The invention relates to the technical field of electronic and electrical
welding, and discloses a method for enhancing the strength of an IMC layer of a
welding spot in low-temperature
welding and application. The method for enhancing the strength of the welding spot IMC layer in low-temperature welding comprises the following steps that S1, an
electrode plating layer is prepared, specifically, the
electrode plating layer is prepared on a
copper base body
electrode in a component welding area; s2, solder is applied, specifically, low-temperature solder is applied to the surface of the electrode plating layer; s3, welding: melting the low-temperature welding flux, and carrying out metallurgical reaction on the low-temperature welding flux, the electrode plating layer and the
copper matrix electrode below the electrode plating layer, so as to form an IMC layer on a welding spot interface; according to the method, a traditional
nickel-
tin plating structure in the electrical /
electronic industry is abandoned, the pure
tin plating layer is directly prepared on the
copper electrode, the thickness and the
bonding strength of the welding spot IMC layer are effectively improved, the production cost is reduced, and the process compatibility is good.