A 
solvent-free composition is prepared, which is a composition comprising a 
polyol component (A) and a polyisocyanate component (B), wherein the 
polyol component (A) is composed of a low-molecular-weight 
polyol (A1) with a molecular weight of 350 or less.  The 
viscosity of the aforementioned low-molecular polyol (A1) may be 500 mPa·s or less at 25°C.  The aforementioned low-molecular polyol (A1) may be, for example, C2-6 alkylene glycol or the like.  In addition, the polyol component (A) may be composed of a low-molecular polyol (A1) and a 
polymer polyol (A2) as a 
diluent.  The aforementioned polyisocyanate component (B) may be a modified product or a derivative of polyisocyanate (for example, a multimer of diisocyanate, etc.).  The aforementioned 
solvent-free composition may further contain an 
epoxy group-containing compound (aliphatic 
diol glycidyl ether, aliphatic polyhydric 
alcohol glycidyl ether having a hydroxyl group, etc.) (C) that may have a hydroxyl group.  Such a 
solvent-free composition has a small load on the environment, has excellent 
coating film properties, and has high application efficiency.