The invention discloses a full-automatic
silicon carbide module
plastic packaging system, and belongs to the field of
semiconductor production equipment. The
plastic packaging system comprises a material frame feeding device, a material frame discharging device, a material frame transferring device, a frame feeding device, a material feeding device, a preheating device, a
hot pressing device and a
cutting discharging device, and the frame feeding device, the material feeding device, the
hot pressing device and the
cutting discharging device are distributed along a first transverse path. The material frame transferring device extends along a second transverse path, the second transverse path is arranged on the
lateral position of the first transverse path, and the material frame feeding device and the material frame discharging device are installed on the material frame transferring device. The material frame transferring device is used for driving the material frame feeding device and the material frame discharging device to move between the second transverse path and the first transverse path. The problems that in the prior art, the space above a frame conveying device and a material conveying device is small, and adjustment and maintenance of a
plastic packaging system are not facilitated are solved, and the plastic packaging system can meet the production requirement of the
silicon carbide module.