The application discloses a kind of active shutdown test equipment, method and system of hybrid commutation converter, and compensation power module includes multiple power modules in series together;Power module includes diode, capacitor and controllable switch;Series capacitor and controllable switch are connected in parallel to the two ends of diode;The diode of multiple power modules is in series together;Test product and first inductive reactor are connected into first branch, and the first end and the second end of first branch are respectively connected the first end of direct currentinductance and the first end of capacitor;Test product and second inductive reactor are connected into second branch, and the first end and the second end of second branch are respectively connected the first end of direct currentinductance and the second end of capacitor;Test product includes one or more integrated gate commutated thyristor;The second end of direct currentinductance is connected to the first end of compensation power module, and the second end of compensation power module is connected to the second end of capacitor.Compensation power module can supplement energy, use inductive resistance value smaller inductance, small volume and low cost.
A key device of a backlight keyboard comprises a substrate, a thin film circuit board, a flexible circuit board, a key cap, a supporting module, at least one induction resistor and a light-emitting part. The thin film circuit board is arranged on the substrate and can generate a trigger signal after being pressed. The flexible circuit board comprises a lower laid copper circuit sheet arranged above the film circuit board, a base material sheet arranged above the lower laid copper circuit sheet, and an upper laid copper circuit sheet arranged above the base material sheet. And the key cap is positioned above the flexible circuit board and has light transmission. The supporting module comprises an elastic body which is arranged above the flexible circuit board and elastically supports and abuts against the key cap. And the inductive resistor is arranged on the upper copper laying circuit sheet. And the light-emitting part is arranged on the upper laid copper circuit sheet and can directly project light to the key cap.
The invention discloses an electronic load device with low inductive reactance. The electronic load device comprises a first radiator, a first load circuit module, a first conducting strip, a first polarity connecting part and a second polarity connecting part, the first load circuit module comprises a first circuit board and a plurality of first power elements arranged on the first circuit board. The first conducting strip extends in the first direction and is erected on the first circuit board, so that the first circuit board is configured between the first radiator and the first conducting strip. The first polarity connection portion is coupled to an end portion of the first heat sink and protrudes in a first direction. The second polarity connection portion is coupled to an end portion of the first conductive sheet and protrudes along the first direction. The first polarity of the first power element is coupled to the first heat sink, and the second polarity is coupled to the first conductive sheet. Therefore, the distance between the two polarity connecting parts is reduced, the inductance value can be reduced in the power supply transmission process, the path impedance is reduced, and the voltage drop is further reduced.
A hybrid induction-resistive heating system for processingsemiconductor substrates includes a single induction coil surrounding a cylindrical susceptor and at least two resistive heaters disposed within the susceptor. The susceptor provides electromagnetic shielding to isolate the coil from the resistive heaters. A controller independently regulates heater output in response to temperature measurements within the heater to equalize temperatures across multiple zones of the susceptor. In operation, the coil provides rapid bulk heating while the resistive heaters supply localized spot heat, resulting in uniform thermal conditions along the length of the heater. The system achieves temperatures up to 2300° C. suitable for heat treatingsiliconcarbide substrates in batch processes.