1results about How to "Optimizing light path" patented technology

This invention provides an optoelectronic co-packaging structure and its packaging method. Utilizing the excellent optical transparency, thermal stability, and electrical insulation of a glass substrate, it combines through-hole electrical interconnects for electrical signal transmission and through-hole optical interconnects for optical signal transmission. Furthermore, it integrates optical components through dual-surface grooves, solving the problems of low optical interconnect efficiency, poor heat dissipation, and limited integration in traditional optoelectronic co-packaging. This significantly improves the optical interconnect efficiency, heat dissipation performance, and integration of the optoelectronic co-packaging structure. The invention also uses grooves to limit the electrical components, achieving precise alignment and transmission of optical signals and reducing optical coupling loss. Simultaneously, the overlapping of the orthographic projections of the two grooves causes partial vertical overlap of the two optical components, optimizing the optical path and thus greatly enhancing signal fidelity.