The invention discloses a
moisture-proof curing agent applied to a PCB (
Printed Circuit Board)
coating and a preparation process of the
moisture-proof curing agent, and relates to the technical field of PCB protective materials. The invention discloses a
moisture-proof curing agent applied to a PCB
coating. The invention discloses a nano-
silicon dioxide modified
epoxy resin, which is prepared from the following raw materials in parts by weight: 30 to 50 parts of
epoxy resin, 20 to 35 parts of
polyurethane prepolymer, 10 to 15 parts of nano-
silicon dioxide, 5 to 10 parts of
methyltrimethoxysilane, 3 to 8 parts of gamma-aminopropyltriethoxysilane, 0.5 to 2 parts of
dibutyltin dilaurate, 2 to 5 parts of 2-hydroxy-4 '-(2-hydroxyethoxy)-2-methyl
propiophenone and 1 to 3 parts of
antioxidant 1076. The self-repairing
coating is prepared from, by weight, 20-30 parts of
epoxy resin, 8-12 parts of
tripropylene glycol diacrylate, 5-8 parts of
polytetrafluoroethylene micro
powder, 4-7 parts of self-repairing microcapsules and 20-30 parts of modified
acrylic resin. The moisture-proof curing agent has the advantages of good moisture-proof performance, low water absorption, excellent mechanical properties such as
hardness and
adhesive force, good
temperature resistance and
impact resistance, self-repairing function, high repairing efficiency, strong weatherability, no obvious change after
ultraviolet aging, and excellent performance in all aspects, and is suitable for PCB coating protection.