The invention discloses a magnetron
sputtering coating method with uniform
coating and high target material
utilization rate, and belongs to the technical field of film preparation, and the method realizes high-precision
coating through whole-process collaborative optimization of pretreatment,
sputtering, deposition and post-treatment. The substrate is cleaned in cooperation with radio-frequency pulse focusing bombardment; an
electromagnetic coil group containing a temperature compensation coil is used for target
sputtering, a
magnetic field is dynamically adjusted in combination with
laser profile sensing and a PID self-
adaptive algorithm, and a
direct current pulse-
radio frequency composite power supply is matched to solve the target problem; in the deposition stage, a
quartz crystal instrument is used for closed-loop film thickness control,
metal film pulse
gas supply and compound film reaction
gas phase adjustment; gradient temperature rise is carried out according to data of an X-
ray stress meter in post-treatment, and
argon is used for dynamic protection and
impurity prevention. According to the magnetron sputtering coating method with uniform coating and high target material
utilization rate, the uniformity of coating and the target material
utilization rate are improved, and the technological adaptability and stability of coating are improved.