The invention discloses a 1.6 T
Flip Chip high-speed
optical module and a flip packaging method, and belongs to the technical field of
optical communication. The
system comprises a multi-layer rewiring fan-out substrate, a
flip chip silicon optical engine, an eight-channel linear driving DSP, a high-speed electrical / optical interface, an active
temperature control and heat dissipation
system and a power supply and
clock management unit, and through the
hybrid interconnection technology of Cu / SnAg micro-bump flip bonding and gold
wire bonding, the device
interconnection distance smaller than or equal to 30 microns and the
chip interconnection distance smaller than or equal to 5 mm are achieved. The packaging method comprises the five steps of PD-TIA inversion and
lead bonding, PIC integration and interconnection, passive device
assembly, MPO coupler active alignment and sealing cover testing. Key process parameters are as follows: the height of a PD-TIA bump is 15 + / -2 microns, the length of a PIC bonding wire is less than or equal to 300 microns, and the MPO
coupling loss is less than or equal to 0.5 dB. According to the invention, the size of the optical engine is reduced by 40%, the 3dB bandwidth is improved by 20%, and the
failure rate of the device is lt; 100FIT,
power consumption lt; the method meets the OSFP-XD standard, and is suitable for a 1.6 T high-speed interconnection scene of a
data center.