37results about How to "Thermal stress" patented technology

The invention provides a thermal insulation structure with an adjustable cold core for growth of sapphire single crystals by virtue of a kyropoulos method. A metal sheet made from tungsten or molybdenum is taken as a heat shield, wherein the heat shield comprises a horizontal type heat shield and a vertical type heat shield, and a gap between the shields is supported by adopting molybdenum bars at vertical intervals; a space between a stainless steel drum and the vertical type heat shield is divided into an inner layer filling region and an outer layer filling region by virtue of molybdenum plates and cylinders at intervals, the inner layer filling region is filled with zirconium oxide (ZrO2) hollow bubble shells, the outer layer filling region is divided into multiple vertical cubicle structures by adopting vertical molybdenum plates at intervals, and multiple cubicles form a symmetry structure taking the axis of a cylinder as the center; according to a cold core offset direction of an upper furnace, ZrO2 bubble shells are filled in the cubicles at one side of the offset direction or molybdenum slats with the same width of the cubicles are inserted in the cubicles, and a thermal insulation effect of the side of the offset direction is enhanced, so that the cold core moves toward the reverse direction of the offset direction, the effect that the cold core is arranged at a central position of a crucible is guaranteed, radial uniform distribution of a thermal filed in a furnace is improved, and the effects of seeding conveniently, reducing thermal stress inside crystals and preventing the crystals from adhering onto a boiler can be achieved.

The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

A package unit to be mounted on an external printed board includes a package board mounted with an exoergic circuit element, a heat spreader that transmits heat from the exoergic circuit element to a heat sink that radiates the heat, a joining member that seals between the exoergic circuit element and the heat spreader, and forms a sealing space in cooperation with the exoergic circuit element and the heat spreader, and a liquid metal sealed in the sealing space.