2 results about "Peripheral plane" patented technology

The present invention provides a means to enable the mobile vehicle to be launched and landed in a location free of obstacles higher than the launch / landing surface, and to prevent the cargo from being blown away (scattered) by gusts of wind at the time of the vehicle's departure. [Solution] The mobile port 100 comprises a landing / departure surface 12 on which the mobile body 2 arrives and departs, an outer peripheral plane 14 surrounding the landing / departure surface whose upper surface is substantially flush with the landing / departure surface upon arrival of the mobile body, and a luggage scattering prevention device 20 that prevents luggage from moving onto the outer peripheral plane when the mobile body departs. The luggage scattering prevention device 20 includes, for example, a landing / departure surface lifting device 26 that raises and lowers the landing / departure surface relative to the outer peripheral plane. The method for preventing luggage from falling in the mobile port 100 comprises an arrival step S1 in which the upper surfaces of the landing / departure surface 12 and the outer peripheral plane 14 are kept substantially flush upon arrival of the mobile body 2, and a departure step S2 in which the luggage scattering prevention device 20 prevents luggage from moving onto the outer peripheral plane when the mobile body departs.

The invention discloses an MEMS three-axis thermal convection acceleration sensor based on a TGV structure. The sensor adopts a three-layer stacked structure and comprises a first chip, a second chip and a middle layer which are provided with upper and lower glass substrates, and a closed fluid cavity is defined by the first chip, the second chip and the middle layer. TGV conductive through columns are arranged in the first chip and the second chip, and heaters, z-axis temperature detectors close to the heaters and peripheral plane temperature detectors are symmetrically arranged on the surfaces, close to the fluid cavity, of the first chip and the second chip. The low thermal conductivity characteristic of the glass substrate is utilized, high sensitivity can be achieved without deep silicon etching, and the mechanical reliability and impact resistance of the device are remarkably improved; meanwhile, the measurement of the x-axis acceleration, the y-axis acceleration and the z-axis acceleration is successfully realized through the unique layout of the up-down symmetrical temperature detectors and the corresponding differential measurement principle. In addition, the vertical interconnection realized by using the TGV technology is beneficial to miniaturization and high-density integration of the device.