This invention relates to an automatic
soldering device for circuit board leads, comprising a carrier plate, a support platform, and a support frame, wherein the support platform is mounted on the side of the carrier plate. This invention relates to the technical field of circuit board
processing and
assembly. Beneficial effects: In use, this invention uses a
soldering component to perform
soldering, simultaneously feeding the solder wire. During soldering, the solder wire can be directly pulled out, and after soldering, the
conveyor belt automatically moves forward. This eliminates the need for separate control of the solder wire feeding and conveying devices during soldering, thus saving on drive costs. Furthermore, after a certain period of use, no maintenance or replacement is required for the drive component and the
servo motor in the conveying device, allowing for
continuous use and eliminating the need for maintenance. Therefore, this achieves
cost savings and increased efficiency.