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47results about How to "Improve current sharing effect" patented technology

Semi-dry process smoke eliminator with independent temperature-reducing column

The invention relates to a smoke gas purification device by a semidry process, which is provided with an independent desuperheating tower, comprising a reaction tower provided with an smoke inlet box, a smoke gas outlet, a venturi tube type tower wall arranged on a tower bottom, a water injector arranged on the tower wall and a nozzle for lime dry powder and revert dust; and the smoke gas outlet is connected with an inertia separator, an activated carbon mixer, a bag-type dust remover and a draught fan. The invention is characterized in that the invention is also provided with the desuperheating tower which is provided with a boiler smoke gas inlet manifold, a single-stage water injector, an ash bucket with an ash hole and a gas flue; the gas flue of the desuperheating tower is connected with the smoke inlet box into one unit. The boiler smoke gas disperses within the two towers for cooling, thereby improving the adaptability of a system to a load; the boiler smoke gas particularly can be cooled down urgently to a set temperature in the desuperheating tower; and the reaction tower can be humidified only by evaporation with a little water to complete a deacidifying reaction and remove dioxin, thereby avoiding the disadvantages of scale formation on the tower wall of the prior reaction tower and bag burning of the bag-type dust remover, guaranteeing a sustaining and stable smoke purification process and having the advantages of good purification effect and low energy consumption.
Owner:HANGZHOU NEW CENTURY ENERGY ENVIRONMENTAL PROTECTION ENG CO LTD

Fluid distributor

The invention discloses a fluid distributor and belongs to the fluid distributing technical field. The fluid distributor comprises a distributing pipe body and guide plates. A flow distributing groove is formed in the pipe wall of the distributing pipe body. A blanking plate is arranged at the tail end of the distributing pipe body. The guide plates are arranged in the distributing pipe body. The guide plates are connected by inlet plates and outlet plates. The plate surfaces of the inlet plates extend along the entrance direction of the distributing pipe body. The plate surfaces of the outlet plates extend along the direction of the flow distributing groove. The guide plates are sequentially ranked along the length direction of the distributing pipe body. The inlet plates are ranked of a step shape, and projected areas on a cross section of space areas of the adjacent inlet plates are basically identical. Distance from the inlet plates to the flow distributing groove increases by degrees along the entrance of the distributing pipe body to the tail end of the distributing pipe body. The fluid distributor solves the technical problems of an existing distributor that heat exchange efficiency of a heat exchanger is low due to uneven flow distributing of an existing distributor, and is particularly suitable for refrigerant distributing of a plate type heat exchanger.
Owner:陆群英

Mixing and flow-homogenizing structural body

The invention relates to a mixing and flow-homogenizing structural body, which includes a pore plate flow-homogenizing layer and a foam metal flow-homogenizing layer which are arranged vertically to the gas flow direction. The pore plate flow-homogenizing layer is composed of a pore plate flow-homogenizing layer fixed sheet and a pore plate flow-homogenizing layer movable sheet, which are arranged adjacently to each other. A plurality of flow-homogenizing pores are formed in corresponding positions on both the pore plate flow-homogenizing layer fixed sheet and the pore plate flow-homogenizing layer movable sheet. The pore plate flow-homogenizing layer movable sheet can slide transversally and vertically at short distance, and when the movable sheet slides, the overlapping ratio of the flow-homogenizing pores in the movable sheet and the corresponding flow-homogenizing pores in the fixed sheet is changed. By means of the combined structure of the foam metal flow-homogenizing layer and the pore plate flow-homogenizing layer. The overlapping ratio of the flow-homogenizing pores in the movable sheet and the fixed sheet can be adjusted, thereby greatly improving flow-homogenizing effect. When being used for removal of NOx through ammonia process under large flue gas load status, gas flows and pressures in multiple chambers can be equalized, and gas flow distribution in single chamber is uniform. Meanwhile, mixing uniformity of ammonia gas or a thermal-desorption gas with flue gas is improved.
Owner:ACRE COKING & REFRACTORY ENG CONSULTING CORP DALIAN MCC

Driving circuit of semiconductor devices in high-power converter and working method thereof

The invention discloses a driving circuit of semiconductor devices in a high-power converter and a working method thereof. The driving circuit includes a control signal receiving and processing unit,a large-capacity driver unit and a fault signal processing and feedback unit. The control signal receiving and processing unit is used for generating two complementary driving signals with dead zone from an external driving signal and transmitting the driving signals to the large-capacity driver unit. The large-capacity driver unit is connected with the semiconductor devices, and is used for receiving and amplifying the driving signals sent by the control signal receiving and processing unit and sending the driving signals to the semiconductor devices, and obtaining the voltage value across the two ends of each semiconductor device and feeding the voltage values back to the fault signal processing and feedback unit. The large-capacity driver unit simultaneously drives one or more semiconductor devices, which ensures the synchronization of the driving signals of the semiconductor devices and improves the current sharing of the semiconductor devices. The currents and temperatures of thesemiconductor devices are monitored and protected on the basis, which ensures the safe and stable operation of the semiconductor devices of the high-power converter.
Owner:西安翌飞核能装备股份有限公司

Semi-dry process smoke eliminator with independent temperature-reducing column

The invention relates to a smoke gas purification device by a semidry process, which is provided with an independent desuperheating tower, comprising a reaction tower provided with an smoke inlet box, a smoke gas outlet, a venturi tube type tower wall arranged on a tower bottom, a water injector arranged on the tower wall and a nozzle for lime dry powder and revert dust; and the smoke gas outlet is connected with an inertia separator, an activated carbon mixer, a bag-type dust remover and a draught fan. The invention is characterized in that the invention is also provided with the desuperheating tower which is provided with a boiler smoke gas inlet manifold, a single-stage water injector, an ash bucket with an ash hole and a gas flue; the gas flue of the desuperheating tower is connected with the smoke inlet box into one unit. The boiler smoke gas disperses within the two towers for cooling, thereby improving the adaptability of a system to a load; the boiler smoke gas particularly can be cooled down urgently to a set temperature in the desuperheating tower; and the reaction tower can be humidified only by evaporation with a little water to complete a deacidifying reaction and remove dioxin, thereby avoiding the disadvantages of scale formation on the tower wall of the prior reaction tower and bag burning of the bag-type dust remover, guaranteeing a sustaining and stable smokepurification process and having the advantages of good purification effect and low energy consumption.
Owner:HANGZHOU NEW CENTURY ENERGY ENVIRONMENTAL PROTECTION ENG CO LTD

A half-bridge power semiconductor module

The invention discloses a half-bridge power semiconductor module, comprising: a semiconductor chipset located at the bottom layer; a low-sensitivity composite busbar located at the top layer, and the two sides of the low-sensitivity composite busbar are respectively extended with AC interfaces and positive and negative layer interfaces, The low-sensitivity composite busbar includes the negative layer busbar, the positive layer busbar and the AC layer busbar arranged in layers; several busbar groups connected in parallel with each other in the middle layer, among which, the bottom end of each busbar group and the semiconductor chip The corresponding semiconductor chips in the group are connected, and the top busbars of each busbar group are connected to the corresponding busbars of the low-inductance composite busbars. The semiconductor chipset is the main functional part of the power module. The AC interface and the positive and negative layer interfaces of the low-inductance composite busbar are used as the external interface of the main circuit of the power module. The busbar group realizes the conductive connection between the low-inductance composite busbar and the semiconductor chipset. , taking into account the current sharing between the busbar group and the chips of the semiconductor chipset, and improving the low inductance and current sharing of the power module.
Owner:CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST

Medicine material flow equalizing device for propellant extruder

The invention discloses a medicine material flow equalizing device for a propellant extruder. The device comprises an outer cylinder, a mold body, a piston and a rubber pad, wherein the piston consists of a piston body, a piston rod and a rubber disc; a groove is formed in the bottom of the piston body; a ventilation hole communicated with the groove is formed in the top surface of the piston body; the rubber disc is fixed at the bottom of the piston body to enable a groove cavity of the groove to become an air storage chamber; inner holes of the outer cylinder are sequentially a pore diameterD1 section, a pore diameter D2 section and a pore diameter D3 section from top to bottom, and D2 > D1, D3 = D1; a plurality of medicine outlet holes with the same shape and size are formed in the mold body, through holes with the same position, number, size and shape as the medicine outlet holes on the mold body are formed in the rubber pad, and each through hole on the rubber pad is respectivelyaligned with the corresponding medicine outlet hole on the mold body when the rubber pad is fixedly connected with the mold body; and the piston body is mounted in the pore diameter D1 section, the rubber pad is mounted in the pore diameter D3 section, the mold body covers the bottom of the outer cylinder and is fixedly connected with the wall of the outer cylinder, and the pore diameter D2 section and the top surface of the rubber pad form a medicine material extrusion cavity.
Owner:SICHUAN UNIV

Chip layout structure of half-bridge IGBT module

The invention discloses a chip layout structure of a half-bridge IGBT module. The structure comprises an upper bridge IGBT chip and a lower bridge IGBT chip, the upper bridge IGBT chip and the lower bridge IGBT chip are connected with an FRD chip through bonding wire groups to realize chip front connection, grids are positioned on the left side of the IGBT chip, and the reverse sides of the upperbridge IGBT chip and the lower bridge IGBT chip are welded on an upper bridge DCB substrate; dgrids of the lower bridge IGBT chip are all located on the right sides of the IGBT chip, and the upper andlower IGBT chips and the FRD chip are distributed in a central symmetry mode relative to the module. The drop points of the bonding wires of an upper half-bridge signal terminal and a lower half-bridge signal terminal are located on the grid signal copper layers of the upper half-bridge and the lower half-bridge respectively, and the drop points of the bonding wires of the upper half-bridge and the lower half-bridge are located between the drop points of the grid bonding wires of the two non-adjacent IGBT chips on the grid signal copper layers. Simulation shows that the peak current difference rate of the three IGBT chips is reduced from 30% to 9.3%, so that the current sharing performance of the chips is improved; the reduction of the maximum peak current of the chips reduces the impactof the turn-on current on the chips, and facilitates the long-term stable operation of the chips.
Owner:NARI TECH CO LTD

Switching harmonic suppression method for inverter parallel system and inverter parallel system

The invention discloses a switch sub-harmonic suppression method of an inverter parallel connection system and an inverter parallel connection system. The method comprises the following steps: all inverters in an inverter parallel connection system share the voltage of an AC bus, one inverter accesses the parallel connection system, and other inverters do not access the parallel connection system;after the inverter accessing the parallel connection system is operated stably, each parallel connection circuit detects the voltage of the AC bus, and a carrier synchronous signal of each inverter can be obtained according to the voltage of the AC bus; each inverter accesses the parallel connection system, and a carrier phase value of each inverter and a counting direction of the carrier wave are obtained by adopting a rectangular pulse rising edge and falling edge triggering way by virtue of capture interruption; and the obtained carrier phase value of each inverter and the counting direction of the carrier wave are compared with zero or a carrier period value to obtain an adjusting amount for the carrier period of each inverter, so that the period value of the carrier wave is adjusted,and the synchronization of carrier signals of multiple inverters can be realized.
Owner:BEIJING JIAOTONG UNIV

A drug material flow equalization device for a propellant extruder

The invention discloses a medicine material flow equalizing device for a propellant extruder. The device comprises an outer cylinder, a mold body, a piston and a rubber pad, wherein the piston consists of a piston body, a piston rod and a rubber disc; a groove is formed in the bottom of the piston body; a ventilation hole communicated with the groove is formed in the top surface of the piston body; the rubber disc is fixed at the bottom of the piston body to enable a groove cavity of the groove to become an air storage chamber; inner holes of the outer cylinder are sequentially a pore diameterD1 section, a pore diameter D2 section and a pore diameter D3 section from top to bottom, and D2 > D1, D3 = D1; a plurality of medicine outlet holes with the same shape and size are formed in the mold body, through holes with the same position, number, size and shape as the medicine outlet holes on the mold body are formed in the rubber pad, and each through hole on the rubber pad is respectivelyaligned with the corresponding medicine outlet hole on the mold body when the rubber pad is fixedly connected with the mold body; and the piston body is mounted in the pore diameter D1 section, the rubber pad is mounted in the pore diameter D3 section, the mold body covers the bottom of the outer cylinder and is fixedly connected with the wall of the outer cylinder, and the pore diameter D2 section and the top surface of the rubber pad form a medicine material extrusion cavity.
Owner:SICHUAN UNIV

Optimal Control Method for Parallel Power Supply System Based on Current Sharing Standard Deviation Matrix Column and Minimum

The invention relates to an optimal control method for a parallel power supply system based on the minimum column sum of an equalizing standard deviation matrix. According to the method, firstly, the standard deviation matrix is built to determine output current when the equalizing property of the system is the optimal; secondly, a centralized controller determines an output current value under the condition that the equalizing property is the optimal through obtaining the output current of online power supply modules in real time and obtains an optimal value of the number of the online power supply modules; thirdly, the centralized controller controls the number of the online power supply modules in real time and ensures that the number is the optimal value or close to the optimal value; and whether running power supply modules meet the requirements or not is judged and optimal dispatching control is carried out. Under the target of ensuring that the equalizing property of the parallel power supply system is close to an optimal working point, i.e., the number of the online running power supply modules is the optimal, optimal dispatching on the online power supply modules with poor equalizing property and standby power supply modules is carried out by calculating the standard deviation of the output current of each power supply module and equalizing target value deviation, so that the target that the parallel power supply system and the online power supply modules work near the optimal point of the equalizing property is achieved.
Owner:WENZHOU UNIV

A method for controlling the number of modules in a parallel power supply system

The invention relates to a parallel power supply system module number control method based on a current-sharing standard difference matrix array and a minimum. A standard difference matrix between an actual current value and expected current-sharing deviation is built, and the module output current in a condition with the optimal current-sharing performance of the parallel power supply system is determined; then, through acquiring the output current of an online working power module in real time, a total load current value of the system is solved, the total load current value is divided by the module output current value in the condition with the optimal current-sharing performance obtained through former measurement, and the number of online operation power modules of the parallel power supply system is obtained; and finally, a parallel power supply system centralized controller controls the online power module number in real time, the system is ensured to constantly work in the optimal current-sharing performance condition, and through building a current-sharing standard difference matrix A=(sigmami)K*U in various load conditions, and the array and the minimum of A=(sigmami)K*U are calculated. The online power module number is dynamically adjusted in real time, the parallel power supply system is ensured to constantly work near at the optimal current-sharing working site, and the current-sharing performance is high.
Owner:WENZHOU UNIV
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