The invention relates to a TMCP-type YP500MPa-level thick steel plate with excellent low-temperature toughness which comprises the following chemical components by weight: 0.010-0.08% of C, 0.005-0.6% of Si, 0.5-2.50% of Mn, not more than 0.015% of P, not more than 0.005% of S, 0.010-0.12% of Nb, 0.005-0.03% of Ti, less than 0.120% of V, not more than 1.50% of Cr, not more than 0.80% of Mo, not more than 1.2% of Cu, not more than 1.60% of Ni, not more than 0.06% of Al, not more than 0.01% of Ca, 0.003-0.008% of N, not more than 0.0025% of B, not more than 0.008% of O, and the balance of Fe and inevitable impurity elements. In the manufacturing process, a heating temperature of a continuous casting blank is 1100-1250 DEG C; a rolling temperature of a recrystallization zone is 920-1170 DEG C; a rolling temperature of a non-recrystallization zone is 680-910 DEG C; a finish rolling compression ratio is not less than 2 T, wherein T is a finished product thickness; a cooling speed is not less than 5 DEG C/s, and a finally cooling temperature is 300-600 DEG C. A TMCP-type YP500MPa-level thick steel plate with excellent low-temperature toughness is obtained.