37results about How to "Thermal stress" patented technology

A method of operating an inverter for converting a DC power into AC power by use of a pulse width modulation switching scheme is provided is disclosed. The inverter is controlled by use of the pulse width modulation switching scheme to provide an alternating current based on a current demand signal defining an alternating current provided by the inverter. An upper current threshold and a lower current threshold are provided. An instantaneous value of the alternating current is measured. When the instantaneous value of the alternating current overshoots the upper current threshold or undershoots the lower current threshold, the pulse width modulation switching scheme is replaced by an amended switching scheme which controls the instantaneous value of the alternating current to be between the upper current threshold and the lower current threshold. The upper current threshold and the lower current threshold oscillate with at least one alternating phase.

To provide a fine carbon fiber/metal composite material having high mechanical strength, a high thermal conductivity and a low coefficient of thermal expansion and suitable as a substrate for an electronic device. A fine carbon fiber/metal composite material, which is prepared by pressure impregnating a molded product containing fine carbon fibers having a fiber diameter of from 0.5 to 500 nm and a fiber length of at most 1,000 μm, having a multilayer structure wherein cylindrical carbon layers overlap one another, and having a hollow-structured central axis, with aluminum, magnesium, copper or an alloy of such a metal, by molten metal forging.

The present invention relates to a carbon electrode having a conical or pyramidal tip, wherein the tip is surrounded on its side by a raised edge.

An electrode is provided containing spherical voids which improve its gas diffusion properties and improving thermal stability of materials with different properties including the coefficient of thermal expansion. The electrode is especially useful as a component, i.e., cathode and/or anode, of solid oxide fuel cells.

A process of production of a semiconductor apparatus which can suppress a rise in the electrical resistance and a decline in the joint strength at the bump connection interfaces and improve the connection reliability when using the method of reinforcing the bases of the bumps by a resin film. Bumps are formed on a semiconductor wafer formed with a pattern circuit of a semiconductor chip so as to connect to the circuit pattern, a resin film is formed on the bump forming surface of the semiconductor wafer to a thickness giving a surface lower than the height of the bumps while sealing the spaces between the bumps, plasma cleaning etc., is used to remove the sealing resin components deposited on the surface portions of the bumps or natural oxides or other insulating impurities to clean and activate the surfaces of the bumps, and the chip is mounted on a mounting board.

A compressor casing for an exhaust gas turbocharger is disclosed. The exhaust gas turbocharger has a rotatable turboshaft, a compressor wheel mounted on the turboshaft, and a turbine wheel mounted on the turboshaft. The compressor casing includes a sensor for measuring a rotational speed of the turboshaft. The sensor is embedded in the compressor casing and forms an integral component of the compressor casing.

The invention relates to manufacturing equipment for non-mental crystals and aims at providing a reflection ring lifting device for improving the thermal field of a zone-melting single-crystal furnace. The reflection ring lifting device comprises a reflection ring and a window flange of a main furnace chamber; an outer side ring of the reflection ring is provided with a hollow cooling pipe; the two ends of the cooling pipe are connected to metal sealing joints on the window flange; the metal sealing joints are extended out of the outer wall of the window flange to be used as a cooling water inlet and outlet; the cooling pipe is fixed at one end of a support which is positioned on a vertical optical shaft; an engaged vertical lifting lead screw is also arranged on the support; and a transmission shaft is connected with the lifting lead screw through a bevel gear pair. The reflection ring lifting device has the advantages of realizing the lifting movement of the reflection ring in a hearth of the zone-melting furnace, being smooth and reliable in movement, being capable of realizing front and back adjustment, being convenient for aligning the reflection ring and a heating coil and being capable of forming a favorable thermal field in a melting zone, thereby increasing the quality of single crystals. By adjusting the position of the reflection ring, the reflection ring has thermal insulation effect on the single crystals, reduces the thermal stress inside the crystals and prevents detects such as flaws and the like from occurring in the single crystals due to undercooling.

An image sensor includes a package having a window; a sensor chip facing the window, the sensor chip having a pixel region, the sensor chip having an electrode; a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit having a read-out electrode connected to the electrode of the sensor chip; and a shielding plate disposed outside the pixel region of the sensor chip. The shielding plate is configured to block transmission of light.

According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.

The invention relates to a method for preparing a micro-radio-frequency T-shaped power divider on a metal base, and belongs to the technical field of micro-manufacturing. A gel column used for supporting an inner conductor is manufactured by utilizing SU-8 negative photoresist on a copper base by adopting a UV-LIGA technology, then a graphic glue film is manufactured by utilizing AZ50XT positive photoresist, and structures of a metal frame, the inner conductor, a top cover and the like are obtained through a copper electroforming technology. Finally, the AZ50XT glue film is dissolved by utilizing acetone, and the T-shaped power divider is obtained. According to the method for preparing the micro-radio-frequency T-shaped power divider on the metal base, a traditional silicon base is abandoned and the metal base is used, the problem that the silicon base is prone to being broken into pieces in the manufacturing process is solved, further, a metal conducting layer is not needed to be sputtered on the base, and the process steps are reduced. Meanwhile, when the AZ50XT glue film is removed, heating is not needed, and heat stress cannot be generated inside the structure, so that the probability of failure of manufacturing is reduced.

A method for assessing the conversion capacity of a catalytic converter for hydrocarbons when cold starting an internal combustion engine by means of an exhaust probe arranged behind the catalytic converter in the direction of flow, wherein an output signal from the exhaust probe is fed to a control unit.

The invention provides a preparation method of an integrated circuit packaging module. The preparation method comprises the following steps: preparing a PIC chip of which a light-induced active surface is coated with a first photoresist layer; cleaning the first photoresist layer, and coating a coating area of the first photoresist layer for multiple times to obtain a second photoresist layer with the thickness being the target thickness; interconnection between the PIC chip and at least one related chip in the multiple related chips and interconnection between the multiple related chips are completed, and a chip module is obtained; performing plastic packaging on the chip module to obtain a first plastic packaging layer, and grinding and thinning the first plastic packaging layer until the second photoresist layer is exposed; and cleaning the second photoresist layer to obtain a preset cavity for laying the optical fiber array waveguide device. The invention also provides an integrated circuit packaging module and a photoelectric processing module. A low-temperature packaging process is adopted, so that adverse effects on circuits such as transistors in the chip are avoided; the preset cavity with relatively high cleanliness can be obtained; and a photoinduced active surface with a complete structure can be obtained.