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31results about How to "Short off time" patented technology

Novel low end metal oxide semiconductor field effect transistor (MOSFET)/ insulated gate bipolar transistor (IGBT) negative pressure clamping driving circuit and control method thereof

The invention discloses a novel low end metal oxide semiconductor field effect transistor (MOSFET)/ insulated gate bipolar transistor (IGBT) negative pressure clamping driving circuit and a control method thereof which belong to the field of power electronic driving. The driving circuit comprises a negative pressure clamping driving unit and a BOOST unit which are in circuit connection. The control method includes the following steps: (1) controlling S1 and S4 to be in connection state and S2 and S3 to be in disconnection state; (2) controlling the S1, the S2, the S3 and the S4 to be in the disconnection state and maintaining voltage on a Q gate source electrode at U3; (3) controlling the S2 and the S3 to be in the connection state and the S1 and the S4 to be in the disconnection state, enabling voltage on the Q gate source electrode to be clamped on the voltage U4 and enabling the Q to be disconnected instantaneously; and (4) controlling the S1, the S2, the S3 and the S4 to be in the connection state and maintaining voltage on the Q gate source electrode at U4. The S1, the S2, the S3 and the S4 stand for different MOSFET switch tubes. The driving circuit and the control method improve anti-jamming capability and can effectively prevent error connection of switch devices.
Owner:马鞍山市安工大智能装备技术研究院有限公司

A turn-off performance improving method for an insulated gate bipolar transistor

An insulated gate bipolar transistor structure comprises collector metal, a P-type collector region and an N-type base region. The surface of the N-type base region is provided with an N-type carrier storage layer and a groove gates. The groove gates divide the N-type carrier storage layer into strips. The surface of the strip-shaped N-type carrier storage layer is uniformly provided with block-shaped P-type body regions. The block-shaped carrier storage layer is provided with a second-type gate oxide layer connected to a first-type gate oxide layer. The second-type gate oxide layer is provided with a second polysilicon gate connected to a first polysilicon gate. The surfaces of the block-shaped P-type body regions are provided with P-type source regions and N-type source regions and are connected to emitter metal. The structure is characterized in that the surface of the block-shaped carrier storage layer is provided with light-doped shallow P-wells connected to the block-shaped P-type body regions. When the device in conduction, a grid electrode applies a positive grid voltage which is completely exhausted by the light-doped shallow P-wells to realize an injection efficiency enhance effect and enable the device to have a relatively small conduction pressure drop. When the device is turned off, the light-doped shallow P-wells are not completely exhausted, and conductive channels form to accelerate the device turn-off speed.
Owner:SOUTHEAST UNIV

All-solid-state DC circuit breaker

The invention provides an all-solid-state DC circuit breaker, and the circuit breaker comprises a switching module which is electrically connected between a converter and a load; a current detection module which is electrically connected between the switch module and the load and is used for detecting the current input into the load; a pulse distribution module, wherein a first input end of the pulse distribution module is electrically connected with an external control system, a second input end of the pulse distribution module is electrically connected with a signal output end of the currentdetection module, and the pulse distribution module is used for outputting a first control signal when receiving an external control signal sent by the external control system, and judging the received current corresponding to the electric signal output by the current detection module so as to output a second control signal when the received current corresponding to the electric signal output bythe current detection module exceeds a preset threshold value; and a driving module which is used for controlling the switch module to act according to the control signal output by the pulse distribution module. The all-solid-state direct-current circuit breaker provided by the invention is compact in structure, short in turn-off time and small in turn-off overvoltage.
Owner:CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST

An IGBT-based all-solid-state direct current circuit breaker and a control method thereof

The invention discloses an all-solid-state direct current circuit breaker and a control method thereof. The all-solid-state DC circuit breaker comprises a drive control circuit and a power electroniccircuit which are correspondingly connected. The driving control circuit is used for sending a control signal to the power electronic circuit. The power electronic circuit comprises a bidirectional through-flow assembly and an IGBT module assembly which are correspondingly connected. The bidirectional through-flow assembly is used for realizing bidirectional through-flow of the all-solid-state direct-current circuit breaker; and the IGBT module assembly is used for realizing connection and disconnection of the all-solid-state direct-current circuit breaker according to the control signal and controlling the magnitude of current passing through the all-solid-state direct-current circuit breaker during connection. The all-solid-state direct-current circuit breaker can effectively solve the problems that arc discharge and arc extinction are difficult when the circuit breaker is switched off, and the through-current capacity of an existing all-solid-state direct-current circuit breaker isnot high, and the all-solid-state direct-current circuit breaker is simple in structure, compact in design, low in cost and convenient to install and maintain.
Owner:ZHUZHOU CRRC TIMES SEMICON CO LTD

IGBT (Insulated Gate Bipolar Transistor) device with field stop buffer layer and manufacture method of IGBT device

The invention provides a field stop buffer layer which is formed in an IGBT (Insulated Gate Bipolar Transistor) device. The field stop buffer layer comprises an N type substrate and a P type buried layer formed in the N type substrate. The invention also provides an IGBT device with the field stop buffer region. The IGBT device comprises the field stop buffer layer, an N-epitaxial layer, an IGBT front structure, an anode cavity emission region and a back anode collector electrode, wherein the field stop buffer layer comprises the N type substrate and the P type buried layer formed in the N type substrate; the N-epitaxial layer is formed on the surface of the N type substrate; the IGBT front structure is formed on the surface of the N-epitaxial layer; the anode cavity emission region is formed on the back surface, which is far away from the N-epitaxial layer, of the N type substrate; and the back anode collector electrode is formed on the anode cavity emission region. The invention also provides a manufacture method of the IGBT device with the field stop buffer layer. Through increasing the thickness of the field stop buffer layer and regulating the concentration and the thickness between the P type buried layer and the N type substrate, the current density of the IGBT device is increased, and the conduction loss is reduced.
Owner:HANGZHOU SILAN INTEGRATED CIRCUIT

Novel low end metal oxide semiconductor field effect transistor (MOSFET)/ insulated gate bipolar transistor (IGBT) negative pressure clamping driving circuit and control method thereof

The invention discloses a novel low end metal oxide semiconductor field effect transistor (MOSFET) / insulated gate bipolar transistor (IGBT) negative pressure clamping driving circuit and a control method thereof which belong to the field of power electronic driving. The driving circuit comprises a negative pressure clamping driving unit and a BOOST unit which are in circuit connection. The control method includes the following steps: (1) controlling S1 and S4 to be in connection state and S2 and S3 to be in disconnection state; (2) controlling the S1, the S2, the S3 and the S4 to be in the disconnection state and maintaining voltage on a Q gate source electrode at U3; (3) controlling the S2 and the S3 to be in the connection state and the S1 and the S4 to be in the disconnection state, enabling voltage on the Q gate source electrode to be clamped on the voltage U4 and enabling the Q to be disconnected instantaneously; and (4) controlling the S1, the S2, the S3 and the S4 to be in the connection state and maintaining voltage on the Q gate source electrode at U4. The S1, the S2, the S3 and the S4 stand for different MOSFET switch tubes. The driving circuit and the control method improve anti-jamming capability and can effectively prevent error connection of switch devices.
Owner:马鞍山市安工大智能装备技术研究院有限公司

A method for improving the turn-off performance of an insulated gate bipolar transistor

An insulated gate bipolar transistor structure comprises collector metal, a P-type collector region and an N-type base region. The surface of the N-type base region is provided with an N-type carrier storage layer and a groove gates. The groove gates divide the N-type carrier storage layer into strips. The surface of the strip-shaped N-type carrier storage layer is uniformly provided with block-shaped P-type body regions. The block-shaped carrier storage layer is provided with a second-type gate oxide layer connected to a first-type gate oxide layer. The second-type gate oxide layer is provided with a second polysilicon gate connected to a first polysilicon gate. The surfaces of the block-shaped P-type body regions are provided with P-type source regions and N-type source regions and are connected to emitter metal. The structure is characterized in that the surface of the block-shaped carrier storage layer is provided with light-doped shallow P-wells connected to the block-shaped P-type body regions. When the device in conduction, a grid electrode applies a positive grid voltage which is completely exhausted by the light-doped shallow P-wells to realize an injection efficiency enhance effect and enable the device to have a relatively small conduction pressure drop. When the device is turned off, the light-doped shallow P-wells are not completely exhausted, and conductive channels form to accelerate the device turn-off speed.
Owner:SOUTHEAST UNIV
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