The bidirectional
grinding device comprises a
workbench and two
grinding mechanisms symmetrically arranged on the
workbench, and each
grinding mechanism comprises a fixing
assembly, a telescopic driving unit, a grinding
assembly, a lifting driving
assembly and a mounting base mounted at the top end of the lifting driving assembly; the fixing assembly is used for fixedly supporting the end of a to-be-polished workpiece, and the lifting driving assembly is used for controlling the
polishing degree of the
polishing assembly to the to-be-polished workpiece. Inclined guide slideways are formed in the two inner side faces of the mounting base, the guide slideways are in sliding fit with the
polishing assembly, and the inclination degree of the guide slideways is the same as the
radian of the
machining face of the to-be-polished workpiece; the fixed end of the telescopic driving unit is rotationally connected with the center position of the
workbench, the movable end of the telescopic driving unit is rotationally connected with the bottom of the grinding assembly, and the telescopic driving unit is used for driving the grinding assembly to reciprocate on the
machining face of the to-be-ground workpiece along the guide sliding way.