Provided are an
epoxy resin composition including acid anhydrides (A) and
epoxy resins (B), in which: (a)
cyclohexane-1,2,4-
tricarboxylic acid-1,2-anhydride accounts for 50 to 90
mass % of the acid anhydrides (A); (b) an alicyclic
epoxy resin compound accounts for 30 to 90
mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50
mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting
diode. The epoxy resin composition has the following characteristics. That is, (1) the composition has a low
viscosity after the mixing, a low degree of
viscosity increase in standing at
room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has
crack resistance, and changes its color to a small extent with long-term
light irradiation and heating. The composition is suitable for an encapsulant for a
photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a
hydrogen atom or a
methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.)