36results about How to "Remove signal noise" patented technology

The invention discloses a packaging structure and a packaging method for a fingerprint recognition chip. The packaging structure comprises a substrate, a sensing chip, an upper cover layer and a plastic package layer. The sensing chip is coupled to the surface of the substrate and provided with a first surface and a second surface opposite to the first surface, the first surface of the sensing chip is provided with a sensing area, and the second surface of the sensing chip is located on the surface of the substrate. The upper cover layer is at least located on the surface of the sensing area of the sensing chip and is made of polymers. The plastic package layer is located on the surface of the substrate and the surface of the sensing chip, and the plastic package layer is exposed out of the upper cover layer. According to the packaging structure, the requirement for the sensitivity of the sensing chip is lowered, and application is wider.

The invention discloses a packaging structure and a packaging method for a fingerprint recognition chip. The packaging structure comprises a substrate, a sensing chip, a plurality of wires and a plastic package layer. The substrate is provided with a first surface, and the first surface of the substrate is provided with a first welding pad layer. The sensing chip is located on the first surface of the substrate and provided with a first surface and a second surface, the second surface of the sensing chip is located on the first surface of the substrate, the first surface of the sensing chip is provided with a sensing area and a peripheral area, and the surface of the portion, in the peripheral area, of the sensing chip is provided with a second welding pad layer. The two ends of the wires are electrically connected with the first welding pad layer and the second welding pad layer respectively, the wires have top points with the maximum distance to the surface of the substrate, and a first distance is reserved between the top points and the first surface of the sensing chip. The plastic package layer is located on the surface of the substrate and the surface of the sensing chip and surrounds the wires and the sensing chip, and a second distance is reserved between the surface of the plastic package layer and the first surface of the sensing chip and is larger than the first distance. According to the packaging structure, the requirement for the sensitivity of the sensing chip is lowered, and application is wider.

Disclosed is a wafer-level fingerprint recognition chip packaging structure and method. The method includes: providing a substrate which comprises a plurality of induction chip areas and is provided with a first surface and a second surface opposite to the first surface, wherein a first surface of each induction chip area comprises an induction area; forming a covering layer on the first surface of the substrate; forming a plug structure in each induction chip area of the substrate, wherein one end of each plug structure is electrically connected with the corresponding induction area, and the other end of each plug structure is exposed out of the second surface of the substrate. By the forming method, the packaging process of a fingerprint recognition chip can be simplified, the requirement on sensitivity of the induction chip is lowered, and the packaging method is wider in application.

Disclosed are a fingerprint identification chip packaging method and a fingerprint identification chip packaging structure. The fingerprint identification chip packaging method includes: providing a substrate; coupling a sensing chip on the surface of the substrate, wherein the sensing chip is provided with a first surface comprising a sensing area and a second surface opposite to the first surface and positioned on the surface of the substrate; forming a plastic packaging layer on the surface of the substrate, wherein the plastic packaging layer encloses the sensing chip, and the surface of the plastic packaging layer is flush to the first surface of the sensing chip; forming a covering layer with the thickness smaller than 100 micrometers on the plastic packaging layer and the first surface of the sensing chip. The fingerprint identification chip packaging method has the advantages that the fingerprint identification chip packaging structure formed by the fingerprint identification chip packaging method is simplified, and the requirement on sensitivity of the sensing chip can be lowered, so that the fingerprint identification chip packaging method and the fingerprint identification chip packaging structure are wider in application range.

Disclosed herein is a solid-state image taking device including a pixel section and a scan driving section wherein on each pixel column included in the pixel area determined in advance to serve as a pixel column having the unit pixels laid out in the scan direction, the opto-electric conversion section and the electric-charge holding section are laid out alternately and repeatedly, and on each of the pixel columns in the pixel area determined in advance, two the electric-charge holding sections of two adjacent ones of the unit pixels are laid out disproportionately toward one side of the scan direction with respect to the optical-path limiting section or the opto-electric conversion section.

A write counter provides a write count value synchronized with a write clock signal. A read counter provides a read count value synchronized with a read clock signal. The read and write count values are routed through logic, which introduces noise to these values. A first delay circuit generates a first blanking signal, which has a duration corresponding with the duration of the noise introduced to the write count value, in response to the write clock signal. A second delay circuit generates a second blanking signal, which has a duration corresponding with the duration of the noise introduced to the read count value, in response to the second clock signal. The read and write count values are latched into read and write blanking registers, respectively, in response to the first and second blanking signals, respectively, effectively filtering the introduced noise prior to a subsequently performed comparison operation.

There is provided a mouse control module including two light sources, an image sensor, a processing unit and a communication unit. The two light sources emit light of different wavelengths to illuminate a finger surface. The image sensor receives reflected light from the finger surface to generate a plurality of image frames. The processing unit detects a displacement of the finger surface and a physiological characteristic of a user according to the plurality of image frames. The communication unit encodes and/or sequences the displacement and the physiological characteristic so as to generate finger and physiology information. There is further provided an optical finger mouse.

The present invention provides methods and systems of using wavelet transform in a dual-track architecture to process ECG signals of patients and reference ECG signals of previously studied subjects to assess the cardiovascular health of the patients. The dual-track architecture refers to running wavelet transform on the ECG signals of the patients and the reference ECG signals to extract and analyze 2-dimensional time-domain signal characteristics of the ECG signals, and to build and analyze a 3-dimensional model of frequency-domain and time-domain information of the ECG signals. The characteristics of the ECG signals of the patients and the reference ECG signals may be compared and used to identify a cardiovascular disease of the patient or to recommend follow-up tests. The results of the comparison may also be used to configure the ECG device used to acquire the ECG signals of the patient and/or to optimize the parameters of the 2-D/3-D analysis.

In one aspect of the present invention, a light sensor is provided in the active pixel sensor cell for sensing incident radiation. The voltage corresponding to the photon-generated or other radiation-generated charge in the active pixel sensor cell is stored on a storage node via a sample-and-hold capacitor. Additional elements, such as source-follower transistors, may reside between the sensing element and the sample-and-hold capacitor. The signal is read via a readout source-follower (RSF) transistor. The readout source-follower drain is connected to the row select switch while its drain is connected to the output node on the column output bus. This configuration couples the storage node to the gate-source capacitance of the readout source-follower transistor. This allows the voltage on the storage node to increase proportionally to the increase in voltage on the readout node when the row select is closed and thus enables the drain current to flow through the RSF to the column output bus.

The invention discloses a packaging structure and a packaging method for a fingerprint recognition chip. The packaging structure comprises a substrate, a sensing chip and a plastic package layer. The sensing chip is coupled to the surface of the substrate and provided with a first surface and a second surface opposite to the first surface, the first surface of the sensing chip is provided with a sensing area, and the second surface of the sensing chip is located on the surface of the substrate. The plastic package layer is located on the surface of the substrate and the surface of the sensing chip, the surface of the sensing area of the sensing chip is covered with the plastic package layer, the portion, located on the surface of the sensing area, of the plastic package layer has a preset thickness, and the plastic package layer is made of polymers. According to the packaging structure, the requirement for the sensitivity of the sensing chip is lowered, and application is wider.

The invention relates to an optical finger mouse which comprises two light sources, an image sensor and a processing unit, wherein the two light sources are used for emitting light with different wavelengths, so as to illuminate the surfaces of fingers; the image sensor is used for receiving the reflected light from the surfaces of the fingers, so as to generate a plurality of image frames; and the processing unit is used for detecting the displacement and contact state of the surfaces of the fingers and the physiological features of a user in accordance with the image frames. The invention further provides an electronic device.

The invention provides an electrocardiogram classification method and device based on wavelet transform and DCNN (deep convolutional neural networks), and belongs to the field of biological medicinesand modes. According to an automatic classification method and device of electrocardiogram signals based on the wavelet transform and the deep convolutional neural networks, by utilizing wavelet functions, the electrocardiogram signals are decomposed into sub-signals of different frequency scales, and the sub-signals are filtered in sectional modes and are subjected to wavelet reconstruction; by utilizing 24 layers of convolutional neural networks, characteristic extraction is carried out by adopting crossed-size convolution kernels, data overfitting is prevented by adopting dropout and BatchNormalization when characteristic information is transmitted; and finally, classification is carried out by adopting a softmax classifier. The method is already verified on an ECG data set provided by2017 PhysioNet/CinC Challenge, and the accuracy rate is 0.871, and an F1 score is 0.8652. A research proves that noises of the electrocardiogram signals can be eliminated more effectively through thewavelet transform, and extraction of multi-layer characteristics can be performed by utilizing the 24 layers of convolutional neural networks, and meanwhile, a receptive field can be improved by increasing the sizes of the convolution kernels, so that the classification performance of a model is improved.

The present invention provides system and method for three-dimensionally tracking micro particle motion wherein a dark-field condenser is configured to receive light field emitted from a light source and project the light field on a fluid sample having at least one particle thereby generating a scattered light field associated with the at least one particle, an objective lens is configured to receive the scattered light field, an image capturing unit coupled to the objective lens receives the scattered light field thereby generating at least one image of the fluid sample, and a controller is configured to couple to the image capturing unit for analyzing interference ring pattern corresponding to a specific particle in the at least one image and determining a tracking information associated with the specific particle along three-dimensional direction according to the size and center of the interference ring pattern.

A transient signal denoising method is characterized by including the steps of 1, subjecting a noise-bearing transient signal to phase-space reconstruction according to the number of preset embedded dimensions and a time delay parameter, thus obtaining a phase-space data matrix having the preset embedded dimensions; 2, subjecting the phase-space data matrix to time-frequency manifold learning, thus obtaining an internal manifold structure embedded in a time-frequency distribution data matrix, namely a time-frequency manifold data matrix; 3, subjecting each dimension of the phase-space data matrix to time-frequency integration according to the time-frequency manifold data matrix, thus obtaining an updated phase-space data matrix with the preset embedded dimensions; and 4, integrating the updated phase-space data matrix according to the preset embedded dimensions and the time delay parameter, thus obtaining a denoised transient signal. The transient signal denoising method has the advantages that background noise in signals is effectively removed, intrinsic time-frequency characteristics of the transient signal are retained to the maximum extent, and important information carried by the transient signal can be represented effectively.

The invention relates to the technical field of motion control, and discloses a signal processing method for handle direct position control. The signal processing method comprises the following steps of: carrying out distortion correction processing on a handle angle signal to obtain a handle effective angle signal after distortion correction processing; converting the processed effective angle signal of the handle into a position signal; performing speed constraint on the position signal to obtain a target position signal after speed constraint; and smoothing the target position signal subjected to speed constraint to obtain a smoothed position signal, and performing direct position control by a servo system according to the smoothed handle position signal. According to the signal processing method, absolute position control is realized, an application scene requiring direct position control is satisfied, the handle change sensitivity is set, and compared with direct gear setting, the gear switching disturbance is avoided, and the position control precision is high.

The invention discloses a roof antenna, which mainly relates to communication equipment. The invention includes a first filter and a second filter. The first filter is located above the second filter and connected to each other through a rotating shaft. It also includes a pole and a Chassis, one end of the pole is fixed on the bottom of the second filter, the other end of the pole is connected to the top surface of the chassis, the chassis is provided with a plurality of screw holes, and the top of the first filter is provided with a detachable The lightning rod is provided with a plurality of fixing claws on the chassis; the lightning rod is used to prevent the invention from being damaged by lightning, and the fixing claws can make the invention firmly fixed on the carrier.

The invention provides an EEG signal denoising method based on EEMD and DSS-ApEn. The noisy EEG signal is decomposed into several intrinsic mode functions (IMF) components by using the EEMD decomposition algorithm; the IMF component with the highest frequency component filtered out is used to extract each independent source signal by DSS, and then the independent source signal with the largest approximate entropy of spectrum is selected as the denoising signal. The EEG signal has relatively clear EEG signal waveform after denoising by the denoising method provided in the invention, and more importantly, the detailed features of the original signal shelf are well preserved.

A circuit and method thereof for sampling/holding signal is provided. The signal sampling/holding circuit comprises a first signal sampling/holding device, a second signal sampling/holding device, a target signal and a reference voltage. First, the first signal sampling/holding device is supplied with the reference voltage and the target signal. The reference voltage is disconnected from the first signal sampling/holding device before the target signal is. Similarly, the reference voltage is disconnected from the second signal sampling/holding device before the target signal is. Thus the target signal is respectively sampled and held in the first signal sampling/holding device and the second signal sampling/holding device.