This invention relates to the field of
phased array radar antenna technology, and more particularly to a highly integrated, miniaturized, high-power, high-efficiency
delay microwave T / R
assembly. The
assembly includes a housing and a PCB (
Printed Circuit Board) for functional integration. The PCB is located on the lower left side of the housing, housing a multi-functional MMIC (Multi-
Microelectronics Microcontroller)
chip manufactured using MCM (Multi-
Chip Module) technology. The multi-functional MMIC
chip is located on one side of the PCB, and a wave control
chip is located on the other side. The technical solution involves using an SMP (Surface
Mount Multi-Fold) button
RF connector, where the button and circuit board are softly interconnected inside the
assembly.
Microwave signals within the circuit board are transmitted via vias, resulting in
high input / output isolation and preventing loop self-oscillation. This soft-contact
interconnection between the button and the circuit board significantly improves the manufacturability of the assembly.