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120results about How to "Avoid excess performance" patented technology

Test and burn-in apparatus, in-line system using the test and burn-in apparatus, and test method using the in-line system

A test and burn-in apparatus for semiconductor chip package devices, an in-line system which includes the test and burn-in apparatus, and a test method which employs the in-line system are provided. A test and burn-in apparatus for testing semiconductor devices allows various testing processes, including a burn-in process, to be performed at the same testing stage. The apparatus employs test trays which contain the semiconductor devices. These test trays are used throughout the in-line system so that an entire back-end process can be performed without the need for loading / unloading the semiconductor devices into and from device trays between the various tests. The test and burn-in apparatus according to this invention can therefore occupy less space than the prior art testing apparatuses. The in-line system includes multiple test and burn-in apparatuses as well as a single sorting unit which performs a composite sorting operation after all the testing processes have been performed. Furthermore, the method for testing the semiconductor devices in the in-line system includes testing the semiconductor devices in the test trays using the test and burn-in apparatus, generating a test tray map corresponding to results of the test, transferring the test trays to a different testing apparatus for a second testing and test tray map generation process, and finally sorting the semiconductor devices in the sorting unit after all testing processes have been performed based on a final sorting map created by combining the test tray maps of each of the tests. The benefits of this invention are reduced time and space requirements because neither transferring the devices to device trays between tests nor performing multiple sorting steps are required.
Owner:SAMSUNG ELECTRONICS CO LTD

Providing secure services to a non-secure application

A data processing apparatus comprising a data processor for processing data in a secure and a non-secure mode, said data processor processing data in said secure mode having access to secure data that is not accessible to said data processor processing data in said non-secure mode; and a further processing device for performing a task in response to a request from said data processor issued from said non-secure mode, said task comprising processing data at least some of which is secure data, said further processing device comprising a secure data store, said secure data store not being accessible to processes running on said data processor in non-secure mode; wherein prior to issuing any of said requests said data processor is adapted to perform a set up operation on said further data processing device, said set up operation being performed by said data processor operating in said secure mode and comprising storing secure data in said secure data store on said further processing device, said secure data being secure data required by said further processing device to perform said task; wherein in response to receipt of said request from said data processor operating in said non-secure mode said further data processing device performs said task using data stored in said secure data store to access any secure data required.
Owner:ARM LTD

Data communications system with splitterless operation

A data communication system that provides different types of service (e.g., telephone services and high-speed data transmission services) to a remote site even when the remote site lacks a splitter is disclosed. A central site (e.g., central office) is able to communicate with at least two different types of remote sites. One type of remote site includes a full splitter (i.e., both low-pass and high-pass filters), and the other type of remote site has only a partial splitter (i.e., includes high-pass filter but lacks a low-pass filter). Although conventionally the transceivers (e.g., ADSL transceivers) at these remote sites would be of the same design and use the same modulation technique for upstream as for downstream transmissions, here the remote site that lacks a low-pass filter (i.e., partial splitter type remote site) uses a different modulation technique for upstream transmissions. As an example, in a data communication system where a remote site lacks a complete splitter, a high peak-average-ratio (PAR) technique like discrete multi-tone (DMT) can be used with downstream transmissions that do not lead to noise at the telephone service even in the splitterless design, and a lower PAR technique (e.g., CPM, QAM, FSK, etc.) can be used with upstream transmissions so that the noise levels produced at the telephone service are vastly reduced. The central site is able to communicate with both the different types of remote sites. The central site selects from various receiver units depending on the type of modulation (e.g., low PAR technique) used.
Owner:TEXAS INSTR INC

Electrically-Conductive Laminated Film, Touch Panel Electrode Plate, Touch Panel, and Pressure-Sensitive Adhesive for Use in Electrically-Conductive Laminated Film

InactiveUS20080213583A1High solubility parameterLess to adhesive performanceConductive layers on insulating-supportsSynthetic resin layered productsSkin appearanceMeth-
An electrically-conductive laminated film of the invention comprises a first transparent substrate having first and second surfaces; an electrically-conductive film comprising a second transparent substrate having first and second surfaces and a transparent electrically-conductive thin layer provided on the first surface of the second transparent substrate; and a pressure-sensitive adhesive layer, wherein the first transparent substrate and the electrically-conductive film are arranged in such a manner that the second surface of the first transparent substrate is opposed to the second surface of the second transparent substrate, wherein the first transparent substrate and the electrically-conductive film are bonded to each other with the pressure-sensitive adhesive layer interposed therebetween; wherein each of the first and second transparent substrates is formed of a plastic material, wherein the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive comprising an acrylic polymer comprising 1 to 35% by weight of a methyl (meth)acrylate monomer unit, 60 to 98% by weight of an alkyl (meth)acrylate monomer unit having an alkyl group of 2 to 12 carbon atoms, and 0.1 to 10% by weight of a functional group-containing monomer unit. The electrically-conductive laminated film can suppress to become the pressure-sensitive adhesive layer a pear skin appearance.
Owner:NITTO DENKO CORP
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