The invention provides a dual-core concurrent universal swing mechanism which comprises a first drive unit, a second drive unit, a rotating arm, a clamping device and a medium channel, wherein the output end of the first drive unit is connected with the rotating arm; the clamping device is mounted on the rotating arm and is linked with the rotating arm; the output end of the second drive unit is connected with the clamping device; the clamping device is used for clamping a cutting head; and the medium channel is used for feeding a working medium into the cutting head. According to the invention, corner and arc errors and cutting conicity errors caused by different fluid states of a high energy beam at an entrance point and an exit point can be eliminated. Meanwhile, the medium channel composed of at least four rotating joints forms a rigidly connected four-link mechanism, and the four-link mechanism can be matched with the random swing of the cutting head to realize the transmission of the high energy beam medium. Due to the absence of a vertical rotating axis or an approximately vertical rotating axis, in the process of continuous circumferential conical cutting, the cutting head can not rotate around the self axis, thereby avoiding the problem that a pipeline connected with the cutting head is wound around a cable.

The invention discloses an intelligent plastic forming process method and intelligent plastic forming equipment used for the same. The process method sequentially comprises the steps that three-dimensional modeling and plastic deformation digital simulation are conducted, an automatic programming system with a machine learning function is adopted for completing analysis and programming of the forming step of a forge piece, a steel ingot is heated, closed-die upsetting is conducted on the steel ingot, and plastic forging forming is conducted by squeezing a blank on an intelligent plastic forming hydraulic machine through rolling tools. According to the equipment, intelligent manipulators installed on the intelligent plastic forming hydraulic machine drive intelligent pressing heads to rotate around the axes in the horizontal direction or the vertical direction, and wedging angles larger than zero degree are formed by the squeezing surfaces of the rolling tools on the intelligent pressing heads and the surface of the forge piece; a supporting device can drive the forge piece to rotate and move; a sensing system can obtain data of the temperature of the forge piece, the pressure of the rolling tools on the forge piece and the forge piece metal flowing displacement and send the data to a control system; the control system controls actions of all components. According to the intelligent plastic forming process method and the intelligent plastic forming equipment used for the same, the forging precision is high, materials are saved, no special molds are needed, the forging flexibility is high, and the cost is low.

The invention provides a method for manufacturing a three-dimensional minitype die; patterns corresponding to each layer structure of the parts to be manufactured are respectively etched on each silicon wafer; H2SO4 with the weight percentage of 98% and H2O2 with the weight percentage of 98% are mixed by the volume ratio of 2-4:1; the mixed solution is then used for cleaning all silicon wafers; the silicon wafers are then activated and dried; the silicon wafers are then rapidly aligned and bonded by layer; finally, the three-dimensional die cavity is gained by the annealing disposal. The method of the invention can manufacture the three-dimensional minitype die with micron meter dimension, has the advantages of high precision, low cost and large flexibility and is applicable to the processing and manufacture of micro electro-mechanical system device dies such as micro-gear shafts, micro-step shafts and high depth-width-ratio three-dimensional minitype structure, etc.