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42results about How to "Satisfactory workability" patented technology

Method for producing hot-dip galvanized steel sheet having high strength and also being excellent in formability and galvanizing property

A hot-dip galvanized high-strength steel sheet having superior workability and galvanizability containing:0.01% to 0.20% by weight of C;1.0% by weight or less of Si;more than 1.5% to 3.0% by weight of Mn;0.10% by weight or less of P;0.05% by weight or less of S;0.10% by weight or less of Al;0.010% by weight or less of N;0.010% to 1.0% by weight in total of at least one element selected from the group consisting of Ti, Nb, and V; andthe balance being Fe and incidental impurities;in which the steel sheet has the metal structure in which the areal rate of the ferrite phase is 50% or more, the ferrite phase has an average grain diameter of 10 mum or less, and the thickness of a band-like structure composed of the second phase satisfies the relationship Tb/T<=0.005, where Tb is the average thickness in the sheet thickness direction of the band-like structure and T is the thickness of the steel sheet, and a method for producing the same. To provide a method for producing a hot-dip galvanized high-strength steel sheet in which superior workability and high strength are obtained and moreover satisfactory galvanizability is obtained when galvanizing is performed using facilities such as a continuous galvanizing line.
Owner:KAWASAKI STEEL CORP

Alkali-developing type photocurable composition and calcined pattern obtained by use thereof

Disclosed are a photocurable composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photocurable composition. The photocurable composition comprises (A) an alkali-soluble macromolecular binder having a weight-average molecular weight in the range of 5,000 to 100,000 and an acid value in the range of 50 to 150 mg KOH / g and obtained by causing (c) an organic acid possessing one carboxyl group and no ethylenically unsaturated bond in its molecule to react with the glycidyl group of a copolymer of (a) a compound possessing an ethylenically unsaturated bond and possessing neither hydroxyl group nor acidic group and (b) glycidyl (meth)acrylate and then causing (d) a polybasic acid anhydride to react with the resultant secondary hydroxyl group, (B) an inorganic powder, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) an organic solvent. The composition may be in the form of paste or in the form of a dry film. When the photocurable composition is in the form of paste, the paste is applied to a substrate and then dried to form a film. When the photocurable composition is in the form of a dry film, the film is laminated on the substrate. A calcined pattern of high fineness is obtained by patterning the superposed layer of the composition by selective exposure to light and development, and thereafter calcining the patterned film.
Owner:TAIYO INK MFG CO LTD

Epoxy resin composition, cured object obtained therefrom, and light-emitting diode

Provided are an epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics. That is, (1) the composition has a low viscosity after the mixing, a low degree of viscosity increase in standing at room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has crack resistance, and changes its color to a small extent with long-term light irradiation and heating. The composition is suitable for an encapsulant for a photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a hydrogen atom or a methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.)
Owner:MITSUBISHI GAS CHEM CO INC

Curable Composition

The present invention provides a curable composition comprising a reactive silicon group-containing polyoxyalkylene polymer which is obtained by reacting a polyoxyalkylene polymer (A) having a molecular weight distribution of 1.6 or less, a number average molecular weight of 15,000 to 50,000, and 0.8 or more reactive groups, on average, per molecule thereof with an organic compound (B) having in the molecule thereof a reactive silicon group and a functional group capable of reacting with the reactive groups of the polymer (A) in a proportion of 0.8 to 1.5 molecules of the organic compound (B), on average, per molecule of the component (A), a filler (C) and a curing catalyst (D); further in which, in the liquid components contained in the curable composition, the ratio y/x of the content y (wt %) of a component having no reactive silicon group and the content x (wt %) of a component having at least one reactive silicon group is 0.4 or less; and further in which the composition comprises a plasticizer in an amount of 10 parts by weight or less in relation to 100 parts by weight of the reactive silicon group-containing polyoxyalkylene polymer. The curable composition of the present invention improves the staining property of the cured product thereof, ensures favorable mechanical properties favorable for a sealant such as low stress and high elongation, and is also satisfactory in workability.
Owner:KANEKA CORP
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