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106results about How to "Configuration is complicated" patented technology

Substrate processing apparatus, substrate processing method, computer program, and storage medium

A substrate processing apparatus is provided, which can place a substrate in a correct position, even though a positional error occurs between the substrate carried in a processing vessel and a placing table. This substrate processing apparatus can take a necessary action immediately against a positional error of the substrate generated when the substrate is separated from the placing table after completion of a process. The plasma apparatus 1 includes a processing vessel 11, lifting pins 34 provided in the processing vessel 11, and a detecting head 22. A wafer W is carried into the processing vessel 11 from the exterior of the processing vessel 11 by using a carrying apparatus 6, and is stopped in a transferring position above the lifting pins 34. Thereafter, the detecting head 22 is moved from an evacuation position to a detection position, so as to obtain positional error information between a current position in which the wafer W is currently held and a programmed position in which the transfer of the wafer W is to be carried out. Based on the positional error information, the transferring position of the wafer W is corrected by using the carrying apparatus 6, such that an amount of the positional error between the current position W and the programmed position is within an allowable range.
Owner:TOKYO ELECTRON LTD

Substrate processing apparatus, substrate processing method, computer program, and storage medium

A substrate processing apparatus is provided, which can place a substrate in a correct position, even though a positioinal error occurs between the substrate carried in a processing vessel and a placing table. This substrate processing apparatus can take a necessary action immediately against a positioinal error of the substrate generated when the substrate is separated from the placing table after completion of a process. The plasma apparatus 1 includes a processing vessel 11, lifting pins 34 provided in the processing vessel 11, and a detecting head 22. A wafer W is carried into the processing vessel 11 from the exterior of the processing vessel 11 by using a carrying apparatus 6, and is stopped in a transferring position above the lifting pins 34. Thereafter, the detecting head 22 is moved from an evacuation position to a detection position, so as to obtain positioinal error information between a current position in which the wafer W is currently held and a programmed position in which the transfer of the wafer W is to be carried out. Based on the positioinal error information, the transferring position of the wafer W is corrected by using the carrying apparatus 6, such that an amount of the positioinal error between the current position W and the programmed position is within an allowable range.
Owner:TOKYO ELECTRON LTD

Optical head, optical information apparatus, and optical-information reproducing method

An optical head is provided which is capable of realizing a stable tracking control, even if the rotational center of an information recording medium is not located on the extension line of the transfer directions of a light-concentrating element. This optical head includes: a semiconductor laser which emits a beam of light; an objective lens which concentrates the beam of light on an optical disk; a transfer mechanism which transfers the objective lens between the outermost circumference and the innermost circumference of the recording area of the optical disk along the optical disk; and a photo-detector which detects a beam of light that returns from the optical disk. The photo-detector includes a plurality of areas which are divided by a division line. The division line is set parallel to the tangential directions of the track in a predetermined position on the transfer line of the objective lens between the outermost circumference and the innermost circumference of the recording area, and the plurality of areas are divided, by a lateral division line which intersects the division line, into a first area on which a beam of light that mainly includes a tracking component is incident and a second area on which a beam of light that does not include the tracking component is incident.
Owner:PANASONIC CORP
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