This invention discloses a design method and apparatus for a general-purpose aging board for DIP-like packaged module circuits, belonging to the field of
power module circuit aging testing. By fully utilizing the commonalities of DIP-like packaged module circuits, this invention creates more versatile fixtures, improving fixture compatibility and achieving
full coverage of DIP-like
package pin spans within 50.8mm. This reduces the design time and procurement costs of custom-made fixtures, improving design efficiency. Under different power conditions, crown spring holes are used as
resistor connectors, enabling free
insertion and replacement between different load resistors, reducing the cost of repeatedly customizing fixtures and manufacturing boards due to different load resistors, and improving efficiency. When only the connection method of the CTRL pin differs—negative logic requires grounding,
positive logic requires floating—the design of pin headers and jumpers allows for flexible connection selection, reducing overall hardware manufacturing costs. This invention is suitable for large-scale design and storage, and offers high testing efficiency.