A
solvent-free composition is prepared, which is a composition comprising a
polyol component (A) and a polyisocyanate component (B), wherein the
polyol component (A) is composed of a low-molecular-weight
polyol (A1) with a molecular weight of 350 or less. The
viscosity of the aforementioned low-molecular polyol (A1) may be 500 mPa·s or less at 25°C. The aforementioned low-molecular polyol (A1) may be, for example, C2-6 alkylene glycol or the like. In addition, the polyol component (A) may be composed of a low-molecular polyol (A1) and a
polymer polyol (A2) as a
diluent. The aforementioned polyisocyanate component (B) may be a modified product or a derivative of polyisocyanate (for example, a multimer of diisocyanate, etc.). The aforementioned
solvent-free composition may further contain an
epoxy group-containing compound (aliphatic
diol glycidyl ether, aliphatic polyhydric
alcohol glycidyl ether having a hydroxyl group, etc.) (C) that may have a hydroxyl group. Such a
solvent-free composition has a small load on the environment, has excellent
coating film properties, and has high application efficiency.