The present invention relates to a thermosetting resin composition suitable for production of flexible printed wiring boards (FPC) and built-up circuit boards, and laminates and circuit boards formed therefrom. Contains (A) polyimide resin component, (B) phenolic resin component, (C) epoxy resin component, and uses the weight of (A) component relative to the total weight of the above-mentioned (B) component and (C) component A thermosetting resin composition whose weight mixing ratio (A)/[(B)+(C)] is 0.4 to 2.0 can obtain a thermosetting resin composition excellent in dielectric properties, adhesiveness, processability, heat resistance, fluidity, etc. Laminates, circuit boards. In addition, (A) polyimide resin, (D) phosphazene compound, (E) cyanate compound, and (D) phosphazene compound, containing (D-1) phenoxyphosphazene having a phenolic hydroxyl group compound, and/or a thermosetting resin composition obtained by crosslinking the (D-1) phenoxyphosphazene compound, (D-2) crosslinked phenoxyphosphazene compound having at least one phenolic hydroxyl group, Laminates and circuit boards excellent in dielectric properties, processability, heat resistance, and flame retardancy can be obtained.